Events

Networking expert Cesar Plata will lead us through a dynamic, interactive session where we will practice proven techniques to expand your professional reach. Key topics include: - The Law of Attraction & Marketing Yourself: Learn how to position yourself effectively. - Networking Etiquette: Master the art of starting and leaving conversations gracefully. - The Elevator Pitch: Refine and deliver your personal pitch with confidence. - Strategic Growth: Explore effective tradeshow tips and learn how to connect and leverage as a team. - Event Mastery: Gain insights on how to organize events and, most importantly, have fun while networking! Speaker(s): Cesar Plata, Room: 108, Bldg: Alameda Hall, Santa Clara University, Santa Clara, California, United States

IEEE Event Agenda - Tuesday May 12, 2026 🔹 5:00 PM – 5:30 PM Registration, Refreshments, Food & Networking (Meet & Greet) Featured Speakers & Sessions 🔹 5:30 PM – 6:15 PM Topic 1: Industry Talk – Standardizing Automotive Firmware for SDVs Experts from Mercedes-Benz, Arm, and Athos Silicon will discuss the urgent need for a standardized, secure, and vendor-agnostic firmware foundation. Key focus areas: - Overcoming fragmented firmware ecosystems - UEFI as a scalable automotive standard - Enabling functional safety, cybersecurity, and interoperability - Supporting chiplet-based and next-gen ADAS architectures Speakers: - François Piednoël – (https://www.linkedin.com/in/francoispiednoel/) - Sachin Athanikar – (https://www.linkedin.com/in/sachin-athanikar-18ba5914/) - Dong Wei (https://www.linkedin.com/in/dongweimba/) 🔹 6:15 PM – 6:45 PM Topic 2: Academic Keynote – Safe Embodied AI: From Theory to Deployment Prof. Ding Zhao (Carnegie Mellon University) Topics include: - Rare-event safety in autonomous systems - Safe reinforcement and imitation learning - Generalizable and adaptive AI safety - Future of trustworthy embodied AI at scale Speaker: - Ding Zhao – (https://www.linkedin.com/in/ding-zhao-01130730/) 🔹 6:45 PM – 7:15 PM Topic 3: Industry Talk – Static Safety Is Dead: Continuous Risk & Compliance for SDVs Akshay Chalana (CEO & Co-founder, Saphira AI) Modern vehicles evolve continuously through software updates, AI-driven functionality, and increasing connectivity—yet safety and cybersecurity practices remain largely static. This talk explores: - What breaks when traditional safety assumptions no longer hold - Real-world ADAS/autonomy failure propagation: dataset bias, requirement drift, and system boundary ambiguity - Cross-domain challenges between safety and cybersecurity - A new model for continuous, system-aware risk assessment and compliance - Treating compliance artifacts as live infrastructure integrated into development pipelines This session provides a practical path to maintaining certification-grade rigor while operating at software velocity. Speaker: - Akshay Chalana – (https://www.linkedin.com/in/akshaychalana/) 🔹 7:15 PM – 7:30 PM Q&A and open discussion - Aditi Ramadwar About This Technical Forum This technical forum brings together OEMs, Tier-1 suppliers, semiconductor leaders, researchers, and innovators to address the challenge of fragmentation and define a unified, future-ready mobility stack. Who Should Attend: - Automotive engineers and architects - Safety and cybersecurity specialists - Semiconductor and embedded systems professionals - Researchers in autonomous vehicles and AI safety - Technical decision-makers from OEMs and suppliers - Students in Automotive, Compute, Mechanical & Electrical Engineering We would be delighted if you could join us and participate in shaping the future of intelligent transportation. Speaker(s): Francois, Wei , Sachin, Zhao, Akshay In-Person at: SEMI Headquarters, 673 S Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/551666

