Calendar of Events
|
Monday
|
Tuesday
|
Wednesday
|
Thursday
|
Friday
|
Saturday
|
Sunday
|
|---|---|---|---|---|---|---|
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
|
0 events,
|
1 event,
-
This is a hybrid in-person and online event. Pre-registration is required for either. The latter part of 20th century witnessed the rise of the compute utility made up of large-scale data centers housing densely-packed compute, storage and networking equipment. In the cyber age, data centers became modern day factories requiring megawatts of power for the information technology (IT) equipment, much like the process equipment in a factory of the machine age. Electrical energy supplied to the chips and systems in the data centers turned into multi-megawatts of heat energy which in turn required heat removal means. The active heat removal means also required power. While many innovative measures have been used for heat removal and energy management in data centers, there is a substantial gap in application of the fundamentals of engineering when compared to the approaches taken by the contributors of the 19th and early 20th century machine age. As an example, machine age contributors performed exergy (2nd law of thermodynamics) analysis and deemed it necessary to build a hydro-electric plant as part of the design of an Aluminum factory. Indeed, the majority of data centers today rely on the power infrastructure built by our predecessors. Given the inexorable trajectory of data centers strongly driven by AI, and associated demands on available energy, it is time we returned to such fundamentals, particularly given the environmental challenges. This talk will present a holistic approach that traces the energy flow from a power plant to a chip, and from the chip core to the cooling tower. Speaker(s): Chandrakant D. Patel, PE 925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/518438 |
0 events,
|
1 event,
-
Short-circuit current ratings (SCCR) and interrupting ratings form the backbone of electrical safety, coordination, and compliance in modern power systems. This presentation explores how UL 508A Supplement SB intersects with the National Electrical Code (NEC) to define the limits of what electrical equipment can safely withstand and interrupt under fault conditions. The presentation examines how UL product listings and component ratings interact with NEC Articles 409, 110.9, and 110.10, clarifying how available fault current, protective device selection, and equipment labeling all converge in practice. Real-world examples will illustrate how engineers can properly determine SCCR, verify interrupting ratings, and ensure that the overall system meets both code and product standard intent. Key Topics - Fundamentals of SCCR and interrupting ratings - Relationship between UL 508A Supplement SB and NEC Articles 409, 110.9, and 110.10 - Evaluating equipment for compliance and labeling accuracy - Case studies from industrial and institutional systems Speaker(s): Tyler Shewbert, Agenda: No-host social at 5:30pm Presentation at 6:00pm Dinner at 7:00pm Presentation continues at 7:45pm Adjourn by 8:30pm Zio Fraedo's, 611 Gregory Lane, Pleasant Hill, California, United States, 94523 |
0 events,
|
0 events,
|
0 events,
|
|
0 events,
|
0 events,
|
0 events,
|
1 event,
[]Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas. Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design. We expect registrations for our on-site program to be filled by the end of December; we apologize if you are not able to attend in person, but we encourage you to join us via WebEx. SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/495346 |
1 event,
|
0 events,
|
0 events,
|
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|