Performance requirements for today’s semiconductor and optoelectronic devices are leading to shrinking geometries, more complex 3-dimensional structures, and new materials. High temperatures, hot spots and temperature spikes can have a major impact on reliability. It is essential that one have a thorough understanding of static and dynamic thermal performance under operating and static conditions. This has traditionally been complex, time consuming, and often lacked the resolution required to detect thermal anomalies that could lead to early device failures. Fortunately, advances in thermal imaging techniques that combine the benefits of thermoreflectance-based analysis with illumination wavelengths from near-ultraviolet to near infrared coupled with infrared thermography can support thermal, spatial, and transient resolution consistent with today’s advanced complex device structures and shrinking geometries. In addition, equipment has advanced to considerably reduce the time and cost to get accurate results. Many examples will be shared to fully illustrate the device thermal behaviors that can be detected with these advanced thermal analysis techniques. Speaker(s): John H Lau, SEMI World Hdqtrs, 673 S Milpitas Blvd, Milpitas, California, United States, 950335, Virtual: https://events.vtools.ieee.org/m/336549

The emerging field of behavior change design is revolutionizing the way we think and feel about ourselves, our peers, our customers, our products and our lives, in general. When combined in an interdisciplinary approach with recent psychological and spiritual understandings, a clear picture of how we miraculously manage to heal emerges. How can we bio-hack ourselves to choose and commit to the habits we want and let old habits go? This talk will focus on the process of gaining wisdom and living in greater social harmony, and how we, our companies and the technology that we develop can be a healing force. We’ll examine this fundamental question, first posed by Albert Einstein: “I think the most important question facing humanity is, ‘Is the Universe a friendly place?'” Simple and concrete examples will be given, as well as a few very simple equations to describe this emerging social science in a way that not just an EE who reads IEEE papers might find deeply intuitive. We’ll also talk about trauma and how to become “trauma-informed.” Speaker(s): Mark Moeglein, Virtual: https://events.vtools.ieee.org/m/349959

Learn what it takes to develop and deploy high-reliability, space-qualified, 20 GHz, 10 Watt High-Gain GaN IC Amplifier Modules from Industry Veteran and Distinguished Maxar Engineer Jim Sowers. Co-sponsored by: Electron Devices Society–Santa Clara Valley/San Francisco Chapter Speaker(s): Jim Sowers, Room: 4201, Bldg: SCDI 4201, Santa Clara University Frugal Innovation Lab, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/350415

Title: How Ignition and Target Gain > 1 was achieved in inertial fusion presented by Dr. Omar A. Hurricane, Distinguished Member of the Technical Staff Chief Scientist for the Inertial Confinement Fusion Program, Design Physics (DP) Division of Lawrence Livermore National Laboratory Speaker(s): Dr Omar Hurricane, Agenda: Abstract: For many decades the running joke in fusion research has been that `fusion’ is twenty years away and always will be. Yet, this year we find ourselves in a position where we can talk about the milestones of burning plasmas, fusion ignition, and target energy gain greater than unity in the past tense – a situation that is remarkable! In this talk, we tell the story of the applied physics challenges that needed to be overcome to achieve these milestones and the strategy our team followed. To help understand the story, several key physics principles of inertial fusion will be presented, and I will try and dispel any confusion about what the terms burning, ignition, and gain mean in the context of inertial fusion research. About the speaker: Omar Hurricane is Chief Scientist for the inertial confinement fusion program at Lawrence Livermore National Laboratory, a position he’s held since 2014. Omar completed his PhD in Physics at UCLA in 1994 where he remained as a postdoc doing plasma theory until 1998. In 2009, Omar was awarded the Department of Energy E.O. Lawrence Award for National Security and Nonproliferation for solving a long-standing nuclear weapons anomaly. More recently, Omar has been recognized for his contributions to inertial confinement fusion with Fellowship in the American Physical Society (APS), the 2021 Edward Teller Award of the American Nuclear Society, and the 2022 John Dawson Award from Excellence in Plasma Physics of the APS for achieving the first laboratory burning plasma. Virtual: https://events.vtools.ieee.org/m/350188

