Understanding other perspectives and finding common ground is a key leadership skill. It is correct to say that your perspective is your reality. Yet, when you validate other perspectives of a situation or problem, the closer to reality you get. The value of using this skill is listening to people who may have a different point of view than you and discovering potential blind spots or new things to consider that will contribute to your understanding of the situation and help in your decision making. A leader’s ability to navigate diverse viewpoints to consensus builds trust and engagement, increases ownership, and grows project or solution commitment. What could be different in your personal leadership style if you could better navigate diverse perceptions and find common ground? Speaker(s): Gwen Wagner, Virtual: https://events.vtools.ieee.org/m/359393

Learn about Portable Radar systems at the human-microwave frontier including Life Activity Sensing and Human Tracking Speaker(s): Changzhi Li Virtual: https://events.vtools.ieee.org/m/359657

Glass, with its manifold compositional tweaking, offers the widest possible range of attributes and properties relevant to carrier performance in wafer thinning as well as in advanced packaging. In this presentation, we will first focus on the topic of wafer ultra-thinning of semiconducting as well as piezo materials. We will demonstrate that the desire for thinner substrates can be realized with 1) carriers that exhibit extremely low total thickness variation (TTV), and 2) an associated temporary bonding method that presents extremely low thickness variation as well. The combination of Corning’s recently announced ultra-low TTV carriers with near-zero TTV bonding methods has proven to be a powerful tool to guarantee high precision thinning of various wafer types. On the topic of carrier properties, the coefficient of thermal expansion (CTE) plays a major role in the control of in-process warpage in buildup structures such as fan-out wafer level packaging and multi-layer laminates. We will present several use cases when specifically-tuned CTE is advantageous to reduce stress within a given process environment. Corning’s Advanced Packaging Carrier (APC) product family offers glass wafers with CTE that varies from 4.9-12.6 ppm/C with fine granularity of 0.2 ppm/C, in addition to silicon-matched glasses with a CTE of 3.4 and other glass types that go all the way down to 0 ppm/C. This portfolio enables the right choice of glass for each and every application to optimize processability. Speaker(s): Julia Brueckner, Virtual: https://events.vtools.ieee.org/m/353525

Road transportation, which accounts for 22 percent of greenhouse gas emissions, is undergoing a major transformation with the advent of ridesharing, autonomous driving, and vehicle electrification. Collectively these technologies, in conjunction with renewable sources of electricity, have the potential to dramatically reduce the negative impact of road transportation on the health of the planet. The successful convergence of these technologies will require electric vehicles that are low cost and fully autonomous. These attributes can be realized through dynamic wireless charging. However, this will require wireless charging technology that is well beyond current capabilities and opens new areas of research related to power and transportation infrastructure. Using examples from research on capacitive wireless charging (as opposed to the more common inductive techniques), which leverage very high frequency power electronics, this talk will highlight the opportunities and challenges in dynamic wireless charging of electric vehicles. Speaker(s): Dr Khurram Afridi 440 N Wolfe Rd, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/356408

