IEEE/EPS Hybrid Bonding Symposium

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NOTE: On-site registration is fully booked; we have reached the limits of our facility. Please join us on-line.
Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.
Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design. We expect registrations for our on-site program to be filled by the middle of January; we apologize if you are not able to attend in person, but we encourage you to join us via WebEx.
SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/495346