Events

It may surprise you that the world’s first hospital‑wide medical information system MIS-I (pronounced "MIS One") was pioneered in Silicon Valley by defense contractor Lockheed Missiles and Space Company in partnership with El Camino Hospital. This accomplishment is being recognized with the dedication of an IEEE Milestone plaque at El Camino Hospital on Thursday, May 14th. From one hospital in 1974 to two hundred in the late1990s and still installed at a few installations as late as 2020, MIS-I proved what a true systems‑engineering approach could accomplish in healthcare. It let physicians and staff across all departments access patient data and enter work orders electronically, eliminating handwritten versions and thereby reducing costs, improving safety, and laying the foundation of modern medical informatics. MIS-I and its successive embodiments were treated the way Lockheed treated spacecraft: as an integrated system. Working side‑by‑side with the hospital’s clinical staff, teams designed and configured each system in a way no competitor matched then and perhaps even now. That collaboration led Lockheed to a number of inventions, including: - A systems architecture that enabled near instantaneous response using 1970s IBM mainframe computers. - The light-pen controlled Video Matrix Terminal, a practical solution to the user‑interface problems of the era when staff couldn’t type fast enough, and the mouse was not available as a tool. - Matrix Programming (also known as Matrix Coding), a language that allowed screens to be created for clinical use without reprogramming the system. [] (https://events.vtools.ieee.org/vtools_ui/media/display/4fcf27c6-0748-4ee1-b6e2-ba5072afd995) [] The program includes a slide show and a video on the history of MIS‑I at El Camino Hospital, along with an interview of Mel Hodge by Deb Muro, CIO of El Camino Health. Mel drove the development of MIS‑I at Lockheed and continued on as the leader of Technicon Medical Information Systems Company. Executives from El Camino Health, IEEE, and Lockheed Martin will speak about the Milestone and the role MIS‑I played in the evolution of hospital information systems. The event will conclude with the dedication of the Milestone plaque. Virtual Attendance Suggested URL will be provided to registered attendees prior to start of event Limited In-Person Seating Available Please select In-Person only if you truly plan to attend Allow ample time for parking. Limited valet parking available at the hospital main entrance. Co-sponsored by: Silicon Valley Technology History Committee Agenda: Virtual Attendees Start Time Virtual Event 4:00 PM Live stream starts, includes historic slide show 4:15 PM Live stream of Program begins 5:30 PM Virtual event ends In-Person Attendees Start Time Live Event 3:45 PM Arrival and Historic Photo Slideshow 4:15 PM Program begins 5:30 PM Reception with Refreshments 6:30 PM Event ends El Camino Hospital, 2500 Grant Road, Mountain View, California, United States, 94040, Virtual: https://events.vtools.ieee.org/m/554746

Abstract: Active Magnetic Bearings (AMBs) are actuators for robotics systems that offer near-frictionless operation of spinning rotors. As is often the case with actuators used with feedback, magnetic bearings are driven with a high gain inner loop to linearize their input-output response for the stabilizing rotor position outer loop control development. The primary benefit of the high gain actuator is that the need for the outer loop to have an internal model of the magnetic bearings is mitigated. However, driving the magnetic bearings with high gain presents issues including increased noise, reduced stability margin, and sensitivity to rotor imbalance, motivating the inclusion of an internal model of the magnetic bearings. H_inf synthesis will be employed to demonstrate potential benefits of a low gain amplifier. And since magnetic bearings show temperature sensitivity, mu-synthesis will be leveraged to show that the benefits of a low gain amplifier can still be realized despite significant process noise and strict requirements. Models of AMB rotor systems will be shown to demonstrate their inherent issues and how a holistic control approach can solve them. Speaker(s): Jordan McCrone, Agenda: 6:00 - 6:30 - Networking and light dinner (for in person attendees) 6:30 - 7:30 - Talk and Q & A 7:30 - 8:00 - Wrap up and Networking Room: 116, Bldg: Bergin Hall, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/558058

Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305

[] (We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.) The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO). As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures. BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics. SEMI World Headquarters, Milpitas, California, United States

[] (We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.) The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO). As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures. BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics. SEMI World Headquarters, Milpitas, California, United States

Speaker(s): Sudipto Chakraborty, Room: 4021, Bldg: Sobrato Campus for Discovery and Innovation, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95054, Virtual: https://events.vtools.ieee.org/m/557263

