Events

Artificial Intelligence is rapidly evolving from generating content and improving individual productivity to securely interacting with enterprise systems, applications, APIs, and organizational data. As AI assistants and agents become more capable, organizations need standardized and governed ways to provide them with the context, tools, and business capabilities required to perform meaningful work. Following our July session on Driving Business Efficiency with AI, the IEEE Orange County Computer Society GET-AI Series continues with a practical, demo-driven August session focused on the Model Context Protocol (MCP) and its role in connecting AI to enterprise data and systems. This double-feature session will first introduce MCP fundamentals, including its architecture, core components, tools, resources, prompts, and the development of a simple MCP server. The second session will build on that foundation by demonstrating how MCP can be used to connect AI assistants and agents with enterprise applications, APIs, databases, and business workflows. By combining foundational concepts with real-world integration patterns and live demonstrations, the August session will help attendees understand how MCP enables secure, scalable, and intelligent enterprise AI solutions. --------------------------------------------------------------- 🔒 August Focus: Connect AI to Enterprise Data [] Session 1: MCP Foundations—Building Your First Model Context Protocol Server (45 mins) Through practical explanations and live demonstrations, this session introduces the Model Context Protocol (MCP) and explains how it enables AI assistants and agents to securely connect with external tools, applications, APIs, and data sources. Attendees will learn how MCP provides a standardized framework for supplying AI systems with the context and capabilities required to perform meaningful tasks. The session will move from core concepts to a hands-on demonstration of building and connecting a simple MCP server. Topics include: - What MCP is and why it matters in the AI era - MCP architecture and core components - MCP Hosts, Clients, and Servers - Tools, Resources, and Prompts - Connecting AI assistants to external data and capabilities - Building a simple MCP server - Defining and exposing an MCP tool 👉 Takeaway: Understand how MCP connects AI assistants and agents with external systems, and learn how to build a basic MCP server that exposes tools, resources, and prompts through a standardized interface. --------------------------------------------------------------- Session 2: Connecting Enterprise AI Using MCP (45 mins) Building on the MCP foundations introduced in Session 1, this session explores how organizations can use the Model Context Protocol (MCP) to connect AI assistants and agents with enterprise applications, APIs, databases, knowledge sources, and business workflows. Through architecture examples and live demonstrations, attendees will learn how MCP can enable secure, scalable, and governed access to enterprise capabilities. The session will focus on moving from a basic MCP implementation to practical enterprise use cases that support intelligent workflows and real-world business outcomes. Topics include: - Connecting AI assistants and agents to enterprise systems using MCP - Exposing enterprise APIs, applications, and data as MCP capabilities - Integrating databases, file repositories, business systems, and knowledge sources - Combining MCP with Retrieval-Augmented Generation and semantic search - Designing secure and governed access to enterprise data - Authentication, authorization, and access-control considerations - Orchestrating multi-step workflows across enterprise systems 👉 Takeaway: Learn how to use MCP to securely connect AI assistants and agents with enterprise applications, data, and workflows, enabling intelligent automation, faster access to business information, and scalable enterprise AI solutions. --------------------------------------------------------------- About the Organizer Pradyumna Kodgi Principal Product Manager | Oracle Health & AI IEEE Senior Member | Vice Chair, IEEE EMBS – Orange County Member, IEEE AI Agentic Systems & AI Policy Committees 📍 California, USA 📧 pkodgi@ieee.org 🔗 linkedin.com/in/pkodgi Co-sponsored by: Pradyumna Kodgi Speaker(s): Laxman Tank Agenda: August Session Agenda 4:30 PM – 5:00 PM — Registration, Check-In & Networking 5:00 PM – 5:15 PM — Welcome, Introductions & Opening Remarks Google Meet opens at 5:00 PM. Virtual attendees may join at this time. 5:15 PM – 6:00 PM — Session 1: MCP Foundations—Building Your First Model Context Protocol Server 6:00 PM – 6:15 PM — Dinner & Networking 6:15 PM – 7:00 PM — Session 2: Connecting Enterprise AI Using MCP --------------------------------------------------------------- This session will equip attendees with the practical knowledge needed to understand MCP, build foundational MCP capabilities, and apply the protocol to create secure, scalable, and intelligent enterprise AI solutions. Room: Emerald Cove Conference Room, Bldg: Beall Applied Innovation, 5270 California Ave, 2nd Floor , IRVINE, California, United States, 92617, Virtual: https://events.vtools.ieee.org/m/570942