Love them or hate them, the world’s first hospital‑wide computerized medical information system was pioneered in Silicon Valley by Lockheed Missile and Space Corporation in partnership with El Camino Hospital. From one hospital in 1974 to two hundred in the late 90s and still working in 2020, MIS‑1 proved what a true systems‑engineering approach could accomplish in healthcare. It let physicians and staff across all departments access patient data and enter work orders electronically — reducing costs, improving safety, and laying the foundations of modern clinical informatics. Lockheed treated MIS‑1 the way they treated spacecraft: as an integrated system. Working side‑by‑side with El Camino Hospital’s clinical staff, they designed and configured the system in a way no competitor matched then — and perhaps even now. That collaboration led to the light pen, a practical solution to the user interface problem of the era — staff couldn’t type and the mouse hadn’t been invented. --------------------------------------------------------------- HYBRID EVENT This event may be attended in person or viewed in real time online. Connection details will be provided to registered attendees. HOSPITAL PARKING Please allow ample time for parking. Limited valet parking is available at the hospital main entrance. The event is in the Conference Center on the Ground Floor. Co-sponsored by: Silicon Valley Technology History Committee El Camino Hospital, 2500 Grant Road, Mountain View, California, United States, 94040, Virtual: https://events.vtools.ieee.org/m/554746

Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305

[] (We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.) The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO). As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures. BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics. SEMI World Headquarters, Milpitas, California, United States

[] (We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.) The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO). As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures. BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics. SEMI World Headquarters, Milpitas, California, United States

Theme for 2026: at the intersection of modernised Payments and AI, featuring Stablecoins, protocols such as x402, Agentic AI such as OpenClaw, on the wake of Bill C-15 and the rise of open source AI. We have a packed agenda! [] The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Expect deep thought leadership, executive talks and panels, and academic presentations. We're talking long-term engineering trends and innovation. You won't find marketing narratives, token launches, or promotions. Note: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum Enterprise Alliance, EY, Starknet, among others. Co-sponsored by: Toronto Tech Week and the Government of Ontario Agenda: First wave of speaker announcement On the wake of Bill C-15 and the rapid digitisation of Canada's financial system, Canadian innovation leaders will give us a glimpse of what's to come this year and next. Panel #1 - Stablecoins: A New Era of Payments in Canada - Felipe Priuli, Program Director for CAD Digital (CADD) - Kesem Frank, CEO of Canada Stablecorp - Kevin Zhang, Founder and CEO of LOON Panel #2 - Canada's Digital Sovereignty - Ali Abou Daya, CEO of Transactix Financial Inc. - Thomas You, Associate Partner at Maverix Private Equity Panel #3 - The new Frontier of Trust in Agentic AI & Blockchain - Michelle Beyo, CEO of FINAVATOR - Carlos Andres Delgado, Fintech, AI & Banking Expert - Diana Oreto, Blockchain & Digital Assets Expert More speakers to be announced soon. Stay tuned! Many thanks to our sponsors: the Government of Ontario (sponsoring the location), as well as Invest Hong Kong (Canada), Moody's Ratings, Compass360 Consulting and Tetra Digital Group! Ontario Investment and Trade Centre, 250 Yonge Street, 35th Floor, Toronto, Ontario, Canada, M5B 2L7

IEEE WIE AG Schenectady is going to organize WIE Distinguished Lecture (virtual webinar) on "Human System Engineering Initiatives: From Human Views to Human Readiness Levels" on 5 June 2026, Friday, 12-1 pm EDT. The speaker is Holly A. H. Handley, PhD, PE, the Interim Dean of the Interdisciplinary Schools and a Professor in the Engineering Management and System Engineering Department of Old Dominion University (ODU). This talk discusses the role of Human System Engineering within the System Engineering discipline. It describes two initiatives that are enabling better integration of humans and systems. The Human Views comprise a system architecture viewpoint that provides a perspective on the human roles, activities, and information flows required by a complex system. The Human Readiness Levels assess the degree to which human-focused requirements are incorporated into design decisions and the readiness of a system to interact with its human operator. Together these two efforts encourage System Engineering for the total system by supporting a comprehensive integration of the human component into the systems engineering effort, which is critical to the design, development, and operation of successful systems. Current standards and applications of both initiatives will be included. Speaker(s): Holly Handley Virtual: https://events.vtools.ieee.org/m/550987