AI/ML is an all-pervasive technology that has the potential to transform our lives. It has use cases from Internet of Things (IoT) to edge devices to automotive to cloud. This presentation discusses how AI is disrupting traditional embedded edge market including surveillance, robotics, industrial automation, aerospace and defense applications. We will cover market requirements, customer use cases and key challenges. In addition, we will also discuss how next generation of purpose-built products are addressing the needs of this market. Speaker(s): Gopal Hegde, Virtual: https://events.vtools.ieee.org/m/362147

Massive demands are being placed on computing due to skyrocketing increases in data consumption. Penetration of AI and ML into more and more fields requires real-time fast processing at the edge as well as fast data transfer to datacenters for analysis. 5G and 6G technologies demand ever increasing frequency for wireless communications. Autonomous driving and other harsh environments demand high reliability. The semiconductor industry needs to continuously deliver better performance from a smaller footprint with higher frequency response, higher reliability, lower power consumption, and all with a lower barrier for entry than advances at the transistor level. How are these rigorous market demands influencing innovations in chip manufacturing and advanced interconnect such as hybrid bonding? This presentation will give a brief introduction of the hybrid bonding technology, how it enables disaggregation and heterogeneous integration and helps increase efficiency and performance while shrinking footprint, and how it enables high reliability. Speaker(s): Guilian Gao, SEMI World Hdqtrs, 673 S Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/360650

Free Registration: https://www.eventbrite.com/e/a-vision-of-intelligent-train-control-tickets-641698887647 Synopsis: The progressive adoption of Artificial Intelligence (AI) and advanced communication technologies within railway control and automation gave rise to a huge potential in terms of optimization, learning and adaptation, due to the so-called “self-x” capabilities. However, it has also raised several dependability concerns due to the lack of measurable trust that is needed for certification purposes. In this talk, a vision will be provided about future train control that builds upon existing automatic train operation, protection, and supervision paradigms. The basic concepts for autonomous driving in digital railways will be provided, and feasibility will be addressed in terms of challenges and opportunities, including explainability, autonomic computing, and digital twins. Due to the clear architectural distinction, traditional train protection (ATP) can act as a safety envelope for intelligent operation to optimize energy, comfort, and capacity, while intelligent protection based on signal recognition and obstacle detection can improve safety through advanced driving assistance. Speaker(s): Prof. Francesco Flammini , Vishnu S. Pendyala Virtual: https://events.vtools.ieee.org/m/362162

The need for an efficient power management solution has never been more critical across virtually all electronic devices and systems from low power to high power, smartphones to data centers, battery-powered components to renewable-energy-powered grids, and from stationary systems to aircraft. Particularly for ultra-low power systems such as untethered sensors and IoT systems, the key challenge is to maintain high delivery efficiency while satisfying increasingly demanding input/output requirements, space constraints, reliability, and cost, simultaneously. Aiming to address this grand and increasingly difficult challenge, the speaker will present multiple approaches centered around physical, architectural, and functional integration of advanced power management units with the systems that allow them to efficiently and essentially disappear/merge with the environment. Design examples and results from the iPower3Es group at UCSD and state-of-the-arts will also be covered as demonstration. Speaker(s): Hanh-Phuc Le, Room: Grand Ballroom F, Bldg: Santa Clara Convention Center, 5001 Great America Parkway, Santa Clara, California, United States, 95054

