Events

In the past few years, because of high-performance computing (HPC) driven by artificial intelligence (AI) and data centers in this AI era, packaging using glass-core substrates has been attracting lots of traction. For example, among others, Intel’s one-trillion-transistors application processor with glass-core substrate is to be shipped by the end of 2030 (announced September 2023) and TSMC’s chip-on-panel-on-substrate (CoPoS) with glass-core interposer is to be shipped in Q1 of 2029 (announced April 2025). In this lecture, a brief fundamental of through-glass via (TGV) and redistribution-layers (RDLs) of glass packaging will be presented. The advantages and disadvantages of glass, silicon, and organic will be discussed. Panel-level packaging vs. wafer-level packaging and the panel size will also be provided. Finally, the effects of coefficient of thermal expansion (CTE) of glass-core substrate on the solder joint reliability on printed circuit board (PCB) will be presented. Some recommendations will be provided. Speaker(s): John Lau, SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, 95050

Artificial Intelligence is rapidly progressing from systems that generate responses to intelligent agents capable of reasoning, planning, using tools, maintaining context, and executing multi-step tasks. As organizations move toward agentic AI, the opportunity is no longer limited to helping employees find information—it is increasingly about enabling AI systems to participate in and automate real business processes. Following our August session on Connecting AI to Enterprise Data using Model Context Protocol (MCP), the IEEE Orange County Computer Society GET-AI Series continues in September with a practical, demo-driven exploration of AI Agents and Autonomous Operations. This double-feature session begins with the foundations of agentic AI—what makes an AI system an agent, how agents reason and plan, how they use tools, memory, and context, and how to build a simple agent capable of completing a multi-step task. The second session builds on those concepts to explore how autonomous and multi-agent systems can orchestrate complex enterprise workflows while maintaining security, governance, observability, human oversight, and operational reliability. By combining foundational concepts with architecture patterns and live demonstrations, the September session will help attendees understand how organizations can progress from AI assistance to intelligent, governed autonomous operations. --------------------------------------------------------------- [] Session 1: AI Agents 101: Build Your First Intelligent Agent 45 minutes Through practical explanations and a live demonstration, this session introduces the fundamentals of Agentic AI and explains how AI agents differ from traditional chatbots and standalone LLM applications. Attendees will explore the core building blocks of an AI agent, including reasoning, planning, memory, context, tools, and actions. The session will then demonstrate how these components work together by building a simple agent capable of interpreting a goal, selecting appropriate tools, executing multiple steps, and returning a meaningful result. Topics Include - What Is an AI Agent? From Assistants to Agentic AI - Core Agent Components: Reasoning, Planning, Memory & Actions - Tools, Function Calling & Context Management - Human-in-the-Loop Controls and Common Agent Design Patterns - Build and Demonstrate a Simple Multi-Step AI Agent 👉 Takeaway Understand how AI agents reason, plan, use tools, and take actions—and learn how to build a basic intelligent agent capable of executing a multi-step task. --------------------------------------------------------------- Session 2: Autonomous Enterprise AI: Orchestrating Agents, Tools & Business Workflows Building on the agent foundations introduced in Session 1, this session explores what it takes to move from a single AI agent to reliable, governed autonomous enterprise operations. Attendees will examine architecture patterns for orchestrating agents across applications, APIs, enterprise data, and business processes. The session will explore when to use a single agent versus multiple specialized agents, how agents collaborate and delegate tasks, and how organizations can maintain control through approvals, identity, policy, observability, evaluation, and operational guardrails. The session will also examine the production challenges that arise when agents begin taking actions—including incorrect tool selection, uncontrolled loops, unreliable outputs, excessive autonomy, and failure recovery—and practical strategies for addressing them. A live demonstration can showcase an end-to-end autonomous workflow in which an agent receives a business objective, gathers context, selects tools, performs multiple steps, requests approval when appropriate, and completes the workflow. Topics Include - From AI Agents to Autonomous Operations - Enterprise Agent Architecture: Single-Agent & Multi-Agent Systems - Agent Orchestration, Delegation & Enterprise Tool Integration - Governance, Human Oversight, Observability & Failure Recovery - Production-Ready Agentic Systems with Live End-to-End Demonstration 👉 Takeaway Learn how to design secure, observable, and governed agentic systems that coordinate tools, data, and business processes to enable reliable autonomous enterprise operations. --------------------------------------------------------------- About the Organizer Pradyumna Kodgi Principal Product Manager | Oracle Health & AI IEEE Senior Member | Vice Chair, IEEE EMBS – Orange County Member, IEEE AI Agentic Systems & AI Policy Committees 📍 California, USA 📧 pkodgi@ieee.org 🔗 linkedin.com/in/pkodgi Co-sponsored by: Pradyumna Kodgi Agenda: September Session Agenda Following the same format as August: 4:30 PM – 5:00 PM — Registration, Check-In & Networking 5:00 PM – 5:15 PM — Welcome, Introductions & Opening Remarks Google Meet opens at 5:00 PM. Virtual attendees may join at this time. 5:15 PM – 6:00 PM — Session 1: AI Agents 101 — Build Your First Intelligent Agent 6:00 PM – 6:15 PM — Dinner & Networking 6:15 PM – 7:00 PM — Session 2: Autonomous Enterprise AI — Orchestrating Agents, Tools & Business Workflows Room: Emerald Cove Conference Room, Bldg: Beall Applied Innovation, 5270 California Ave, 2nd Floor , IRVINE, California, United States, 92617, Virtual: https://events.vtools.ieee.org/m/575018

