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This event will feature two insightful talks that together provide both a broad overview of the rapidly evolving public blockchain landscape and a hands-on roadmap for developers building the platforms of tomorrow. The first talk, Emerging Trends in the Public Blockchain Ecosystem will examine the latest developments shaping open networks such as stablecoins, NFTs, DAOs, Decentralized Physical Infrastructure (DePIN), Real-World Assets (RWAs), and AI-driven interactions. Attendees will gain an understanding of the broader economic and technological forces guiding public blockchain innovation. Following this, Blockchain Developer Roadmap – 2025 will shift the focus to practical career growth and skill-building for developers. This talk will outline key technologies, programming languages, interoperability solutions, and best practices in security and compliance, offering a clear path to successfully navigating the complex environment of next-generation blockchain development. Together, these sessions provide a comprehensive perspective on where the public blockchain ecosystem is headed and how developers can best prepare to build meaningful, secure, and innovative applications that will drive the industry forward. Co-sponsored by: FreeCodingSchool.org Speaker(s): Dr Ramesh Ramadoss, Revanth R Airre Agenda: 9:00 – 09:05 AM: Welcome Address & Introduction 9:05 – 9:35 AM: Talk 1 – "Emerging Trends in the Public Blockchain Ecosystem" By Ramesh 9:35 – 9:40 AM: Audience Q&A Session with Ramesh 9:40 – 10:10 AM: Talk 2 – Blockchain Developer Roadmap – 2025 by Revanth 10:10 – 10:15 AM: Audience Q&A Session with Revanth 10:15 AM – 10:30 AM: Closing Remarks & Future Events Preview 10:30 PM: Event Concludes Virtual: https://events.vtools.ieee.org/m/453000
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Dear Parents and Guardians, Do you dream of giving your child the tools to succeed in an ever-changing world? Are you looking for ways to spark their curiosity and open doors to exciting opportunities? We invite you and your family to join us for an inspiring STEM (Science, Technology, Engineering, and Math) educational experience designed specifically for students from underrepresented communities. --------------------------------------------------------------- Event Details Where: Glad Tidings Family Life Complex When: Dec 30, 10am to 1:30pm. Who: Students aged 8–17 (parents encouraged to attend) - What’s Included: Hands-on STEM lessons and interactive activities. --------------------------------------------------------------- Why STEM Education Matters for Your Child STEM education is more than just learning about technology or engineering—it’s about developing critical thinking, creativity, and problem-solving skills that are essential in today’s world. By exposing your child to STEM: - Help them discover new interests and talents. - Prepare them for high-paying and rewarding careers. - Show them that they can be creators, innovators, and leaders. --------------------------------------------------------------- Featured Activities - Bridge Design Challenge Your child will explore structural engineering by designing and building their own bridge model. Guided by experts, they’ll learn how engineers solve real-world problems and even test the strength of their designs. - Electronics Assembly/ LED Light-Up Snowman Children will dive into the exciting world of electronics by assembly circuits. This activity introduces them to concepts like automation, and mechanics, in a fun and engaging way. Celebrate the season with STEM! Your child will create their own LED light-up snowman, learning basic electronics, circuits, and creativity. They’ll wire a simple LED circuit to bring their snowman to life, sparking joy and innovation all at once. --------------------------------------------------------------- Our Program’s Commitment Through our partnership with the IEEE Oakland-East Bay Section, TryEngineering, and Glad Tidings, we are dedicated to fostering a supportive and inclusive environment. Here’s why this program is unique: Mentors Who Care: STEM professionals from your community will guide your child every step of the way. - Hands-On Learning: Engaging activities like designing bridges, building robots, and creating LED circuits make learning exciting. Equity in Education: Our goal is to provide access and opportunity to all children, particularly those in underrepresented communities. --------------------------------------------------------------- Parent Involvement We understand the vital role parents play in their child’s success. During the event, you’ll: - See firsthand how STEM activities boost confidence and teamwork. - Learn about free and affordable resources to continue your child’s STEM journey. - Meet other parents who share the same goal of empowering their children. --------------------------------------------------------------- Don’t Miss Out! This is a chance to show your child that their dreams matter and that they belong in STEM fields. Secure your spot today! RSVP by DEC. 23rd To ensure we have the proper supplies and resources, please RSVP by end of day DEC 23rd, so we can better plan the workshop. Together, let’s inspire a generation of problem solvers, innovators, and dreamers. We look forward to seeing you there! Warm regards, Aaron Lin IEEE Benita McLarin Glad Tidings Co-sponsored by: Glad Tidings International Agenda: 10:00AM Check-in 10:30AM Bridge Design Challenge 11:30AM Lunch 12:30PM Electronics Assembly/ LED Light-Up Snowman 1:30PM End Glad Tidings Family Life Complex, 27709 Tyrrell Avenue, Hayward, California, United States, 94544