Join Kurt Petersen (Guest Speaker) and Roger Grace (Moderator) on a Fireside Chat at Sensors Converge in Santa Clara (CA) on Wednesday, June 21, from 7 to 8pm (PT). Kurt Petersen (a.k.a. the Father of MEMS) is an American Inventor and Enterpreneour. Dr. Petersen received his BS degree cum laude in EE from UC Berkeley in 1970. In 1975, he received a PhD in EE from the Massachusetts Institute of Technology. Dr. Petersen established a micromachining research group at IBM from 1975 to 1982, during which he wrote the review paper “Silicon as a Mechanical Material,” published in the IEEE Proceedings (May 1982). This paper is still the most frequently referenced work in the field of micromachining and micro-electro-mechanical systems (MEMS). Since 1982, Dr. Petersen has co-founded six successful companies in MEMS technology, Transensory Devices Inc. in 1982, NovaSensor in 1985 (acquired by GE), Cepheid in 1996 (was a public company on NASDAQ: CPHD; acquired by Danaher in 2016), SiTime in 2004 (acquired by MegaChips in 2014, IPO in 2019), Profusa in 2008 (still private), and Verreon in 2008 (acquired by Qualcomm in 2010). In 2011, Dr. Petersen joined the Silicon Valley Band of Angels. The Band is an angel investment group which mentors and invests in early stage, high-tech, start-up companies. Today, he spends most of his time helping and mentoring such companies. Dr. Petersen has published over 100 papers, and has been granted over 35 patents in the field of MEMS. In 2001 he was awarded the prestigious IEEE Simon Ramo Medal for his contributions to MEMS. Dr. Petersen is a member of the National Academy of Engineering and is a Life Fellow of the IEEE in recognition of his contributions to “the commercialization of MEMS technology”. In 2019, he was awarded the IEEE's highest honor, the IEEE Medal of Honor. Roger H. Grace is president of Roger Grace Associates, a Bonita Springs, Florida-based marketing consultancy he founded in 1982 that provides market research, strategic marketing communications and business development services to the MEMS, sensors and capital equipment industry. He can be reached via email at rgrace@rgrace.com. His background includes over 40 years in high frequency analog circuit design engineering, application engineering, project management, product marketing and technology consulting. He was a founding member of MANCEF and currently is its VP of the Americas. Specializing in microelectromechanical systems (MEMS) and sensors for over 40 years, he is considered a pioneer in this field. He has authored over 40 technical feature articles, organized, chaired, and spoken at over 30 international technical sessions and is frequently quoted as an industry expert in major international technical and business publications. He is a recipient of the Outstanding Engineering Alumni of the Year in 2004 by Northeastern University and was bestowed the inaugural Sensor Industry Impact Award by Sensors Magazine in 2016. Mr. Grace held the position of visiting lecturer at the University of California at Berkeley from 1990 to 2003. His educational background includes a B.S.E.E. and M.S.E.E. (as a Raytheon Company fellow) from Northeastern University, and the MBA program at Haas Graduate School of Business at U.C. Berkeley. Agenda: 6:30 – 7:00 PM Networking 7:00 – 8:00 PM Fireside Chat Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, California, United States, 95054