As AI and HPC workloads scale exponentially, traditional network fabrics are hitting a critical bottleneck. Legacy Ethernet simply wasn’t built for the ultra-low latency and zero-loss tolerances demanded by next-generation clusters. This talk will provide an engineering-first primer on UltraEthernet—the industry’s collaborative answer to modern data center scaling. Rip Sohan will dissect the architectural gaps of legacy networks, analyze the new data plane building blocks, and unpack the specification’s advanced congestion control and reliability mechanisms. He will also explore how UltraEthernet integrates with existing RDMA ecosystems. Attendees will leave with a definitive mental model of the fabric designed to power the future of compute. Speaker(s): Rip Sohan, 925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/565084

Dr. Stan Trout of Spontaneous Materials will discuss how changing tariffs, domestic sourcing requirements, and global market forces are reshaping the permanent magnet industry and what these trends mean for its future. With nearly 50 years of experience in permanent magnets, magnetic materials, and rare-earth technologies, Dr. Trout is widely recognized as a leading authority in the field. For more information, see (https://scvmag.org/event/20260910/) Speaker(s): Dr. Stan Trout Quadrant Corp, 1120 Ringwood Ct., San Jose, California, United States, 95131, Virtual: https://events.vtools.ieee.org/m/567538

Modern AI does not understand pixels or words. It understands latent structure. As these invisible representations become the language through which humans and machines communicate, they will fundamentally redefine how we create, discover, and collaborate. This lecture reveals the mathematics behind these hidden spaces and explores why they may become the most important interface between human intelligence and artificial intelligence. This lecture explores the evolution of latent representations from Variational Autoencoders, which first learned meaningful probabilistic embeddings, to Generative Adversarial Networks, which demonstrated photorealistic generation while exposing challenges in stability and control, and finally to diffusion models and Stable Diffusion, which combine exceptional image quality with unprecedented controllability and robustness. Beyond the algorithms, the talk examines how latent representations are transforming human-AI interaction. By enabling AI systems to reason, generate, and collaborate through shared abstract representations, they are reshaping creativity, scientific discovery, healthcare, education, and engineering. Understanding these hidden spaces offers not only insight into how modern AI works, but also a glimpse into a future where humans and intelligent machines communicate and co-create in entirely new ways. Note: - You will require a Zoom account (free to obtain) to join the meeting. This requirement is to avoid Zoom bombing. Please sign in using the email address tied to your Zoom account, not necessarily the one you used to register for the event. - By registering for this event, you agree that IEEE and the organizers are not liable to you for any loss, damage, injury, or any incidental, indirect, special, consequential, or economic loss or damage (including loss of opportunity, exemplary or punitive damages). The event will be recorded and will be made available for public viewing. Co-sponsored by: Vishnu S. Pendyala, SJSU Speaker(s): Dr. Narayan Srinivasa, IEEE Fellow , Dr. Vishnu S. Pendyala Virtual: https://events.vtools.ieee.org/m/570049