The Electron Devices Society Santa Clara Valley/San Francisco Chapter with the San Jose State University IEEE student chapter is hosting a mini-colloquium celebrating the 75th anniversary of the invention of the transistor. In this mini-colloquium, we are inviting 3 speakers to each give talks on topics ranging from traditional/planar transistors and advanced transistors to analog technology. When: Friday, March 24, 2023 – 12 Noon to 2 pm (PST) Where: This is a hybrid event so speakers and attendees can choose to participate either in person at SJSU Engineering building or online via Zoom. Registration Link: (http://bit.ly/3SSTPhf) Contact: hiuyung.wong at ieee.org Speaker(s): Prof. Tsu-Jae King Liu, Prof. Debbie G. Senesky Agenda: Title: Sustaining the AI Revolution: Transistor Scaling and Beyond Speaker: Prof. Tsu-Jae King Liu Abstract: Advancements in semiconductor integrated circuit (IC) “chip” technology over the past 60+ years have enabled exponential growth in chip functionality with exponential reduction in cost per transistor, resulting in the proliferation of information and communication devices and systems, with revolutionary impact on society; today cloud computing, big data and artificial intelligence are driving the digital transformation of all industries. In this talk I will discuss three dimensions of IC technology advancement – transistor scaling, new computing architectures and new computing paradigms – to usher in the Age of Ambient Intelligence. Speaker Bio: Tsu-Jae King Liu earned her B.S., M.S. and Ph.D. degrees in electrical engineering at Stanford University in 1984, 1986 and 1994, respectively. From 1992 to 1996, she was member of research staff at the Xerox Palo Alto Research Center (PARC). In 1996, she joined the faculty of the Department of Electrical Engineering and Computer Sciences (EECS) at the University of California, Berkeley, where she is now Dean of the College of Engineering. Liu is internationally known in academia and industry for her innovations in semiconductor devices and technology, and is highly regarded for her achievements as an instructor, mentor and administrator. She is a fellow of the Institute of Electrical and Electronics Engineers (IEEE), an elected member of the U.S. National Academy of Engineering, a fellow of the U.S. National Academy of Inventors, and Director of Intel Corporation and of Maxlinear, Inc. Her awards and honors include the Intel Outstanding Researcher in Nanotechnology Award, the IEEE Aldert van der Ziel Award for distinguished educational and research contributions to the field of electronic devices and materials, the IEEE Electron Devices Society Education Award, and the Defense Advanced Research Projects Agency (DARPA) Significant Technical Achievement Award for her role in the development of the FinFET, an advanced transistor design used in all high-end computer chips today. =x=x=x= Title: Semiconductors in Extreme Environments Speaker: Prof. Debbie G. Senesky Abstract: Wide bandgap semiconductor materials such as silicon carbide (SiC), gallium nitride (GaN) and, diamond are well known for their inherent resilience to high-temperature and radiation-rich environments. This makes them attractive electronic platforms for use in space exploration and other extreme-environment applications (e.g., combustion, downhole, hypersonic aircraft). Gallium nitride (GaN) electronics have operated at temperatures as high as 1000°C making it a viable platform for robust space-grade (“tiny-but-tough”) electronics and nano-satellites. Even with this major technological breakthrough, there are still challenges in making GaN in low-cost formats with low defect density for proliferation in “beyond silicon” applications. New communities are adopting this electronic platform for a multitude of emerging device applications including the following: sensing, energy harvesting, actuation, and communication. In this talk, we will review and discuss the benefits of GaN’s two-dimensional electron gas (2DEG) over silicon’s p-n junction for space exploration applications (e.g., radiation-hardened, temperature-tolerant Venus probes). In addition, we will discuss the use of prolonged microgravity environments on the International Space Station (ISS) and commercial stations for future manufacturing of semiconductors for the benefit of life on Earth. Speaker Bio: Debbie G. Senesky is an Associate Professor at Stanford University in the Aeronautics and Astronautics Department and by courtesy, the Electrical Engineering Department. In addition, she is the Principal Investigator of the EXtreme Environment Microsystems Laboratory (XLab). Her research interests include the extreme-environment sensors, high-temperature electronics for Venus exploration, and nanomaterials synthesis within prolonged microgravity. She received the B.S. degree (2001) in mechanical engineering from the University of Southern California. She received the M.S. degree (2004) and Ph.D. degree (2007) in mechanical engineering from the University of California, Berkeley. She is currently serves as the Site Director for nano@stanford, as well as co-editor for the IEEE Journal of Microelectromechanical Systems (JMEMS) and Sensors (journal). In recognition of her work, she is a recipient of the Emerging Leader Abie Award from AnitaB.org, NASA Early Faculty Career Award, and Alfred P. Sloan Foundation Ph.D. Fellowship Award. More information about Prof. Senesky can be found at xlab.stanford.edu or on Instagram: @astrodebs. =x=x=x= Title: The Evolution of Analog Technology Speaker: Lou N Hutter Abstract: Despite the major advancements made in semiconductor technology, the world remains a very analog place. Consequently, analog and power management integrated circuits are ubiquitous in almost every electronic system built today. Analog technology has made significant strides in the past 50+ years, migrating from low-density bipolar-based technologies and SSI products to highly scaled CMOS-based nodes and LSI and VLSI products today. The wide diversity of analog applications has driven a wide diversity of process technologies. This talk will discuss the evolution of analog technology from the 1970s to today and beyond, highlighting the many design constraints that have led to the diverse technology portfolio and rich component sets used today. Speaker Bio: Lou is a veteran of the semiconductor industry. He spent 29 years at Texas Instruments Inc., until retiring in 2007, as Director of TI’s Mixed-Signal Technology Development organization where he was responsible for worldwide analog, power, RF SiGe, and mixed-signal technology development, process delivery kits, production ramps, and transfers that supported every business unit in the company. He was elected a TI Fellow in 1995 based on his technical accomplishments and their revenue impact. In 2008, he joined Dongbu HiTek, in Seoul, S. Korea, as Senior Executive Vice President and General Manager of the newly created Analog Foundry Business Unit, where he was responsible for technology development, design enablement, IP development, and sales and marketing. During his tenure there, he increased revenues 4X, added many and significant new customers, and established Dongbu HiTek as a leading analog/power management foundry in the industry. Since 2012, he has been Principal of Lou Hutter Consulting LLC, advising foundries, IDMs, fabless companies, and material suppliers in the areas of analog and power technology, design infrastructure, organizational management, and business development. Lou has 47 U.S. patents, has published over 35 journal articles, has co-authored 1 book entitled Silicon Analog Components, now in its 2nd edition, and other book chapters. He has an MSEE from the Massachusetts Institute of Technology, and resides in Dallas, Texas. Bldg: Engineering building, 1 Washington Sq, Charles W. Davidson College of Engineering, San Jose, California, United States, 95192, Virtual: https://events.vtools.ieee.org/m/351273