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[] Free Registration (with a Zoom account; you can get one for free if you don't already have it): https://sjsu.zoom.us/meeting/register/tZcsc-CoqjwpG9aPDHfg6Axqvn90i4uQRmqr Synopsis: For a long time, the AI/ML community relied on traditional evaluation metrics such as the confusion matrix, accuracy, precision, and recall for assessing the performance of machine learning models. However, the rapidly evolving field has been raising several ethical concerns, which calls for a more comprehensive evaluation scheme. In easy-to-understand language, this talk will delve into the quantitative analysis of model performance, emphasizing the critical importance of explainability. As ML models become increasingly complex and pervasive, understanding their decision-making processes is paramount. We'll explore various performance metrics, their limitations, and the growing need for transparency. Topics covered include Cohen’s Kappa Statistic, Matthew's correlation coefficient (MCC), Confusion Matrix, Precision, Recall, G-measure, ROC Curve, Youden's J statistic, Type II Adversarial attack, R-squared, LIME, SHAP, and more. Speaker(s): Dr. Vishnu S. Pendyala Virtual: https://events.vtools.ieee.org/m/442073 |
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Artificial Intelligence approaches could be transformative toward identifying strategies for preservation of good health with advancing age. AI researchers can exploit computationally intense algorithms to assist humans in making sense of large, complex data sets with patterns that may not be detected using parametric statistical methods. An overarching question now in the aging field is whether AI, machine learning (ML), and deep learning (DL) approaches would be useful tools for identifying the genetic basis of exceptional health and life span. With this background, Dr. Ronjon Nag will discuss the following areas during this presentation: - Can AI make you live longer with better, smart diets? - Can AI help you exercise better? - Can AI detect cancerous cells and destroy them? - Can you upload your brain to a machine and live forever? Speaker(s): Ronjon Nag, Room: 225, Bldg: Heafey, Santa Clara University, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/452858 |
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This is a hybrid in-person and online event. Pre-registration is required for either. As the world’s largest technical professional organization, IEEE has been actively developing initiatives that support ethics in AI, a broader semiconductor supply chain, mitigating climate change, and ensuring sustainability. IEEE’s efforts include initiatives in its Standards Association (SA), Future Directions Committee (FDC), Technical Societies (TS), Educational Activities Board (EAB), and Members and Geographic Activities (MGA). In this talk, Dr. Tom Coughlin will discuss his work as 2024 IEEE President, and how these IEEE activities have included work on the Ethical Design of Intelligent and Autonomous Systems, Global CHIPS Act activities, sustainability efforts such as e-Liability for certifiable determination of the carbon content in a supply chain, and the 2883-2022 standard for data sanitization. Further, he will discuss how climate change efforts have included the recent formation of a Matrix organization in IEEE to address this issue. Attendees will learn how they can find out more about these efforts, as well as how to get involved. Speaker(s): Tom Coughlin, 673 South Milpitas Blvd., Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/450081 |