Seminar Title: Miniaturized Power Management that Disappears and Merges with the Environment and Systems Abstract: The need for an efficient power management solution has never been more critical across virtually all electronic devices and systems from low power to high power, smartphones to data centers, battery-powered components to renewable-energy-powered grids, and from stationary systems to aircraft. Particularly for ultra-low power systems such as untethered sensors and IoT systems, the key challenge is to maintain high delivery efficiency while satisfying increasingly demanding input/output requirements, space constraints, reliability, and cost, simultaneously. Aiming to address this grand and increasingly difficult challenge, the speaker will present multiple approaches centered around physical, architectural, and functional integration of advanced power management units with the systems that allow them to efficiently and essentially disappear/merge with the environment. Design examples and results from the iPower3Es group at UCSD and state-of-the-arts will also be covered as demonstration. About the speaker: Dr. Hanh-Phuc Le is an Assistant Professor of ECE at the University of California San Diego and a co-Director of the Power Management Integration Center, an NSF IUCRC center. He received the Ph.D. degree from UC Berkeley (2013), M.S. from KAIST, Korea (2006), and B.S. from Hanoi University of Science and Technology in Vietnam (2003), all in Electrical Engineering. In 2012, he co-founded and served as the CTO at Lion Semiconductor until October 2015. The company was acquired by Cirrus Logic in 2021. He was with the University of Colorado Boulder from 2016 to 2019, before joining the ECE department at UC San Diego. He held R&D and consulting positions at Oracle, Intel, Rambus, JDA Tech in Korea and the Vietnam Academy of Science and Technology (VAST) in Vietnam. His current research interests include miniaturized/on-die power conversions, large conversion ratios, smart power delivery and control for high performance IT systems, data centers, telecommunication, robots, automotive, mobile, wearable, and IoT applications. Dr. Le received a 2021 NSF CAREER Award, a 2012-2013 IEEE Solid-State Circuits Society Pre-doctoral Achievement Award, and UC Berkeley's 2013 Sevin Rosen Funds Award for Innovation. He authored three book chapters, over fifty journal and conference papers with one best paper award in various topics in the area of integrated power electronics. He is an inventor with 22 U.S. patents (11 granted and 11 pending). He serves as an associate editor of the IEEE Journal of Emerging and Selected Topics in Power Electronics (JESTPE), TPC Chair/co-chair for the International Workshop on Power Supply On Chip (PwrSoC 2018, 2020), Chair of the Power Management and Outreach Subcommittees at the IEEE Custom Integrated Circuits Conference (2020, 2021), Vice Chair of the Energy Conversion Congress and Exposition (ECCE) in 2021-2023, and Chair of the IEEE Power Electronics Society Technical Committee on Power Components, Integration, and Power ICs (IEEE PELS TC2) in 2019-2023. Dr. Le is an IEEE Senior Member. About Sensors Converge 2023: Discover the future at the only event where the building blocks of IoT converge - sensors, processing, and connectivity. Join the sensors and electronics community this June 20-22 at the ONLY event covering the biggest design engineering trends. From enabling innovation, to process design & control development, to transforming markets, Sensors Converge (https://www.sensorsconverge.com/) covers technologies and applications that can help you design smarter systems/IoT devices in a sustainable economy. Santa Clara , California, United States

Cameras have become key sensors in many products, e.g., cellphones, automotive, and AR/VR. Though cameras were traditionally invented to mimic human perception, the recent development of artificial intelligence (AI) enabled cameras in an increasing number of computer vision applications (e.g., gesture control, object detection), which also brings additional challenges in camera development and packaging. This talk will first provide a brief introduction to the camera system, including both camera module hardware and the image processing pipeline, and then discuss how different applications affect camera development and packaging. Speaker(s): Zack Lai, SEMI World Hdqtrs, 673 S Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/361749

At a time when computing is so much a part of all of our lives, has incredible job opportunities, and is so empowering, most students graduate high school without having had any introduction to computer science. A decade ago in the United States, the CSforALL movement was launched to broaden participation in computing to those traditionally underrepresented. This talk will reflect on the current state of that initiative, and introduce the "Beauty and Joy of Computing (BJC)" course, which has received worldwide attention and currently has 65% female enrollment at UC Berkeley, among the highest in the nation. Speaker(s): , Dan Garcia Virtual: https://events.vtools.ieee.org/m/360195

WBG semiconductors (i.e. SiC and GaN) outperform silicon in terms of breakdown field (10X in the case of SiC) and thermal conductivity (2X in the case of SiC), hence, ensuring smaller conduction losses and better heat dissipation combined with faster switching frequency. All this results in saving energy (i.e. smaller battery) and costs (i.e. smaller passive components and volume of the power module). However, to take fully advantage of WBG semiconductors it is of paramount importance to: (i) develop new packaging technologies, (ii) optimize the packaging design in terms of thermo-electric and electromagnetic (i.e. stray inductance and mutual coupling) behavior to ensure clean and fast switching of the MOSFETs and avoid oscillations. This talk will start from basic concepts of power module design by taking a half-bridge topology as reference and will show some of the tools and methodologies that are currently used for the optimization. Moreover, the talk will briefly describe some of the new advanced technologies (embedding, chip scale packaging, sintering) for the packaging of GaN and SiC power modules. Speaker(s): Dr. Giovanni Salvatore, Virtual: https://events.vtools.ieee.org/m/361989