Fan-out Wafer and Panel Level Packaging are gaining relevance as high-volume-compatible advanced packaging technologies. Providing technical advantages and optimized cost for manifold applications, FOWLP and PLP are fundamentally changing the packaging infrastructure. In the past, OSATs dominated high-volume manufacturing, but recently new players in packaging such as semiconductor foundries, PCB or LCD manufacturing companies entered this business area and are changing not only supply chains but also form factors towards larger areas. However, materials are playing an important role especially for future applications such as RF, power or advanced computing applications. In addition, materials are also a key factor for cost and sustainability. In summary, the presentation will discuss recent technical developments as well as the changing ecosystem and actual advantages and challenges when moving to large-panel-level manufacturing. Speaker(s): Tanja Braun, Virtual: https://events.vtools.ieee.org/m/353528

Plastic production has outgrown most other manmade materials, with more than 99% of them being petroleum-based and nonbiodegradable. Conventional plastics are difficult to recycle and persist in the environment for hundreds of years, causing great environmental concerns. In addition, the dependence on crude oil makes the plastics industry unsustainable and renders the plastics market vulnerable to oil price volatility. Therefore, there is a growing interest in developing sustainable alternatives to conventional plastics. Particularly, the electronics industry is making a switch to greener alternatives to reduce greenhouse gas emissions, lower product environmental footprints, and build positive marketing image. Here, we present a perspective on the advancement of bioplastic sustainable alternatives and the challenges and advantages associated with their potential use in electronics. Speaker(s): Yael Vodovotz, Virtual: https://events.vtools.ieee.org/m/353539

Wesley Lau from Interface Engineering will be presenting Microgrid Strategies and Typologies. He will cover when a microgrid is required, different operating modes and strategies for peak shaving, redundancy, and carbon reduction, and typologies for serving portions of a building, entire buildings, or entire campuses. Speaker(s): Wesley Lau, Virtual: https://events.vtools.ieee.org/m/352233

Abstract: A review of piezoelectric BAW filter technology will be presented focusing on the resonator technology comprising the filters. The presentation will discuss the modeling of frequency and bandwidth selection, spurious resonance suppression, and harmonic emissions. Resonator stored energy, Q factor, temperature coefficient, and power characterization will be discussed as well as the scaling of BAW filters to low and high frequencies. BAW filter technology will also be compared to other filtering technologies. Speaker(s): Dr. David A. Feld, Agenda: 6:30 – 7:00 PM Registration & Networking 7:00 – 7:45 PM Invited Talk 7:45 – 8:00 PM Questions & Answers Skyworks Inc., 2740 Zanker Road, San Jose, California, United States, 95134, Virtual: https://events.vtools.ieee.org/m/353395

Bimonthly meeting for the Silicon Valley, San Francisco and Oakland/East Bay Chapter of the IEEE Robotics and Automation Society. This meeting is for everyone interested in being involved in the chapter, organizing events, coordinating with other robotics speaker series and conferences or contributing news and events for RAS members' benefit. This is a great meeting to attend IF: You want to know what's happening in robotics in the Bay Area, OR, you want to reinvigorate the local RAS community (largest in the world!) We'll be planning for our events or events we're participating in: The Robot Block Party at Circuit Launch on April 8, The Future of Robotics at The Commonwealth Club in May, the inaugural IEEE Conference on AI in June and the IEEE Industry Hub's Autonomous Vehicle event in autumn, as well as planning for more debates and technical symposiums. Agenda: Chapter Reports: President Treasurer Partnerships: tbd Event Planning: (https://robot-block-party.eventbrite.com) at Circuit Launch Oakland on April 8th The Future of Robotics at The Commonwealth Club in San Francisco on May tbc (https://cai.ieee.org/2023/) in Santa Clara on June 5-6 IEEE Industry Hub Autonomous Vehicle Symposium in Q3 tbc Virtual: https://events.vtools.ieee.org/m/352241