Recent updates to NFPA 70B reflect the industry’s shift from periodic inspection toward continuous condition monitoring by permitting permanently installed thermal sensors to be used in lieu of traditional infrared (IR) thermographic inspections. This presentation will examine Continuous Thermal Monitoring (CTM) as a modern, code‑aligned approach for monitoring critical electrical assets, highlighting how permanently installed sensors provide 24/7 temperature visibility, early detection of abnormal heat rise, and actionable data for predictive maintenance—without requiring IR windows, panel opening, or personnel exposure to energized equipment. Speaker(s): Jonathan Fromm, Agenda: No-host social at 5:30pm Presentation at 6:00pm Dinner at 7:00pm Presentation continues at 7:45pm Adjourn by 8:30pm Zio Fraedo's, 611 Gregory Lane, Pleasant Hill, California, United States, 94523

Abstract In high-volume manufacturing, failures in advanced electronic packaging are an unavoidable reality. Consequently, effective failure analysis is vital for enhancing product quality, reliability, and safety. This multidisciplinary task requires the integration of fundamental material science with technological expertise in manufacturing processes and product operation. As packages incorporate increasingly diverse materials and complex geometries, the interactions between components become more intricate. To address this, a systematic, data-driven approach is essential for identifying root causes. This lecture outlines strategies for postulating and verifying failures by linking material properties and characterization techniques to specific failure modes. The session concludes by addressing the industry's most pressing technical challenges. Outline - Foundations of Failure Analysis: Global perspectives, packaging challenges, and the "Octagonal Relationship" of engineering materials. - Mechanisms of Failure: Exploring electrical, thermal, mechanical, chemical, and optical properties in advanced packaging. - Strategic Problem Solving: Implementing the 3C Technique (Create, Challenge, and Confirm) to navigate modern analysis hurdles. Co-sponsored by: Benson Chan Speaker(s): KY Cheong, Agenda: See LOCATION tab for WebEx info Room: Symposium Hall, Bldg: Center of Excellence Building, Binghamton University, 85 Murray Hill Road, Vestal, New York, United States, 13850, Virtual: https://events.vtools.ieee.org/m/557425

[] The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Expect deep thought leadership, executive talks and panels, and academic presentations. We're talking about long-term engineering trends and innovation. You won't find marketing narratives, token launches, or promotions. Note: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum Enterprise Alliance, EY, Starknet, among others. Co-sponsored by: Government of Ontario, Invest Hong Kong (Canada), Moody's Ratings, Compass360 Consulting and Tetra Digital Group Agenda: Program Details Room 1: Seminar Room - for the Thought Leaders On the wake of Bill C-15 and the rapid digitisation of Canada's financial system, Canadian innovation leaders will give us a glimpse of what's to come this year and next. 9 am – Registration 9:30 am - Welcome and introduction - Conference Chair Marc Lijour, Secretary of the IEEE Blockchain Technical Community 9:40 am - Opening Keynote by Alex McDougall, CEO of The FUTR Corporation: The Missing Layer: Why Agentic Commerce Needs a Consumer Data Protocol 10 am - Short Keynote by Sheereen Khan, Founder and CEO of Regulativity: An update on the Canadian regulatory landscape 10:10 am - Panel #1 - Stablecoins: A New Era of Payments in Canada - Felipe Priuli, Program Director for CAD Digital (CADD) - Kesem Frank, CEO of Canada Stablecorp (QCAD) - Kevin Zhang, Founder and CEO of LOON Moderator: Evan Thomas 11 am - Short Keynote by Hilary Carter, SVP Research at The Linux Foundation: What's the Role of Open Source for Canadian Sovereignty? 11:10 am - Panel #2 - Sovereignty by Design - Ali Abou Daya, CEO of Transactix Financial Inc. - Thomas You, Associate Partner at Maverix Private Equity - Gaëlle Martin-Cocher, IEEE Canada Moderator: Marc Lijour === NOON: LUNCH BREAK (food will be served in the Boardroom) === 1 pm - Short Keynote by Christopher Chen, Head of InvestHK Canada: Opportunities within the Hong Kong Fintech/Web3 eco-system 1:10 pm - Panel #3 - How does Canada compete on the global stage? - Rajeev Bamra, Global Head of Strategy, Digital Economy at Moody's Ratings - Stuart Davis, President of Surpass Insights Inc. - Torstein Braaten, Chief Compliance at Stablecorp 2 pm - Short Keynote by Bernice Cheung, VP, Financial Services & Cultural Markets Research at Environics Research Group: The State of FinTech Adoption and the rise of Self-Driving Money 2:10 pm - Panel #4 - Gaining Momentum from Innovation to Adoption - Nisrine, Innovation Lead at Interac - Eric Richmond, General Counsel & Head of Business Development at Shakepay - Adam Cai, CEO at Virgo Group Moderator: Asad Saeed == SNACK BREAK == 3:30 pm - Short Keynote by Eyal Sivan, Principal Consultant / Podcast Host at Mr. Open Banking: Open Banking and AI - A Perfect Match 3:40 pm - Panel #5 - The New Frontier of Trust in Agentic AI & Blockchain - Michelle Beyo, CEO of FINAVATOR - Carlos Andres Delgado, Fintech, AI & Banking Expert - Diana Oreto, Blockchain & Digital Assets Expert Moderator: Michelle Beyo 4:30 pm - Neworking Room 2: Main Theatre - for The Engineers Building the next generation of payments and Agentic AI Anil Nadiminti - When AI Agents Pay: Building x402 Apps for Agentic AI on AWS James Holler - Compliance by Design: Why Blockchain Systems Must Integrate Regulatory Frameworks from Day One Ken Timsit - Agentic Commerce and Payments Lawrence Ley - Agentic AI & Blockchain: The Autonomous Future of Decentralized Intelligence Rayan Sekhraoui - Sovereign Infrastructure for Web3 — Why Decentralized Apps Need Independent Cloud Simon Kubbinga - Solana, Superteam, and Agentic Commerce Vikas Malhotra - Building safer environments with control, decentralization and distribution === 12:30 pm LUNCH BREAK (food will be served in the Boardroom) === Academic Talks Federico Gatta - Deviations from Tradition: Stylized Facts in the Era of DeFi Ignacy Nieweglowski - PoliFi Tokens and the Trump Effect Dr. Jia Kan - Stop Building Faster Chains: Start Building Blockchain Operating Systems Dr. Marina Flat - AI Governance in Distributed Ecosystems: Accountability by Design Ngozi Nora Agwu - Beyond Hype: Governance Barriers to Blockchain-Enabled Infrastructure Revanth Reddy Airre - From Reasoning to Settlement: A Five-Layer Architecture for Agent Payments on the Decentralized Network Srisht Fateh Singh - Modeling Loss-Versus-Rebalancing in Automated Market Makers via Continuous-Installment Options Emerging Ventures Shashank Motepalli, Founder of Ekai Labs: Auditable Context Handoff in the Agent-to-Agent Economy Tity Lyngdoh, Founder of Dolphinze: From Global Workforce to Global Payment Rails: Rebuilding Contractor Payments Infrastructure Vedant Harlalka, CEO and Co-Founder of Auditorium AI: Building Early Stage Startups in Canada - Blockchain, Data and Crypto More speakers to be announced soon. Stay tuned! Many thanks to our sponsors: the Government of Ontario (sponsoring the location), as well as Invest Hong Kong (Canada), Moody's Ratings, Compass360 Consulting and Tetra Digital Group! Ontario Investment and Trade Centre, 250 Yonge Street, 35th Floor, Toronto, Ontario, Canada, M5B 2L7

