POSTPONED - look for this lecture to be rescheduled for after June 30, 2024 Hall-Of Fame Lecture Series of the Silicon Valley Engineering Council (https://www.svec-ca.org/) Using AI in the development of vaccines and technologies for aging Is aging another disease that can be ultimately cured? Can lifespan be extended and are centenarians different? Additionally how can artificial intelligence create robotic and software assistants as we get older and is living forever is possible in any form ? Topics will include: age-related diseases, artificial intelligence for longevity, and innovations to improve the quality of life as we age. Speaker: Ronjon Nag, PhD Adjunct Professor in Genetics, Stanford School of Medicine Fellow, Stanford Center for the Study of Language and Information President, R42 Group SVEC Hall-Of-Fame Inductee-2024 Registration & Cost Free - No Charge registration Co-sponsored by: Silicon Valley Engineering Council Milpitas Tech Center, 691 So. Milpitas Blvd., Milpitas, California, United States, 95035

Thomas Ferrin of UCSF will describe 3D imaging of the Corona virus. He will be bringing virtual reality imaging equipment for demonstration and for use by the audience. Interactive computer graphics has been used for more than 60 years to visualize and analyze 3-D molecular structures such as DNA and proteins, and has contributed to the development of many drugs and, more recently, vaccines that are in common use today. Today, VR headsets enable structural biologists to immerse themselves within these molecules in order to gain a better understanding of how they function. This talk will recount the evolution of interactive molecular graphics from the early days of calligraphic CRT displays to the current use of VR headsets such as the one shown here. The video shows structures from the following article where more details can be found. "(https://journals.plos.org/plospathogens/article?id=10.1371%2Fjournal.ppat.1007236)" Agenda: Presentation and lunch included with the registration fee. Depending on the number of registrants the meal will be either a buffet or individual orders from the menu. Virtual reality headset will be available for demonstration. Bldg: golf course restaurant, Beeb's Sports Bar and Grill, 915 Clubhouse Drive , Livermore, California, United States, 94551

Abstract The miniaturization led advances in silicon-based micro/nanoelectronics on planar and stiff substrates, have revolutionized nearly every socio-economic sector through fast computing and communication. However, miniaturization alone is insufficient as several emerging applications (e.g., robotics, interactive systems, wearables, flexible displays etc.) require electronics with features such as flexible form factors, and seamlessly integrated on soft substrates. The environmental impact of inherently wasteful fabrication steps in conventional micro/nanofabrication is also a growing concern. As a result, new resource-efficient methods are being explored to fabricate electronic devices and circuits on unconventional flexible and stretchable substrates. This talk will present recent advances in this direction, particularly focussing on hybrid or heterogenous integration of the off-the-shelf devices, ultra-thin chips, and high-mobility semiconducting nanostructures-based printed electronics. The talk will also cover innovative resource efficient methods such as transfer printing, contact printing and direct-roll printing etc. that are expected to transform the way electronics will be manufactured in future. Speaker(s): Prof. Ravinder Dahiya, Agenda: 6:30 – 6:45 PM Registration & Networking 6:45 - 6:50 PM Chapter Announcements 6:50 - 7:10 PM 2023 MEMS Report Card 7:10 – 7:50 PM Invited Talk 7:50 – 8:00 PM Questions & Answers Virtual: https://events.vtools.ieee.org/m/422413

[] Transforming the company with AI enables us to design new kinds of business models and new sources of competitive advantage. But that would also require us to reorganize the company. We have to transform its operations, its organizational structures, processes, even its culture. And that means that the key people who have to lead this transformation are specifically the managers. It’s not the technologists, it’s not the programmers or even the engineers. Can the workforce learn AI skills quickly enough to keep pace with innovation? Andrew Ng, Landing AI founder and CEO, discusses the effect AI will have on the labor force and which companies are positioning themselves the best in the AI market. We will watch a couple of video and discuss how we think and feel about the message. Join us to discuss the impact of AI on the labor force and on the role of managers. Speaker(s): Carl Angotti, Virtual: https://events.vtools.ieee.org/m/422503