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ABSTRACT This presentation will provide a description of III-V semiconductors and their use in commercial communication satellites. The focus will be on Geo-synchronous (GEO) type satellites, but the discussion will be relevant to Middle-Earth-Orbit (MEO) and Low-Earth-Orbit (LEO) satellite products. To this end a comparison of reliability requirements for these orbital types will be given showing their differences. The focus on GEO will allow the presentation to talk about the more stringent requirements for qualification of these devices which encompasses the other product types. Additionally, this presentation will compare these material types against others to justify their usage for these products and provide insight into where Si type devices may be useful. The need for high performance, high reliability RF electronics (typically referred to as “the payload”) in Commercial Communications Satellites comes from both the products environment and it’s mission. The environment for GEO satellites is 36,000km from the earth’s surface encompassed in a distant, harsh radiation and thermal background. The mission is for high performance communications systems that can last for many years. For these applications, it is required to supply radiation hardened electronics while also providing the demanding performance required to meet the payload’s mission. To this end the use of III-V semiconductor technologies has enabled many of these missions. This presentation will provide an understanding of what are commercial communications satellites and their payload architectures. This will provide insight into their need for III-V RF active semiconductors. A brief history of communication satellites will be given to allow an understanding of how the commercial and non-commercial (military/government) products are related, and what are the possible trends. Additionally a review and comparison of the various device types against other semiconductor materials like silicon will be discussed. Subsequently a look at some present requirements will be given to show the state of this technology in this application, a description of the qualification process for these devices will be given to show how the performance is guaranteed over the lifetime in space, and a view of the future usage for this technology will be presented. [] Speaker(s): Jim Sowers, Room: RM 4021, Bldg: SCDI, Sobrato Campus for Discovery and Innovation, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/453332
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Date and Time: Wednesday, January 15, 2024. Networking and Pizza for those interested starting at 6pm. First tour starts at 6:30 pm. Second tour starts at 7pm. Location: The tour is being held in an applications laboratory in Cupertino, just off DeAnza Boulevard, and south of Stevens Creek Blvd. The exact address and information on parking will be sent to all registered tour participants. This tour is limited to the first 30 participants to register. Please cancel at least 48 hours before the event if your plans change. Note: Registration required – no unregistered walk ins will be allowed on the tour!! Presenters / Tour Guides: Dwight Evard, Business Development Manager, Edmund Optics Nitin Sampat, Vision System Engineer, Edmund Optics Matt Hori, Field Application Engineer for Allied Vision, Jim Clark, Senior Manager Applications Engineering, Cognex Corporation Abstract: Tours are some of our most popular Photonic Society events. In a first for the IEEE Photonics Society, we are offering a “triple header” applications lab tour, including an optics lab, and two machine vision labs. Tour of Edmund Optics: - On the tour of the EO-SV Solution Center people will see: - Solutions targeting specific customer applications, e.g. finding defects in semiconductor devices, microscopy, detecting water in well plates - Solutions requiring different parts of the spectrum, e.g. UV, VIS, VIS-NIR, SWIR - Lighting options to optimize the solution, e.g. DoAll light with six options to easily select the best lighting - System to measure image quality - Videos showing the manufacture of imaging lens assemblies and aspheres Tour of TKH / Allied Vision: TKH Vision overview (1D, 2D, 3D hardware and software) · Cameras and sensors for various applications (UV to Extended SWIR) · Camera interfaces and application examples (embedded to industrial machine vision) · Case studies · Demo—EO's lab will host a few Allied Vision and SVS-Vistek demos. I can add a couple to this office as well. Tour of Cognex: (No detailed information available at this time – the tour is expected to include an overview of Cognex’s machine vision inspection systems) Information on the participating companies: Edmund Optics: Edmund Optics worldwide has been a leading global optical solutions provider that has served a variety of markets, including Life Sciences, Biomedical, Industrial Inspection, Semiconductor, R&D and Defense since 1942. The company employs 1250+ employees across 18 global lcoations and continues to expand, with 8 manufacturing locations. Edmund Optics – Silicon Valley Solutions Center is a local portal to the global world of Edmund Optics. We have workstations where engineers can evaluate solutions with complimentary consultation with vision experts. The loaner library of a wide variety of lenses, lights, cameras, filters, accessories and test targets allows engineers to test solutions at their facilities. TKH / Allied Vision: TKH Group is a global technology company developing machine vision, manufacturing, and connectivity systems. TKH Vision is a group segment comprised of eight brands focusing on 1D, 2D, and 3D vision technology. · Allied Vision - Cupertino offers consultation and support for 2D vision projects, primarily focusing on Allied Vision and SVS-Vistek brands. · TKH Vision - Cupertino is a new solution and experience center that offers consultation and support for all brands. The grand opening is on November 14th, 2024, and is located 5 minutes away from the Allied Vision Cupertino office. Cognex Corporation: Cognex is a machine vision company offering automated inspection imaging systems. Cupertino, California, United States |