Join us for the 2nd Annual IEEE Power & Energy (PES) Resiliency Summit on Achieving a More Reliable and Resilient Energy Future, taking place 6-8 October 2026 at the Hilton San Francisco Union Square in San Francisco, CA. Registration and full details are at: (https://ieee-pes.org/events/2026-ieee-power-energy-society-pes-resiliency-summit/) Hosted by PG&E, this year's summit convenes utility professionals, solution providers, and industry leaders to explore practical solutions for strengthening the reliability and resilience of our electric power grid. As we navigate an era of increasing energy demand and climate challenges, this event is your opportunity to engage with the latest strategies, technologies, and policy perspectives shaping the future of energy delivery. View videos from last year's event. (https://ieeetv.ieee.org/event/2025-ieee-power-energy-society-pes-summit) Why Attend? - Expert Insights: Hear from industry leaders on critical topics, including AI and data center impacts on the grid, wildfire mitigation, extreme weather response, and workforce development. - Practical Solutions: Gain actionable best practices that you can implement in your own systems to improve reliability performance and outage response. - Networking Opportunities: Connect with top decision-makers from leading organizations in energy, technology, and government. - Collaborative Future: Join a vibrant community of professionals dedicated to achieving a more reliable and resilient energy future. - 86% of the participants from the 2025 event indicated that they would attend this event in the future. Event Highlights: - Keynote Speakers: Hear insights from PG&E leadership and other top-tier industry executives. - Expert Panels: A single-track program covering the most urgent challenges facing our grid today. - Networking: Engage with peers during receptions, lunch breaks, and display tables. See the event website for latest schedule and speaker names and topics. Our Bay Area PES and IAS chapters are co-hosting this event to publicize it to our Bay Area members. Additionally, our SF/OEB PES, SF YP, and SF WIE are hosting a post-Summit Networking event with separate registration. Please check it out, register early for limited spots and join us! (https://events.vtools.ieee.org/m/572258) Co-sponsored by: Pacific Gas & Electric Agenda: See Registration links for Resiliency Summit & Post Summit Networking Agendas: (https://ieee-pes.org/events/2026-ieee-power-energy-society-pes-resiliency-summit/) (https://events.vtools.ieee.org/m/572258) San Francisco, California, United States

IEEE SCV WIE AI Summit 2026 [] In an era where AI technologies are rapidly transforming industries and redefining possibilities, it is crucial to explore both the innovations driving this change and the responsibilities that come with it. Today, we will delve into a diverse array of topics that highlight the multifaceted nature of AI and its profound impact on our lives. Our sessions will cover the latest developments in Large Language Models and Foundation Models, exploring efficient fine-tuning, multilingual adaptation, and the role of LLMs as knowledge bases. We will also examine the evolution of AI agents, focusing on autonomous task completion, multi-agent collaboration, and the integration of external knowledge for robust decision-making. In the realm of Vision and Multimodality, we will explore the integration of text, image, and video understanding, as well as advanced techniques like zero-shot learning and self-supervised learning. Our discussions on MLOps for LLMs will provide insights into best practices for training, deploying, and evaluating large models. We will also address the critical areas of Knowledge-Grounded Reasoning, On-Device Learning, and the ethical dimensions of AI, including bias mitigation, privacy preservation, and the detection of misinformation. Talk tracks are broadly classified but not limited to, 1. Large Language Models (LLMs) & Foundation Models 2. AI Agents 3. Sustainable Hardware for AI 4. Edge to Cloud Orchestration 5. Knowledge-Grounded & Reasoning 6. On-Device Learning for LLMs and Multi-Modal AI 7. Ethics, Bias & Fairness 8. Women Leading the AI Revolution Agenda: TBD Bldg: SC12, Intel, 3600 Juliette Ln, Santa Clara, CA 95054, US, Santa Clara, California, United States, 95054

