AI is Accelerating the Shift to Advanced Packaging with PLP and Glass Cores

The semiconductor sector continues to expand rapidly, supported by growing needs in AI, automotive electronics, and consumer devices. As the limits of traditional scaling become increasingly evident with both physically and economically, advanced packaging is taking center stage as a critical driver of higher performance, tighter integration, and further miniaturization. In this context, next-generation packaging platforms such as panel-level packaging (PLP) and glass core substrates are emerging as key technologies shaping the industry's future direction.
PLP is gaining industry interest for its potential to reduce manufacturing costs and support ultra-large form-factor package. Nevertheless, its adoption introduces several materials and process challenges, including warpage management, thermal robustness, and process compatibility. To overcome the warpage issue, alternative material like glass core substrate is being explored for its exceptional dimensional stability and favourable electrical characteristics. Despite core cores advantages, the use of glass raises practical concerns in handling, via creation, and integration within existing assembly infrastructures.
This presentation will delve into these evolving technology pathways, examining market motivations, supply-chain considerations, and the broader ecosystem shifts surrounding them. It will outline both the opportunities these solutions present and the technical barriers that must be overcome as advanced packaging moves into its next phase of development.
Co-sponsored by: Benson Chan
Speaker(s): YY Tan,
Agenda:
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Virtual: https://events.vtools.ieee.org/m/541765