The Electron Devices Society Santa Clara Valley/San Francisco joint Chapter is hosting an EDS Distinguished Lecturer Dr. Adam Skorek. The titled of the lecture is ‘Artificial Intelligence and Brain Biofields Quantum Computing. When: Friday, May 19, 2023 – 12 Noon to 1 pm (PDT) Where: This is an online event and attendees can participate via Zoom. Registration Link: (https://bit.ly/3KY0mUa) Contact: hiuyung.wong at ieee.org Speaker: Prof. Adam Skorek (EDS Distinguished Lecturer) Abstract: Artificial intelligence (AI) is present in electrical, electronics, and computer engineering for years. In particular, the biofields defined as electromagnetics and thermal fields in living matter are naturally related to AI studies and applications, including brain analysis with numerical modeling and simulations. Brain functionalities inspire all developments in AI from theoretical investigations to machine learning, humanoids robots, Digital Twins (DT), and brains interface devices implementation. The brain biofields’ interactions with external excitations such as 5G/6G telecommunications devices, transcranial magnetic stimulation, and even other brains biofields are currently explored more than ever before. The computation demand in modeling and simulation is still growing and it is particularly high in both AI and brain biofields applications. Hopefully, the High-Performance Computing (HPC) and High-Performance Quantum Computing (HPQC) infrastructures become more easily accessible and offer researchers some new opportunities based on the open and shared resources including not only computing facilities with quantum units but also knowledge with currently observed openings in the field of intellectual property issues. A presentation from a worldwide perspective of some modern research works with their results applications is completed by the lecturer’s experiences and guidelines for the future. Some practical examples and instructions for researchers, engineers, and students are presented, stimulating the audience to various scientific as well R&D activities in those so promising areas. Speaker Bio: Prof. Adam Waldemar Skorek (M’87, SM’90, F’09, LF’23) completed Bachelor and Master of Electrical Engineering Program at Białystok University of Technology (Poland) receiving both Master and Engineer degrees in 1980. Participant of the Electrical Engineering Faculty Doctoral Studies, he received a Doctor of Technical Sciences degree in Electrical Engineering at Warsaw University of Technology (Poland) in 1983. From 1983 to 1987 he was a Visiting Lecturer at the Institute of Telecommunications in Oran (Algeria). In 1987, he joined the University of Quebec at Trois-Rivières (UQTR), Canada, where currently, he is a Full Professor and Director of the UQTR’s Electro-Thermal Management Laboratory which succeeded both the Nano-Heat Laboratory and Industrial Electro-Heat Laboratory, all founded and directed by himself since 1989. He is conducting electrical engineering courses for bachelor, master, and Ph.D. students. His research works were granted by NSERC, CFI, FRQNT, MITACS, and Industry. He was made contributions to the numerical analysis of electro-thermal and biofields phenomena exploring and applying various techniques to electrical apparatus, electronic devices, and living organisms. His publications and communications record include works on High-Performance Computing, Artificial Intelligence, Digital Twins (DT) and Quantum Computing applications, in electro-thermal and biofields analysis. A number of those publications are available in IEEE Xplore. The IEEE Life Fellow, as well as Fellow of the Engineering Institute of Canada, Prof. Adam W. Skorek is a Member of the Engineering Academy in Poland and recipient of the 2021 IEEE Industry Applications Society Distinguished Service Award. Speaker(s): Prof. Adam Skorek Agenda: The Electron Devices Society Santa Clara Valley/San Francisco joint Chapter is hosting an EDS Distinguished Lecturer Dr. Adam Skorek. The titled of the lecture is ‘Artificial Intelligence and Brain Biofields Quantum Computing. When: Friday, May 19, 2023 – 12 Noon to 1 pm (PDT) Where: This is an online event and attendees can participate via Zoom. Registration Link: (https://bit.ly/3KY0mUa) Contact: hiuyung.wong at ieee.org Speaker: Prof. Adam Skorek (EDS Distinguished Lecturer) Abstract: Artificial intelligence (AI) is present in electrical, electronics, and computer engineering for years. In particular, the biofields defined as electromagnetics and thermal fields in living matter are naturally related to AI studies and applications, including brain analysis with numerical modeling and simulations. Brain functionalities inspire all developments in AI from theoretical investigations to machine learning, humanoids robots, Digital Twins (DT), and brains interface devices implementation. The brain biofields’ interactions with external excitations such as 5G/6G telecommunications devices, transcranial magnetic stimulation, and even other brains biofields are currently explored more than ever before. The computation demand in modeling and simulation is still growing and it is particularly high in both AI and brain biofields applications. Hopefully, the High-Performance Computing (HPC) and High-Performance Quantum Computing (HPQC) infrastructures become more easily accessible and offer researchers some new opportunities based on the open and shared resources including not only computing facilities with quantum units but also knowledge with currently observed openings in the field of intellectual property issues. A presentation from a worldwide perspective of some modern research works with their results applications is completed by the lecturer’s experiences and guidelines for the future. Some practical examples and instructions for researchers, engineers, and students are presented, stimulating the audience to various scientific as well R&D activities in those so promising areas. Speaker Bio: Prof. Adam Waldemar Skorek (M’87, SM’90, F’09, LF’23) completed Bachelor and Master of Electrical Engineering Program at Białystok University of Technology (Poland) receiving both Master and Engineer degrees in 1980. Participant of the Electrical Engineering Faculty Doctoral Studies, he received a Doctor of Technical Sciences degree in Electrical Engineering at Warsaw University of Technology (Poland) in 1983. From 1983 to 1987 he was a Visiting Lecturer at the Institute of Telecommunications in Oran (Algeria). In 1987, he joined the University of Quebec at Trois-Rivières (UQTR), Canada, where currently, he is a Full Professor and Director of the UQTR’s Electro-Thermal Management Laboratory which succeeded both the Nano-Heat Laboratory and Industrial Electro-Heat Laboratory, all founded and directed by himself since 1989. He is conducting electrical engineering courses for bachelor, master, and Ph.D. students. His research works were granted by NSERC, CFI, FRQNT, MITACS, and Industry. He was made contributions to the numerical analysis of electro-thermal and biofields phenomena exploring and applying various techniques to electrical apparatus, electronic devices, and living organisms. His publications and communications record include works on High-Performance Computing, Artificial Intelligence, Digital Twins (DT) and Quantum Computing applications, in electro-thermal and biofields analysis. A number of those publications are available in IEEE Xplore. The IEEE Life Fellow, as well as Fellow of the Engineering Institute of Canada, Prof. Adam W. Skorek is a Member of the Engineering Academy in Poland and recipient of the 2021 IEEE Industry Applications Society Distinguished Service Award. Virtual: https://events.vtools.ieee.org/m/359050

Power converters designed for higher frequency operation than conventional designs can be smaller and lighter. However, to gain these benefits and maintain high reliability the converters also need to be more efficient, as smaller converters offer less surface area for heat removal. The development of efficient, small and light weight power converters can benefit from converter architectures that leverage novel topologies and control techniques. Using examples from my group’s research on compact and high-efficiency power converters, this talk will highlight the opportunities and challenges at the frontiers of high-frequency power electronics. One focus of the talk will be on new power electronic converter architectures that target high power densities and high efficiencies for wide operating range applications. Another focus of the talk will be on emerging power electronic enabled applications, including wireless power transfer systems suitable for powering in-motion mobile platforms and radio-frequency power amplifiers for compact particle accelerators. The talk will also identify directions for future work in the area of high performance power electronic converters Speaker(s): Khurram Afridi, Room: Silicon Valley Conference Room, Bldg: Plug and Play Tech Center, 440 North Wolfe Road, Sunnyvale, California, United States, 94085