Our IEEE PES San Francisco / Oakland East Bay Chapter invites you to join our post IEEE PES Resiliency Summit Networking session (at the Hilton Union Square) and a delicious 5-course Moroccan dinner & show at Marrakech Restaurant right afterwards. (The restaurant will not be open to the public and registration will be required.) See https://ieee-pes.org/events/2026-ieee-power-energy-society-pes-resiliency-summit/ for more info and separate registration for the Summit. Our Networking, Dinner & Show will be co-hosted by our IEEE San Francisco Young Professionals (YP) & Women in Engineering (WiE) affinity groups. Additionally, this event is cosponsored by the IEEE PES Resiliency Summit, IEEE PES Region 6 YP and IEEE PES Women in Power (WiP). All are welcome but registrations will be limited to seating capacity. Networking at Hilton Union Square 4-5pm Moderated Panel: PES Industry Leaders to share about their careers, challenges and excitement for the next generation of engineers. 5-6pm Speed Networking: PES Industry Leaders will move from tables of 6-8 attendees every 10 minutes. Move from Hilton Union Square a 1/2 block to Marrakech Restaurant 6:30-7:30pm Five Course Moroccan Dinner at Marrakech Restaurant with informal networking 7:30-10pm Georges Lammam Ensemble & Show with the premier Arabic band including violinist & singer Georges Lammam, keyboardist Khader Keileh, Susu Pampanin on tabla & Amina Goodyear on additional percussion. The show will also include two local SF bellydancers Jordone & Maya and open floor dancing! Co-sponsored by: IEEE PES Resiliency Summit & Region 6 Young Professionals (YP) & Women in Power (WiP) San Francisco, California, United States

[]This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC (High Performance Computing), Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems. Speaker(s): Dan Kuchta, Virtual: https://events.vtools.ieee.org/m/568144

Part of the 11th ACM/IEEE Symposium on Edge Computing (SEC 2026) Location: Santa Clara University | Date: Oct 13-15, 2026 Overview The future of the Edge is not just decentralized—it must be sustainable. As AI models grow in complexity, the environmental and energetic costs of deploying them on edge devices have become a critical bottleneck. The Minimalist Edge AI Challenge invites student teams to tackle the "AI Bloat" head-on. This one-day competition challenges you to take state-of-the-art "heavy" models and transform them into lean, green, high-performance machines capable of running on constrained, eco-friendly hardware. Can you maintain intelligence while slashing the carbon footprint? Join our Discord group for latest updates (https://discord.gg/V29ZXCTFR5). --------------------------------------------------------------- The Challenge Participating teams will be tasked with deploying a complex AI workload (e.g., real-time multi-object tracking or environmental anomaly detection) onto provided low-power hardware (Qualcomm Arduino UNO Q). Your mission is to optimize for the "Green Trifecta": - Model Accuracy: Maintain high predictive performance and reliability while operating under strict resource constraints. - Model Compression: Use pruning, quantization, and distillation to shrink the model footprint. - Resource Efficiency: Minimize peak RAM and CPU utilization to ensure smooth execution on minimalist hardware. - Energy Parsimony: Achieve the lowest possible Joules-per-inference to maximize battery life and sustainability. --------------------------------------------------------------- Why Participate? - Showcase Your Skills: Pitch your solution to a jury of world-leading edge computing experts from academia and industry. - Build Your Career & Network: Pitch your solution to a premier jury of world-leading edge computing experts and recruiters from academia and industry giants like Qualcomm. - Engineer for Planet Earth: Move past theoretical AI. Help define the actual benchmarks for "Green AI" and create real-world impact by building hyper-efficient, eco-friendly edge computing models. - Cash Prizes: The top three teams from each track will receive cash rewards: - 1st Place: $1,000 - 2nd Place: $750 - 3rd Place: $500 - Participant Perks: All competition participants will receive IEEE Computer Society swag and a free IEEE Computer Society Student Membership (Note: Requires an active IEEE Student Membership). --------------------------------------------------------------- Eligibility & Team Composition - Open to all undergraduate and graduate students registered at a recognized university. - Teams should consist of 2 to 4 members. - Recommended Skill Set: * Proficiency in Python (PyTorch/TensorFlow) and/or C++/Rust. - Experience with model optimization techniques (Pruning, Quantization). - Knowledge of Linux systems and resource profiling. - A passion for sustainable engineering. --------------------------------------------------------------- Important Dates ● Team Registration Deadline: Sept. 6th, 2026 ● Competition Day: Oct. 13-16 (Co-located with SEC 2026) Co-sponsored by: QualComm 500 El Camino Real, Santa Clara, California, United States, 95053

