Third Annual IEEE Build-Up Substrate Symposium

[]
(We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.)
The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO).
As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures.
BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics.
SEMI World Headquarters, Milpitas, California, United States