Mobile sensors are often used in health to track and monitor health, ranging from daily activities to diagnosing life-threatening conditions; however, they are underutilized for substance use and its disorders. Our work is focused on developing digital biomarkers from the physiological data captured from wearable devices for addiction. Specifically, we build models that combine the multimodal sensor data from wearable devices to detect drug administration, predict drug-induced mental states such as drug craving and euphoria. We further show that integrating drug pharmacokinetics into these data-driven models enhances the accuracy of drug monitoring, thereby increasing the generalizability and trust. A consistent pattern observed among these models was bias based on drug-usage history; therefore, we develop a model that screens users and distinguishes opioid misusers from prescription users, which would allow for more accurate prescription of opioids, minimizing the risk of addiction. Co-sponsored by: Media Partner: Open Research Institute (ORI) Speaker(s): Bhanu T. Gullapalli, Agenda: - Invited talk from (https://www.linkedin.com/in/bhanu-teja-gullapalli/), PhD Candidate at the University of California San Diego. - Q/A Session Virtual: https://events.vtools.ieee.org/m/422258

[]Join us for an insightful session on the latest advancements in blockchain technology, featuring two distinguished speakers. Professor Daswin De Silva will delve into "Blockchain and AI for Industrial Applications," exploring the synergistic potential of blockchain and AI to drive industrial innovation. Associate Professor Yuhong Liu will present on "Facilitating Security and Trust among Multiple Parties through Blockchain Techniques," discussing the adoption of multi-signature schemes in blockchain to enhance security and efficiency. Speaker(s): Daswin, Yuhong Agenda: 6:00 PM: Door opens, Pizza, snacks and networking 6:30 PM: Welcome and Introduction 6:40 PM: Session by Prof. Daswin De Silva - "Blockchain and AI for Industrial Applications" 7:20 PM : Q&A Session with Professor Daswin 7:30 PM: Short Break 7:40 PM: Session by Assoc. Prof. Yuhong Liu - "Facilitating Security and Trust among Multiple Parties through Blockchain Techniques" 8:20 PM: Q&A Session with Prof. Yuhong 8:30 PM: Closing Remarks ActionSpot, 453 W San Carlos St , San Jose, California, United States, 95110, Virtual: https://events.vtools.ieee.org/m/422199

This event will be available live at SEMI, as well as over Zoom. Get to SEMI by 6:30pm to network – and enjoy great pizza and refreshments! All attendees MUST register using the Eventbrite form (see link). Netflix’s journey in enhancing its machine learning capabilities led to the creation of Axion, a revolutionary fact store that is designed to optimize the quality and accessibility of data for machine learning algorithms. This talk will delve into the evolution of Axion, highlighting its critical role in advancing Netflix’s recommendation systems. It will also explore the challenges faced in managing and utilizing large-scale data, and how Axion’s innovative architecture addresses these challenges. You will gain insights into the technical intricacies of Axion, including its four main components: (1) the fact-logging client, (2) ETL (extract, transform, load), (3) the query client, and (4) the data quality infrastructure. You will learn about the unique approaches employed by Axion for data logging, transformation, and querying that ensure efficient and reliable data access for its sophisticated machine learning architecture. Speaker(s): Tejas Chopra, 567 Yosemite Dr, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/414925

Quantum Dots for micro-LEDs: Direct nanoparticle lithography for next-gen energy efficient displays [] Abstract: NanoPattern Technologies is developing inorganic nanoparticle photoresists to enable the next generation of energy efficient electronics and displays. Using our photosensitive ligand technology, we have developed formulations to directly coat and pattern inorganic materials such as InP, CdSe, TiO2, and ZrO2 with no added vacuum or high temperature annealing steps. Because the nanoparticles are not diluted in a polymer matrix, our inorganic photoresists achieve close to 70% volume loading and retain properties close to the pure, fully dense material. As a result, properties like high optical absorption or high refractive index can be achieved while avoiding the multiple costly fabrication steps of vacuum deposition processes. We will describe a focused application on the advantages of our InP quantum dot color converter photoresists to enable next generation energy efficient displays. [] Bio: Dr. Danielle Chamberlin, CTO at NanoPattern Technologies, is an expert in optics and optoelectronics ranging from THz to the UV. Danielle has deep knowledge in the fields of LEDs and nanotechnology, having led down-converter R&D at Lumileds from 2009-2019. She holds over 15 patents on topics ranging from biosensors to microLEDs. Danielle holds a PhD and MS in Materials Science from UC Berkeley and an S.B. Degree in Materials Science from MIT. Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road, EAG Labs, 810 Kifer Road, Sunnyvale, California, California, United States, 95051