IEEE OEB-LMAG, 4Q26 Meeting Visit both the USS Hornet and CA Historical Radio Society Museum! This is one meeting you won’t want to miss! Wednesday, October 14, 2026 (11:50 AM to 2:30 PM PDT) The Oakland East Bay Life Members Affinity Group (OEB LMAG) is hosting an excursion to two historical locations in Alameda CA, including lunch – this is like winning the “daily double”! Our lunch meeting this quarter will be at the USS Hornet Museum, but those who want to spend more time there can come early (at 11:00 AM) for a free docent guided tour of the famous aircraft carrier that recovered the Apollo 11 Astronauts, and their Apollo Capsule, after the first landing of men on the moon, as well as Apollo 12 a few months later. The ship has 20+ restored vintage aircraft from WWII: Grumman FM-2 Wildcat, TBM-3E Avenger, Cold War & Vietnam Era: F-4J Phantom II, F8U-1 Crusader, F-14A Tomcat, F-11 Tiger (cockpit/nose), TA-4J Skyhawk, S-3B VikingHelicopters: SH-3H Sea King, HUP-1 Retriever, SH-2F Seasprite, UH-34D Seahorse, Modern Era: F/A-18C Hornet. After lunch, the excursion will continue with a visit to the birthplace of broadcasting: At the California Historical Radio Society Museum, we be given a tour of the museum that includes a collection that spans about 120 years of radio, wireless communication, and broadcasting history, including vacuum tubes, radios in unusual period casings (snakeskin, neon, even a whisky-bottle design), WWII-era transmitters, CIA com gear, a replica of Amelia Earhart's plane radio, a working telegraph, and vintage televisions (including the largest black-and-white TV ever made) playing classic programs. Please plan to drive, or car pool, to the USS Hornet, docked at Pier 3 in Alameda: USS Hornet - Sea, Air and Space Museum, 707 W Hornet Ave, Alameda, CA 94501 https://maps.app.goo.gl/2YRgoVeC5PcNyNN58 Please plan to arrive no later than 11:50, as lunch will be served at noon! After a leisurely 50 minute lunch, we will depart in the cars we arrived in, and drive to the California Historical Radio Society Museum, about 15 minutes away at: 2152 Central Ave, Alameda, CA 94501 https://maps.app.goo.gl/H15ydMEyjgFxTwUB7 Subsidized fee for OEB Life Members: $30 We also welcome Non-Members, so please bring your spouse or guest(s): $50 Agenda: USS Hornet Museum Tour: 11-Noon Lunch on Board: Noon-1 CHRS Drive and Tour: 1-3 Bldg: Visitor's Entrance, USS Hornet Museum, 707 W Hornet Ave, Alameda, California, United States, 94501