3 events,
[]Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas. Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design. SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/436711 [] Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas. Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design. Please download the full (https://attend.ieee.org/hbs/wp-content/uploads/sites/692/hbs-advprgmC.pdf). SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/455304
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Electrical power distribution relies on the connection of a series of several different types of distribution equipment from the power source to the load. At its core there are almost always low voltage switchboards and switchgear. Though the terms “Switchgear” and “Switchboard” are often used interchangeably and informally to describe a wide variety of electrical distribution equipment, they have precisely different specifications and testing standards; even the NEC includes a different definition of each. Whether selecting electrical equipment for a simple commercial project, a data center, or a hospital, understanding the differences are important as the selection significantly affects reliability, safety, maintenance, size, cost, working space clearances, and more. This presentation will discuss the key differences between switchboards and switchgear for the application, design, and selection by consultants, contractors, and end-users. It will also cover the different types of circuit breakers used in switchboards and switchgear (e.g. molded case, insulated case, and power circuit breakers). Included will be photos of the internal construction and components to illustrate differences, as they are significant. This will help get beyond the single line diagrams and specifications for those who have not had opportunities to visit job sites or manufacturing plants. In addition, since designers are increasingly working on projects with photovoltaic (PV) inverter sources, questions arise on inverter connections and configurations for switchboards. This presentation will touch on NEC compliance, bus sizing, breaker position, customer needs (future and current), and manufacturer requirements. Agenda: No-host social at 5:30pm Presentation at 6:00pm Dinner at 7:00pm Presentation continues at 7:45pm Adjourn by 8:30pm Zio Fraedo's, 611 Gregory Lane, Pleasant Hill, California, United States, 94523 |
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Chiplet Summit is the annual conference and trade show where the entire chiplet ecosystem meets! Technology leaders across all disciplines share solutions that advance chiplet design. Industry leaders set the direction to achieve interoperability in the growing chiplet marketplace. Experts showcase breakthroughs in AI, servers, domain-specific accelerators, automotive, telecom, IoT, and emerging applications. IEEE-CNSV officers and members, and local IEEE officers, will be in Booth #217 on the Exhibition Floor. Note that advance registration for the Exhibition Floor is free. See link at (https://californiaconsultants.org/event/chiplet-summit/) Agenda: Tuesday, 21 January - 8:30am-Noon & 1-5pm: Pre-Conference Tutorials - 5-6pm: Chiplets – The Key to Solving the AI Energy Gap (Panel Discussion) - 6-8:30pm: Chat with the Experts (Beer+Pizza Roundtable) Wednesday, 22 January - 9am-12:30pm: Keynotes - 12:30-8pm: Exhibits (CNSV in Booth 217) - 2:30-3:30 & 4-6pm: Technical sessions Thursday, 23 January - 9-10am: Technical sessions - 10am-Noon: Keynotes & SNIA Presentation - Noon-2pm: Exhibits (CNSV in Booth 217) - 2-3:30pm: Technical sessions - 3:30-5pm: Closing panel discussion Santa Clara Convention Center , 5001 Great America Pkwy, Santa Clara, California, United States, 95054 |
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“AI Trends and Trials” “Know nothing about AI?”, or “Know lots about AI!”, or “Somewhere in between?” Then you are the perfect person to join our LMAG group members and guests for lunch, lots of informal information sharing, and "hands-on" sessions where we explore some of the AI applications, how to use them, and how to avoid misusing them. If you’ve been interested in this new world of AI, then this will be a great opportunity to learn, enjoy some camaraderie, and have some fun! We’ll have a brief overview of the state of AI, have some mobile phones and laptops ready for us to demo and challenge various generative AI Apps like OpenAI’s ChatGPT and Anthropic’s Claude, and Microsoft Copilot. Bring your favorite and share your experience and expertise. Hosted by the IEEE OEB-LMAG Executive Board. Agenda: Meeting and lunch. Buffet or order from menu depending on upon the number of registrants. Subsidized fee for OEB Life Members is $15, for IEEE non-members the fee is $25. Bldg: Golf course restaurant, Beeb's Sports Bar and Grill, 915 Clubhouse Drive, Livermore, California, United States |