[]In the field of silicon photonics, advanced packaging integration is key to achieving product performance. Flip chip attach of Silicon Photonics devices poses new challenges and limitations not encountered for flip chip attach and underfill of mainstream silicon devices. The first challenge in 2.5D silicon photonics die integration is its susceptibility to cracking during downstream reflow processing. The second challenge is to keep the edge-coupling waveguide facet of the silicon photonics die uncontaminated after all MCM assembly processes, for optical coupling. The third challenge is the post-reflow flip chip standoff variation and the underfill coverage under the silicon photonics die that affect optical coupling sensitivity between the edge-coupling waveguide and the planar lightwave circuit (PLC). We have successfully demonstrated flip chip attach of silicon photonics optical light engine (OLE) on an organic substrate using both thermocompression bonding and mass reflow processes with custom tooling to achieve defect-free and uniform standoff bonding of Pb-free flip chip bumps. Various underfill control methods were explored to achieve maximum coverage and avoid underfill creeping onto the waveguide facet. Furthermore, we achieved stable optical coupling post-stress testing. More investigation would be necessary to further improve coupling efficiency stability. Speaker(s): Pushkraj Tumne, Virtual: https://events.vtools.ieee.org/m/421351

[] Abstract: Cities worldwide are transitioning quickly towards a low-carbon environment, high quality of living, and resource-efficient economy. Artificial Intelligence of Things (IoT) is a combination of Artificial intelligence (AI) and the Internet of Things (IoT) to enable autonomous decision-making, data analytics, and system optimization. This talk will share our experiences on AIoT for smart cities. The first work is called Green IoT, which provides artificial intelligence and open data for sustainable city development. In this work, we developed an intelligent IoT system for air pollution monitoring in Uppsala, Sweden. The second work, called Smart Water Auditing, uses IoT and machine learning to provide insights into how much water is consumed in different domestic use categories. It aims to reduce water consumption and raise awareness of people's water consumption habits. This talk will present our AIoT system designs, machine learning algorithms, implementation, and experimental results in Hong Kong and Sweden. Bio: Dr. Edith C.H. Ngai is an Associate Professor in the Department of Electrical and Electronic Engineering at the University of Hong Kong. Before joining HKU in 2020, she was an Associate Professor in the Department of Information Technology at Uppsala University, Sweden. Her research interests include IoT, edge intelligence, smart cities, and smart health. Her co-authored papers received a Best Paper Award in QShine 2023 and Best Paper Runner-Up Awards in ACM/IEEE IPSN 2013 and IEEE IWQoS 2010. She was an Area Editor of IEEE Internet of Things Journal from 2020 to 2022. She is an Associate Editor in IEEE Transactions of Mobile Computing and IEEE Transactions of Industrial Informatics. She has been a TPC co-chair in IEEE SmartCity 2015, IEEE GreenCom 2022, and IEEE/ACM IWQoS 2024. She was a project leader of the "Green IoT" in Sweden, which was named on IVA's 100 List by the Royal Swedish Academy of Engineering Sciences in 2020. She received a Meta Policy Research Award in Asia Pacific in 2022. She is a Distinguished Lecturer in the IEEE Communication Society from 2023 to 2024. HKU IoT Lab: https://www.eee.hku.hk/~iotlab/ At the time of the event, go to https://simnet.zoom.us/j/91698723639?pwd=M05JeHAzUWlYRmVXTDdheEhzamQyUT09 Or on the Zoom app Meeting ID: 91698723639 Meeting Passcode: 848898 Co-sponsored by: Pradeep Kumar Virtual: https://events.vtools.ieee.org/m/417512

