SEMI World Headquarters

[] (We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.) The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO). As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures. BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics. SEMI World Headquarters, Milpitas, California, United States

[] (We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.) The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO). As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures. BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics. SEMI World Headquarters, Milpitas, California, United States