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DesignCon is the premier high-speed communications and system design conference and exposition, now in its 30th year, with a (https://dcon25.mapyourshow.com/8_0/explore/session-gallery.cfm) with more than 180 educational sessions covering all aspects of chip, board, and systems design; an expo with access to over (https://dcon25.mapyourshow.com/8_0/explore/exhibitor-gallery.cfm?featured=false); open-to-all daily (https://www.designcon.com/en/education/keynotes.html) by engineering visionaries; 78 (https://dcon25.mapyourshow.com/8_0/explore/session-gallery.cfm?sessioncategory9=68); (https://www.designcon.com/en/expo/networking.html) including a Welcome Reception, daily booth bar crawls, and multiple (https://www.designcon.com/en/expo/30th-anniversary.html); and more. IEEE-CNSV officers and members, and local IEEE officers, will be in Booth #515 on the Exhibition Floor. As a friend of CNSV, you can (https://utm.io/uhX2z) with the promo code ENGAGE25 for 15% off all conference passes or a FREE expo pass. Onsite expo admission is $279. Santa Clara Convention Center , 5001 Great America Pkwy, Santa Clara, California, United States, 95054
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Fog learning is an emerging paradigm for optimizing the orchestration of artificial intelligence services over contemporary network systems. Different from existing distributed techniques such as federated learning, fog learning emphasizes intrinsically in its design the unique node, network, and data properties encountered in today's fog networks that span computing elements from the edge to the cloud. An important thread of research in fog learning has been on understanding the role that local topologies formed on an ad-hoc basis among proximal groups of heterogeneous computing elements can play in elevating the achievable tradeoff between intelligence quality and resource efficiency. In this talk, I will discuss recent results on the analysis of fog learning processes which give insights into the impact that these topologies, along with other properties such as model characteristics and fog decision parameters, have on global training performance. Additionally, I will discuss the development of adaptive control methodologies that leverage such relationships for jointly optimizing relevant fog learning metrics. Speaker(s): Dr. Christopher Brinton Agenda: Networking: 4:00 PM to 4:30 PM (Refreshments will be provided) Presentation: 4:30 PM to 5:15 PM Q&A: 5:15 PM to 5:45 PM Networking: 5:45 PM to 6:00 PM Room: 206, Bldg: Daly Science Center, Santa Clara University, Santa Clara, California, United States, 95050
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Our inaugural talk of the 2025 Invited Seminar Series comprises of two back to back talks covering a few interesting topics revolving around cloud computing including user access control, authentication and authorization, deploying machine learning models and accelerating ML workflow on the cloud platforms. Co-sponsored by: Media Partner: Open Research Institute (ORI) Speaker(s): Saidaiah Yachuri, Kunal Sekhri Agenda: - Invited talk from (https://www.linkedin.com/in/saidaiah-yechuri-1257bb14/), SDE at Amazon Web Services(25 mins) - Invited talk from (https://www.linkedin.com/in/kunalsekhri/), Senior SW Engg. at Google (25 mins) - Q/A Session (10 mins) Virtual: https://events.vtools.ieee.org/m/460746 |
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Synopsis: If not solved, AI models' power and water consumption threaten human society and ecology. AI is expected to consume 4% of the world's electricity by 2026. Water requirements are even more alarming as water is a shared, non-renewable resource. This talk will discuss some ways, such as data center redesign that industry and academia are working to tackle this issue and the research directions that may enable us to train and use energy-efficient models. Speaker(s): Dr. Vishnu S. Pendyala, Soumya Batra Virtual: https://events.vtools.ieee.org/m/455744 |
