Events

Process sensors measuring pressure, level, flow, temperature, etc. are assumed to be uncompromised, authenticated, and correct. They are the 100% trusted input for Operational Technology (OT) network monitoring as well as safety and predictive monitoring systems. Process sensor monitoring at the physics level can provide more accurate information for productivity and safety while at the same time providing an independent view of the OT network monitoring systems while not being subjected to ransomware or other IP network malware. There have been several recent programs that have monitored process sensors at the physics level that have demonstrated the efficacy of the approach and produced real, quantifiable benefits. Monitoring the process sensors can also help identify confirmed and potential cyber incidents with equipment such as pumps, compressors, valves, transformers, etc. IEEE conference pass IEEESCV200 at https://www.sensorsconverge.com/sensorsconvergecom/register Speaker(s): , Joe Weiss Room: Great America 1, Bldg: Santa Clara Convention Center, 5001 Great America Parkway, Santa Clara, California, United States, 95054

[]Join us for an insightful webinar with Francesco Carobolante, founder of IoTissimo® LLC and an EPS Distinguished Lecturer, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office, Francesco will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. This session will analyze how signal BW and energy requirements dictate the options available for architecting the package structure, including Vertical Power Delivery, integrated voltage regulators and advanced thermal management techniques. Discover how these architectural shifts are enabling the next generation of data center performance. Speaker(s): Francesco Carobolante, Virtual: https://events.vtools.ieee.org/m/546237

Networking expert Cesar Plata will lead us through a dynamic, interactive session where we will practice proven techniques to expand your professional reach. Key topics include: - The Law of Attraction & Marketing Yourself: Learn how to position yourself effectively. - Networking Etiquette: Master the art of starting and leaving conversations gracefully. - The Elevator Pitch: Refine and deliver your personal pitch with confidence. - Strategic Growth: Explore effective tradeshow tips and learn how to connect and leverage as a team. - Event Mastery: Gain insights on how to organize events and, most importantly, have fun while networking! Speaker(s): Cesar Plata, Room: 108, Bldg: Alameda Hall, Santa Clara University, Santa Clara, California, United States

IEEE Event Agenda - Tuesday May 12, 2026 🔹 5:00 PM – 5:30 PM Registration, Refreshments, Food & Networking (Meet & Greet) Featured Speakers & Sessions 🔹 5:30 PM – 6:15 PM Topic 1: Industry Talk – Standardizing Automotive Firmware for SDVs Experts from Mercedes-Benz, Arm, and Athos Silicon will discuss the urgent need for a standardized, secure, and vendor-agnostic firmware foundation. Key focus areas: - Overcoming fragmented firmware ecosystems - UEFI as a scalable automotive standard - Enabling functional safety, cybersecurity, and interoperability - Supporting chiplet-based and next-gen ADAS architectures Speakers: - François Piednoël – (https://www.linkedin.com/in/francoispiednoel/) - Sachin Athanikar – (https://www.linkedin.com/in/sachin-athanikar-18ba5914/) - Dong Wei (https://www.linkedin.com/in/dongweimba/) 🔹 6:15 PM – 6:45 PM Topic 2: Academic Keynote – Safe Embodied AI: From Theory to Deployment Prof. Ding Zhao (Carnegie Mellon University) Topics include: - Rare-event safety in autonomous systems - Safe reinforcement and imitation learning - Generalizable and adaptive AI safety - Future of trustworthy embodied AI at scale Speaker: - Ding Zhao – (https://www.linkedin.com/in/ding-zhao-01130730/) 🔹 6:45 PM – 7:15 PM Topic 3: Industry Talk – Static Safety Is Dead: Continuous Risk & Compliance for SDVs Akshay Chalana (CEO & Co-founder, Saphira AI) Modern vehicles evolve continuously through software updates, AI-driven functionality, and increasing connectivity—yet safety and cybersecurity practices remain largely static. This talk explores: - What breaks when traditional safety assumptions no longer hold - Real-world ADAS/autonomy failure propagation: dataset bias, requirement drift, and system boundary ambiguity - Cross-domain challenges between safety and cybersecurity - A new model for continuous, system-aware risk assessment and compliance - Treating compliance artifacts as live infrastructure integrated into development pipelines This session provides a practical path to maintaining certification-grade rigor while operating at software velocity. Speaker: - Akshay Chalana – (https://www.linkedin.com/in/akshaychalana/) 🔹 7:15 PM – 7:30 PM Q&A and open discussion - Aditi Ramadwar About This Technical Forum This technical forum brings together OEMs, Tier-1 suppliers, semiconductor leaders, researchers, and innovators to address the challenge of fragmentation and define a unified, future-ready mobility stack. Who Should Attend: - Automotive engineers and architects - Safety and cybersecurity specialists - Semiconductor and embedded systems professionals - Researchers in autonomous vehicles and AI safety - Technical decision-makers from OEMs and suppliers - Students in Automotive, Compute, Mechanical & Electrical Engineering We would be delighted if you could join us and participate in shaping the future of intelligent transportation. Speaker(s): Francois, Wei , Sachin, Zhao, Akshay In-Person at: SEMI Headquarters, 673 S Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/551666