We are excited to continue the Orange County Computer Society (OCCS) Global Emerging Technologies and Artificial Intelligence (GET-AI) Series—a monthly platform focused on transformative innovations in computer science and technology. Hosted by the IEEE Orange County Computer Society Chapter, this series brings together professionals, students, and tech enthusiasts to explore the cutting edge of what’s possible. Following a highly engaging April session on Generative AI, where we explored LLMs, RAG, Agents, MCP, and hands-on AI application development, we are excited to bring you our May Tech Talk on “Security in AI.” --------------------------------------------------------------- 🔒 May Focus: Securing Generative AI As AI systems evolve—from traditional models to LLM-powered agents interacting with enterprise systems and real-world tools—they introduce powerful capabilities along with new security challenges, including: - Data leakage and prompt injection - Model misuse and unauthorized access - Risks in agent-driven automation - Governance and compliance concerns This session combines technical insights and practical demonstrations to explore how to build secure, trustworthy AI systems at scale. --------------------------------------------------------------- Session 1: Intelligent Attack Detection & Provenance (45 mins) Modern enterprises generate massive, fragmented logs, making it difficult to derive meaningful security insights. This session explores how AI enhances detection and forensic analysis: - Graph-Based Intrusion Detection Use unsupervised graph learning to uncover multi-step attacks in network activity - LLM-Powered Security Intelligence Convert low-level alerts into high-level, actionable insights for faster response 👉 Takeaway: Move from fragmented alerts to intelligent, end-to-end attack understanding --------------------------------------------------------------- Session 2: Securing AI Agents — MCP Threats & Defense (45 mins) As AI agents integrate with tools, APIs, and external systems, they introduce new attack surfaces. This session includes a live demo of how agents can be compromised—and secured: - Understanding MCP Architectures How agents invoke tools and why trust boundaries blur - Live Demo: Tool Poisoning & Agent Manipulation See how adversarial inputs can: - Manipulate agent behavior - Trigger unintended actions - Lead to data exfiltration - Layered Security Framework Practical defenses: - Tool authentication - Response sanitization - Schema validation - Context isolation - Real-Time Evaluation Prevent attacks without impacting performance 👉 Takeaway: Practical strategies to secure AI agents in enterprise environments --------------------------------------------------------------- About the Organizer Pradyumna Kodgi Principal Product Manager | Oracle Health & AI IEEE Senior Member | Vice Chair, IEEE EMBS – Orange County Member, IEEE AI Agentic Systems & AI Policy Committees 📍 California, USA 📧 pkodgi@ieee.org 🔗 linkedin.com/in/pkodgi Co-sponsored by: Pradyumna Kodgi Speaker(s): Zhou, Sreekanth Agenda: Securing AI: From Innovation to Resilience AI is rapidly transforming how we build intelligent systems—but as capabilities grow, so do security risks. From LLM-powered agents to tool-integrated architectures, the question is no longer just what AI can do—but how do we secure it? In this interactive session, we cut through the noise and break down AI security in practical, real-world terms—so you can understand not just the risks, but how to defend against them. --------------------------------------------------------------- 🔍 What You’ll Explore - How modern AI systems (LLMs, agents, MCP) introduce new attack surfaces - The shift from traditional security to AI-driven threat models - Key security concepts—explained clearly and practically - Real-world attack scenarios and emerging threat patterns --------------------------------------------------------------- 💡 What Makes This Session Different This isn’t just theory—you’ll see AI systems under attack and defense in action. Through a live, end-to-end demonstration, we’ll show how AI agents can be manipulated—and how layered security approaches can prevent these attacks in real time. --------------------------------------------------------------- 🛠️ Practical Takeaways You’ll walk away with actionable strategies and frameworks you can apply immediately, including: - Securing AI agents interacting with external tools - Validating and sanitizing untrusted inputs - Designing trust boundaries in AI-driven architectures --------------------------------------------------------------- 🎯 Who Should Attend - Security professionals and architects working with AI systems - Engineers and developers building AI/LLM-based applications - Product managers and leaders driving AI adoption - Anyone interested in understanding AI risks and defenses --------------------------------------------------------------- ✨ What You’ll Walk Away With - A clear understanding of emerging AI security risks - Practical knowledge of how to secure AI agents and systems - Real-world insights into attack prevention and defense strategies --------------------------------------------------------------- As AI systems become more autonomous and integrated into enterprise workflows, security becomes foundational—not optional. This session will equip you with the mindset and tools to build AI systems you can trust. Virtual: https://events.vtools.ieee.org/m/557806

