Failure Analysis of Engineering Materials for Advanced Electronic Packaging

Abstract In high-volume manufacturing, failures in advanced electronic packaging are an unavoidable reality. Consequently, effective failure analysis is vital for enhancing product quality, reliability, and safety. This multidisciplinary task requires the integration of fundamental material science with technological expertise in manufacturing processes and product operation. As packages incorporate increasingly diverse materials and complex geometries, the interactions between components become more intricate. To address this, a systematic, data-driven approach is essential for identifying root causes. This lecture outlines strategies for postulating and verifying failures by linking material properties and characterization techniques to specific failure modes. The session concludes by addressing the industry's most pressing technical challenges.
Outline
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Foundations of Failure Analysis: Global perspectives, packaging challenges, and the "Octagonal Relationship" of engineering materials.
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Mechanisms of Failure: Exploring electrical, thermal, mechanical, chemical, and optical properties in advanced packaging.
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Strategic Problem Solving: Implementing the 3C Technique (Create, Challenge, and Confirm) to navigate modern analysis hurdles.
Co-sponsored by: Benson Chan
Speaker(s): KY Cheong,
Agenda:
See LOCATION tab for WebEx info
Room: Symposium Hall, Bldg: Center of Excellence Building, Binghamton University, 85 Murray Hill Road, Vestal, New York, United States, 13850, Virtual: https://events.vtools.ieee.org/m/557425