Ninth Annual Symposium on Heterogeneous Integration Roadmap and Annual Meeting

Vision for Heterogeneous Integration from Global Perspectives, 2 days, keynote talks, working groups …
(https://eps.ieee.org/technology/heterogeneous-integration-roadmap/annual-hir-symposium/)
1: Registration is $145 ($125 for IEEE members, and discounts for students). PayPal is the credit card payments processor; please do not use your Paypal account during the payment process here.
This fee is only to cover the food and beverage service costs at the event.
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3: STUDENTS: Current or recent graduate students please contact academic liaison Luu Nguyen luun296@gmail.com or Hualiang Shi hualiang.shi@ieee.org with research interest and using institution domain email for registration information.
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Speaker(s): , , ,
Agenda:
Agenda updates (https://eps.ieee.org/technology/heterogeneous-integration-roadmap/2026-hir-annual-symposium.html)
Time 19-Feb
February 19th Presenter Affilation
8:30 – 8:45 Introduction: Bill Chen ASE Fellow & Senior Technical Advisor at ASE Group
8:45 – 9:15 Ajit Manocha President and CEO SEMI
9:15 – 9:45 Hai Ah Nam HPC Technology Department Head,
Lawrence Berkeley National Laboratory
9:45 – 10:00 Break
10:00 – 10:30 Ritesh Jain SVP of Engineering and Operations, Lightmatter
10:30 – 11:00 Jean-Philippe (J.P.) Fricker CEO and CoFounder, Cerebras
11:00 – 11:30 Dereje Agonafer The University of Texas at Arlington
11:30 – 12:00 Devan Iyer Global Electronics Association
12:00 – 1:15 Lunch
1:15 – 5:30 TWG Member Activities: TWG to TWG discussions and Session on Roadmap Attributes
5:30 – 6:30 Wine Tasting/Social Hour
February 20th Presenter Affilation
8:00 – 12:15 TWG Member Activities: TWG to TWG discussions and Volunteer Management discussion
12:15 – 1:15 Lunch
1:15 – 1:45 PM Sheng Xu Professor, Stanford University
1:45 – 2:15 PM Doug Hackler President and CEO American Semiconductor
GOLD SPONSORS
SEMI INTERNATIONAL HEADQUARTERS, 673 S MILPITAS BLVD, MILPITAS, California, United States, 95035