IEEE WIE AG Schenectady is going to organize WIE Distinguished Lecture (virtual webinar) on "Human System Engineering Initiatives: From Human Views to Human Readiness Levels" on 5 June 2026, Friday, 12-1 pm EDT. The speaker is Holly A. H. Handley, PhD, PE, the Interim Dean of the Interdisciplinary Schools and a Professor in the Engineering Management and System Engineering Department of Old Dominion University (ODU). This talk discusses the role of Human System Engineering within the System Engineering discipline. It describes two initiatives that are enabling better integration of humans and systems. The Human Views comprise a system architecture viewpoint that provides a perspective on the human roles, activities, and information flows required by a complex system. The Human Readiness Levels assess the degree to which human-focused requirements are incorporated into design decisions and the readiness of a system to interact with its human operator. Together these two efforts encourage System Engineering for the total system by supporting a comprehensive integration of the human component into the systems engineering effort, which is critical to the design, development, and operation of successful systems. Current standards and applications of both initiatives will be included. Speaker(s): Holly Handley Virtual: https://events.vtools.ieee.org/m/550987

[] Co-Sponsored by the OEB/SCV SSIT Chapter and the SCV/OEB/SF EPS Chapter The semiconductor era has transformed modern life, yet, as electronic technologies become increasingly pervasive, their environmental footprint, short product lifecycles, and growing contribution to global e-waste present a critical challenge. In this context, biodegradable electronics is emerging as a complementary paradigm for specific classes of future devices where transient operation, material sustainability, and responsible end-of-life are essential. This talk will examine how biodegradable electronics can be positioned within the broader semiconductor ecosystem through innovations in functional materials, low-temperature processing, flexible device platforms, and sustainable integration strategies. Particular emphasis will be placed on biodegradable and bio-derived substrates, piezoelectric and conductive material systems, as well as their relevance to packaging, sensor platforms, and distributed electronic applications. The discussion will highlight how principles from semiconductor science and engineering can be extended beyond the chip toward greener system-level design, including interface materials, encapsulation, and degradation-aware architectures. Speaker(s): Shweta Agarwala, Virtual: https://events.vtools.ieee.org/m/558051