It may surprise you that the world’s first hospital‑wide medical information system MIS-I (pronounced "MIS One") was pioneered in Silicon Valley by defense contractor Lockheed Missiles and Space Company in partnership with El Camino Hospital. This accomplishment is being recognized with the dedication of an IEEE Milestone plaque at El Camino Hospital on Thursday, May 14th. From one hospital in 1974 to two hundred in the late1990s and still installed at a few installations as late as 2020, MIS-I proved what a true systems‑engineering approach could accomplish in healthcare. It let physicians and staff across all departments access patient data and enter work orders electronically, eliminating handwritten versions and thereby reducing costs, improving safety, and laying the foundation of modern medical informatics. MIS-I and its successive embodiments were treated the way Lockheed treated spacecraft: as an integrated system. Working side‑by‑side with the hospital’s clinical staff, teams designed and configured each system in a way no competitor matched then and perhaps even now. That collaboration led Lockheed to a number of inventions, including: - A systems architecture that enabled near instantaneous response using 1970s IBM mainframe computers. - The light-pen controlled Video Matrix Terminal, a practical solution to the user‑interface problems of the era when staff couldn’t type fast enough, and the mouse was not available as a tool. - Matrix Programming (also known as Matrix Coding), a language that allowed screens to be created for clinical use without reprogramming the system. [] (https://events.vtools.ieee.org/vtools_ui/media/display/4fcf27c6-0748-4ee1-b6e2-ba5072afd995) [] The program includes a slide show and a video on the history of MIS‑I at El Camino Hospital, along with an interview of Mel Hodge by Deb Muro, CIO of El Camino Health. Mel drove the development of MIS‑I at Lockheed and continued on as the leader of Technicon Medical Information Systems Company. Executives from El Camino Health, IEEE, and Lockheed Martin will speak about the Milestone and the role MIS‑I played in the evolution of hospital information systems. The event will conclude with the dedication of the Milestone plaque. Virtual Attendance Suggested URL will be provided to registered attendees prior to start of event Limited In-Person Seating Available Please select In-Person only if you truly plan to attend Allow ample time for parking. Limited valet parking available at the hospital main entrance. Co-sponsored by: Silicon Valley Technology History Committee Agenda: Virtual Attendees Start Time Virtual Event 4:00 PM Live stream starts, includes historic slide show 4:15 PM Live stream of Program begins 5:30 PM Virtual event ends In-Person Attendees Start Time Live Event 3:45 PM Arrival and Historic Photo Slideshow 4:15 PM Program begins 5:30 PM Reception with Refreshments 6:30 PM Event ends El Camino Hospital, 2500 Grant Road, Mountain View, California, United States, 94040, Virtual: https://events.vtools.ieee.org/m/554746