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This is the annual IEEE SFBA Consumer Technology Society (CTSoc) event providing a summary of the latest and unique tech innovations from the 2025 Consumer Electronics Show (CES) in Las Vegas. This event has proven to be very popular as many people working in related industries do not get to attend CES. CES's focus has expanded to beyond consumer electronic devices to many (https://www.ces.tech/exhibits/product-categories.aspx) including wearables, smart homes, robotics, drones, medical and healthcare devices, etc. 2024 IEEE President, Tom Coughlin and Region 6 Director, Joseph Wei, both are past-chairs of SFBA CTSoc will share highlights of the unique tech solutions at CES that may not have been covered by the mainstream media. This will be an in-person event, and the room has limited capacity. Register early, do not miss this event to get a glance in the future of consumer technologies. Previous CES Download and other meetings slides and recordings are available for viewing at https://site.ieee.org/scv-ces/recent-events/. This is a FREE event for IEEE members who provide their IEEE membership # when registering, and $10 for non-IEEE members (no refunds). Speakers: Tom Coughlin - President, Coughlin Associates Joseph Wei - Managing Director, Technology Ventures Group, LLC Speaker(s): Tom Coughlin, Joseph Wei Agenda: 5:30 – 6:00 pm: Check-in, networking, food and drinks 6:00 - 6:10 pm SFBA CTSoc introduction 6:10 - 7:30 pm Presentations by Tom Coughlin and Joseph Wei 7:30 - 8:00 pm Q&A and Networking Room: Silicon Valley Room, Bldg: Plug and Play Tech Center, 440 N.Wolfe Road, Suite 71, SUNNYVALE, California, United States, 94085
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Abstract: Portable electronic devices are ubiquitously rising, but are predominantly powered by batteries that require recharge/replacement to extend operation lifetime. Future devices, especially for energy-constrained applications like continuous biosensing or remote environmental monitoring, require energy-autonomy for seamless long-term operation. Ambient energy harvesting can be a sustainable way of powering these devices, but integrated circuits (IC) or chips need to start and function intelligently with the small available energy. In this talk I will present (a) ultra-low-voltage CMOS circuits for self-start and efficient power extraction from body-heat, and (c) ultra-low-power circuit architecture for motion-adaptive heartbeat detection to demonstrate a truly battery-less wearable bioelectronic sensing system-on-chip (SoC). I will conclude the talk with research areas that my group, BRICS at UC Santa Cruz will be working on soon. Biography: Soumya Bose received B.E. degree from IIEST Shibpur in 2009, M.Tech degree from IIT Kharagpur in 2013, and Ph.D. degree from Oregon State University in 2019. From 2013 to 2015 he worked at Rambus on high-speed integrated circuits. As a research intern in 2018, he worked at Kilby Labs, Texas Instruments, contributed to the development of nano-power LDO. As a research scientist from 2019 to 2024 he worked at Intel Labs. In 2025, he joined University of California, Santa Cruz, as assistant professor in Electrical and Computer Engineering to start his research group BRICS. His research focuses on analog & mixed-signal integrated circuit (IC) design for sensor interfacing, energy harvesting, power management, and data communication for energy constrained applications. Dr. Bose's research work has been published in IEEE conferences and journals and has included several patents. He received 2017 CDADIC best poster award, 2014 IEEE TechSym best presentation award, and 2024 Intel Labs DRA award. Dr. Bose has served as an Associate Editor for IEEE Transactions on Circuits and Systems II: Express Briefs from 2021-2023. He is a technical reviewer for various IEEE journals and conferences. Speaker(s): Soumya Bose, Agenda: (5:30 pm - 6:30 pm) presentation (6:30 pm - 8:30 pm) meet new officers of chapter for 2025 Bldg: Mountain Mike's, 2510 Augustine Drive, Santa Clara, California, United States, 95054
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Join us for an in-person networking event for meet-and-greet with members of the IEEE SSCS SCV Section at Mountain Mike's Pizza Food will be provided. Please register to allow for proper planning. Parking structure located at 2585 Augustine Dr. 3-hour free parking Look for the glass double doors to the party room. 2510 Augustine Dr, Santa Clara, CA 95054, Santa Clara, California, United States, 95054 |
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Humans make decisions and solve problems using heuristics (“thinking fast”) or abstract approaches such as modeling (“thinking slow”). Artificial intelligence approaches can similarly use either heuristics that are related to correlation and categorization, or use models that are related to causation. Predictive Engineering, which melds engineering modeling with probabilistic thinking, aligns closely with causation and an aspect of artificial intelligence called Causal Learning. Issues with some artificial intelligence approaches will be explored, with real (and sometimes controversial and provocative) examples, and promising approaches encompassing causation /predictive engineering will be discussed. [] Speaker(s): Eric Maass Virtual: https://events.vtools.ieee.org/m/445270 |
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