*****This vTools link is for purchase of Vendor Tables ONLY! No walk-in registrations.***** (Limit of 10 vendor tables so do not delay!) Vendor table will be one 6-foot exhibit table. Vendor table includes one (1) attendee ticket. A power strip will be available upon request. For more than one (1) attendee to support the table, please register additional people using the regular attendee link: https://events.vtools.ieee.org/m/562108 Tape, Tacks, Nails may not be applied to walls, ceilings, or doors and are strictly prohibited. Outside food, non-alcoholic and alcoholic beverage are not allowed. IEEE and the Hotel are not responsible for any loss or damage to property belonging to you. Sign-in for attendees and continental breakfast will open at 7:15AM, so please be completely set up by 7:15AM. Vendors are encouraged (voluntary) to bring up to three (3) giveaways to be included in the overall raffle for attendees. This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. The seminar will serve as a primer for engineers and a refresher for experienced engineers. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers. The registration cost includes continental breakfast, lunch, and refreshments. Please join us in attending this one-day Technical Seminar which will include an impressive list of speakers from IEEE, Eaton, Electrical Reliability Services (a Vertiv Company), ETAP, SEL, and NEMA. Seminar topics will include: - Overview of IEEE 1547-2018, Standard for Interconnection and Interoperability of distributed energy resources (DER) with Electric Power Systems - Electrical Design Fundamentals – Circuit Breaker Applications Understood - Medium Voltage Cable Installations - Cable Ampacity and Sizing Fundamentals Generator - Protective Relaying Fundamentals - NEMA Resources and the NEMA Standards Store Plan to attend this timely, educational Seminar. Registration is now open! Speaker(s): Chase Sun, Chris Lovin, Steve Park, Avelardo Morales , Angel Morales, Mike Stone Agenda: 8:00AM-4:30PM (sign-in opens at 7:15AM) *****Vendors should be set up and ready by 7:15AM.***** DoubleTree by Hilton Hotel Pleasanton at The Club, 7050 Johnson Drive, Pleasanton, California, United States, 94588

This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. The seminar will serve as a primer for engineers and a refresher for experienced engineers. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers. The registration cost includes continental breakfast, lunch, and refreshments. Please join us in attending this one-day Technical Seminar which will include an impressive list of speakers from IEEE, Eaton, Electrical Reliability Services (a Vertiv Company), ETAP, SEL, and NEMA. Seminar topics will include: - Overview of IEEE 1547-2018, Standard for Interconnection and Interoperability of distributed energy resources (DER) with Electric Power Systems - Electrical Design Fundamentals – Circuit Breaker Applications Understood - Medium Voltage Cable Installations - Cable Ampacity and Sizing Fundamentals Generator - Protective Relaying Fundamentals - NEMA Resources and the NEMA Standards Store Plan to attend this timely, educational Seminar. Registration is now open! For Group Registrations, please list all attendee email addresses under Special Requests. ***** Early-Bird registration closes on July 3, don’t delay!***** (Registration is limited to 100 attendees and must be completed on vTools. No walk-in registrations.) Speaker(s): Chase Sun, Chris Lovin, Steve Park, Avelardo Morales , Angel Morales, Mike Stone Agenda: 8:00AM-4:30PM (sign-in opens at 7:15AM) DoubleTree by Hilton Hotel Pleasanton at The Club, 7050 Johnson Drive, Pleasanton, California, United States, 94588

[]This no-cost workshop brings together five industry experts (plus an optional lab tour) to discuss the latest 2.5D/3D/3.5D semiconductor packaging solutions for HPC and AI. It highlights the growing challenges of fault isolation (FI) and failure analysis (FA) in dense interconnects such as hybrid bonding and micro bump arrays, reviews new thermal management options (metallic TIMs, low-temp solders), showcases advanced non-destructive inspection tools (computed laminography and high resolution CT), and introduces cutting edge microscopy techniques (SAM and PiFM) for defect characterization, while outlining emerging FI-FA workflows and tool roadmaps for reliable, scalable AI and data center hardware. Attendees will gain insight into current industry troubleshooting workflows and a forward-looking roadmap of the tools and techniques being developed to address advanced packaging failures. Additionally, the optional lab tour can help the attendees understand the tools and techniques discussed in the lectures. Four guided training talks with small-group interaction: 9:00: Advanced Packaging for AI – Challenges and Roadmaps in Fault Isolation and Failure Analysis 9:30: Metal TIM and Low-Temp Solder Paste for HPC and AI Industry Challenges 10:00: Failure Analysis of Electronic Components for AI and Data Center Infrastructure 10:30: High-Resolution 3D X-Ray Inspection for Advanced Packaging Integration 11:00: Scanning Acoustic Microscopy (SAM) and Photo-induced Force Microscopy (PiFM) for Defect Identification and Characterization in AI Hardware 11:30: lunch, social/networking, and optional lab tours Speaker(s): Yan Li, David Hu, Audrey Chamoire , Jeff Gelb, Austin Barnes Covalent Corp., 925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/575155