Abstract: Active Magnetic Bearings (AMBs) are actuators that offer near-frictionless operation of spinning rotors. As is often the case with actuators used with feedback, magnetic bearings are driven with a high gain inner loop to linearize their input-output response for the stabilizing rotor position outer loop control development. The primary benefit of the high gain actuator is that the need for the outer loop to have an internal model of the magnetic bearings is mitigated. However, driving the magnetic bearings with high gain presents issues including increased noise, reduced stability margin, and sensitivity to rotor imbalance, motivating the inclusion of an internal model of the magnetic bearings. H_inf synthesis will be employed to demonstrate potential benefits of a low gain amplifier. And since magnetic bearings show temperature sensitivity, mu-synthesis will be leveraged to show that the benefits of a low gain amplifier can still be realized despite significant process noise and strict requirements. Models of AMB rotor systems will be shown to demonstrate their inherent issues and how a holistic control approach can solve them. Speaker(s): Jordan McCrone, Agenda: 6:00 - 6:30 - Networking and light dinner (for in person attendees) 6:30 - 7:30 - Talk and Q & A 7:30 - 8:00 - Wrap up and Networking Room: 116, Bldg: Bergin Hall, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/558058

Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305

[] (We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.) The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO). As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures. BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics. SEMI World Headquarters, Milpitas, California, United States

[] (We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.) The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO). As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures. BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics. SEMI World Headquarters, Milpitas, California, United States

Speaker(s): Sudipto Chakraborty, Room: 4021, Bldg: Sobrato Campus for Discovery and Innovation, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95054, Virtual: https://events.vtools.ieee.org/m/557263

Recent updates to NFPA 70B reflect the industry’s shift from periodic inspection toward continuous condition monitoring by permitting permanently installed thermal sensors to be used in lieu of traditional infrared (IR) thermographic inspections. This presentation will examine Continuous Thermal Monitoring (CTM) as a modern, code‑aligned approach for monitoring critical electrical assets, highlighting how permanently installed sensors provide 24/7 temperature visibility, early detection of abnormal heat rise, and actionable data for predictive maintenance—without requiring IR windows, panel opening, or personnel exposure to energized equipment. Speaker(s): Jonathan Fromm, Agenda: No-host social at 5:30pm Presentation at 6:00pm Dinner at 7:00pm Presentation continues at 7:45pm Adjourn by 8:30pm Zio Fraedo's, 611 Gregory Lane, Pleasant Hill, California, United States, 94523

Abstract In high-volume manufacturing, failures in advanced electronic packaging are an unavoidable reality. Consequently, effective failure analysis is vital for enhancing product quality, reliability, and safety. This multidisciplinary task requires the integration of fundamental material science with technological expertise in manufacturing processes and product operation. As packages incorporate increasingly diverse materials and complex geometries, the interactions between components become more intricate. To address this, a systematic, data-driven approach is essential for identifying root causes. This lecture outlines strategies for postulating and verifying failures by linking material properties and characterization techniques to specific failure modes. The session concludes by addressing the industry's most pressing technical challenges. Outline - Foundations of Failure Analysis: Global perspectives, packaging challenges, and the "Octagonal Relationship" of engineering materials. - Mechanisms of Failure: Exploring electrical, thermal, mechanical, chemical, and optical properties in advanced packaging. - Strategic Problem Solving: Implementing the 3C Technique (Create, Challenge, and Confirm) to navigate modern analysis hurdles. Co-sponsored by: Benson Chan Speaker(s): KY Cheong, Agenda: See LOCATION tab for WebEx info Room: Symposium Hall, Bldg: Center of Excellence Building, Binghamton University, 85 Murray Hill Road, Vestal, New York, United States, 13850, Virtual: https://events.vtools.ieee.org/m/557425