[] Title: Advancing Network Sustainability - Challenges and Solution Approaches Reducing humankind’s carbon footprint and greenhouse gas emissions to slow climate change is one of humanity’s Grand Challenges. Communication networks play a key role in addressing that challenge, enabling applications that reduce the need for physical travel as well as solutions that optimize efficiency of resource and energy usage. Examples range from teleworking to remote operations, from smarter agriculture to more energy-efficient factory floors. However, for all their benefits, networks also have a significant environmental footprint themselves that collectively rivals that of entire countries. It is thus becoming important to make networks themselves "greener" and devise solutions that allow networks to be operated in ways that make them more sustainable while continuing to meet increasing traffic demands and service requirements. Many of today’s network sustainability improvements relate to general advances in energy efficiency of computing hardware as well as in transmission technology (antennas, lasers). While this is where arguably the biggest opportunities lie, the question arises regarding the role that other layers in the networking stack can play in advancing network sustainability. For example, can data planes be designed in ways that make them inherently more energy-efficient? What protocol advances might enable greener networking solutions? How can networks be optimized not just for QoS or utilization but for carbon and what novel tools are needed to operate networks more sustainably? How can we even properly account for energy usage and other sustainability parameters to be optimized? In which ways can network programmability, faster control loops, and AI- or intent-based networking help? This presentation will provide a brief introduction into network sustainability and discuss some of the key challenges that solutions need to address. A number of solution approaches will be presented and opportunities for further research and engagement on this topic pointed out. The presentation will draw on some of the activities that are currently taking place in the IETF and the Internet Architecture Board's E-Impact program. Bio: Dr. Alexander Clemm is a recognized expert in network management technology and networking software in which he has been involved throughout his career. His most recent activities have been in the areas of sustainable networking, future networking services, intent-based networking, service assurance, and telemetry. After 7+ years as a Distinguished Engineer at Futurewei and prior to that 18 years at Cisco, he recently decided to pursue an academic sabbatical and embark on new adventures. Alex has for many years been regularly serving on the committees of IEEE conferences, including NOMS/IM and NetSoft as a member of the steering committee and on several occasions as general co-chair or TPC co-chair. He is the recipient of the 2020 Salah Aidarous Award given by IEEE CNOM and IFIP TC6.6 to "an individual who has provided unremitting service and dedication to the IT and Telecommunications Network Operations and Management community." Alex has an extensive publication record including 70+ papers, 70+ patents, and 15 RFCs. He holds an M.S. degree from Stanford University and a Ph.D. from the University of Munich, Germany, both in Computer Science. Virtual: https://events.vtools.ieee.org/m/423149

[]Bonding technology is the key to the success of vertical stacking in 3D integration, heterogeneous integration, and advanced packaging applications. Furthermore, developing a bonding technology which can be performed at low temperature becomes significant to avoid the concerns of low thermal budget, low mechanical stress, and high reliability in many applications. Among various bonding technologies, bumpless Cu-based hybrid bonding has become the main solution to the requirement of high speed and density since Cu has its excellent electrical performances, thermal properties, and readiness in the backend and packaging fabrication, as well as cost consideration. This talk will describe the history and advances of current Cu-Cu bonding, including technology development and solutions of low temperature Cu-Cu bonding. A wetting/passivation technique for room temperature Cu bonding and its mechanism will be presented. Next, hybrid bonding, an enabling technology for fine pitch/size bonding in multiple 3D integration and advanced packaging applications, will be mentioned with its history development. Current Status, challenges and their solutions, such as fine pitch, warpage, and mechanical and thermal stress, to reach hybrid bonding will be discussed. Finally, applications and recently developed platforms based on hybrid bonding with be introduced. Speaker(s): Kuan-Neng Chen, Virtual: https://events.vtools.ieee.org/m/423122

Come socialize with fellow IEEE members at the beautiful SF Presidio Tunnel Tops! Our IEEE SF PES Chapter is hosting this summer BBQ to bring together members, your family and/or friends. IEEE SF PES will provide the food. Enjoy the sun and toss a frisbee or football and enjoy the amazing Golden Gate Bridge views! Picnic tables are limited to 56 people, so please provide your group count when you register. We look forward to seeing everyone! Please be advised that the parking lot adjacent to Picnic Place is extremely limited. There are several parking lots in the Main Post area of the Presidio within a short walking distance. Use the address 122 Anza Ave, SF CA 94129 to get to the large parking lot across the street from the Presidio Tunnel Tops. There is also parking near 220 Halleck Street at the intersection of Halleck St and French Ct. Please note that most parking lots in the Presidio charge an hourly fee, which is paid at the kiosk in the lot. Picnic Place is easily accessible via public transit! If you are coming via the free Presidio Shuttle, exit the Shuttle at the Presidio Transit Center. Agenda: 11am - 3pm Welcome to the FUN all IEEE members, families & friends! Noon to 2pm BBQ Lunch (Please provide # attendees for food planning) Presidio Tunnel Tops, 210 Lincoln Blvd, San Francisco, California, United States, 94129