IEEE SCV-OEB SSIT Chapter Meeting IEEE P3469 Standard Will Enable an Accounting Method For Carbon Content in a Supply Chain Join us for a Member Technical Meeting on how the proposed IEEE P3469 Standard could enable more accurate and auditable accounting of carbon emissions across complex supply chains. Speaker Tom Coughlin, President of Coughlin Associates and Co-Chair of this SSIT standards activity, will introduce the e-liability accounting method and explain how it addresses common challenges in current carbon accounting practices, including double-counting and reliance on estimates. He will also discuss how organizations can apply the method to track lifecycle emissions across their products and services, along with the current progress toward establishing it as an IEEE standard. Tom Coughlin is a digital storage analyst and business and technology consultant with more than 40 years of experience in the data storage industry. He is an IEEE Fellow, 2024 IEEE President, Past President of IEEE-USA, Past Director of IEEE Region 6, and Past Chair of the IEEE Santa Clara Valley Section. IEEE members and guests are welcome at 6:00 PM on Tuesday, September 15, at Santa Clara University. Venue details will be confirmed. Speaker(s): Tom Coughlin Agenda: Agenda - Challenges in current carbon accounting, including double-counting and estimates - How e-liability accounting tracks supply chain and company emissions - How IEEE P3469 enables accurate and auditable lifecycle emissions data - Current use of the e-liability method and IEEE standard development status - Open Q&A and discussion — bring your questions Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/570636

Santa Clara Valley IEEE Power & Energy and Industry Applications Societies Join us for a presentation and discussion on: Critical Power Systems: Design & NEC Requirements Speaker: Tyler Shewbert, P.E., Field Application Engineer, Eaton’s Bussmann Division Cost: IEEE Members $30, Non-Members $40 by 9/17 (https://events.vtools.ieee.org/m/570048) Date: September 23, 2026, 5:30 to 8:30 PM Place: Delta/Marriott Hotel, 2151 Laurelwood Road, Santa Clara CA 95054. About the Talk This presentation provides an overview of National Electrical Code (NEC) requirements for Critical Power Systems. It will highlight how these systems support life safety, business continuity, and mission-critical operations. Topics include: - The differences between 700 (Emergency Systems), 701 (Legally Required Standby Systems), systems, including permitted loads, transfer requirements, and operational expectations. - NEC requirements for selective coordination of overcurrent protective devices and the impact on system reliability and fault isolation. - Separation requirements for emergency and standby feeders, wiring methods, raceways, and equipment locations. - Generator considerations. - Battery energy storage systems (BESS) and UPS applications for critical power continuity. - Grounding and bonding considerations for separately derived systems and transfer switch configurations. - An overview of Article 708 Critical Operations Power Systems (COPS) Attendees will gain a clear understanding of NEC compliance requirements and practical design strategies that improve system reliability, maintainability, and resiliency. This presentation will be of value to contractors, consulting engineers, AHJs, and facility engineers, Registration required: After 9/17, registration will be $5 more and non-refundable due to hotel final meal commitment. (https://r6.ieee.org/scv-pesias/) and (https://r6.ieee.org/scv-pesias/event/critical-power-systems-design-nec-requirements/) We look forward to seeing you there! Speaker(s): Tyler Shewbert Agenda: Agenda: 5:30 Check in, Meet and Greet 6:30 Dinner buffet 7:00 Talk 8:00 Q&A 8:30 Conclude Room: Parking validation may be required, Bldg: Delta/Marriott Hotel Santa Clara-Silicon Valley, 2151 Laurelwood Road, Santa Clara, California, United States, 95054

In the past few years, because of high-performance computing (HPC) driven by artificial intelligence (AI) and data centers in this AI era, packaging using glass-core substrates has been attracting lots of traction. For example, among others, Intel’s one-trillion-transistors application processor with glass-core substrate is to be shipped by the end of 2030 (announced September 2023) and TSMC’s chip-on-panel-on-substrate (CoPoS) with glass-core interposer is to be shipped in Q1 of 2029 (announced April 2025). In this lecture, a brief fundamental of through-glass via (TGV) and redistribution-layers (RDLs) of glass packaging will be presented. The advantages and disadvantages of glass, silicon, and organic will be discussed. Panel-level packaging vs. wafer-level packaging and the panel size will also be provided. Finally, the effects of coefficient of thermal expansion (CTE) of glass-core substrate on the solder joint reliability on printed circuit board (PCB) will be presented. Some recommendations will be provided. Speaker(s): John Lau, SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, 95050