Events

- Location: The Yosemite Conference Room (B3) has been reserved for - Building 3: (https://www.google.com/maps/search/843+Auburn+Ct.+Fremont,+CA+94538-7366?entry=gmail&source=g) - Guest Check-In: Building 1: (https://www.google.com/maps/search/47173+Benicia+St.+Fremont,+CA+94538-7366?entry=gmail&source=g) - Escort Duty: After the guests check in with Security at Building 1 (B1), Maja Bland and Patty Medina will be responsible for meeting guests, escorting them to Building 3 (B3), and ensuring they remain within the designated approved areas throughout their visit. Co-sponsored by: UL Solutions, Fremont Speaker(s): Richelieu Quoi, Valéry Ray Agenda: 5:30 PM - Dinner and Social 6:15 PM - Call to Order, Announcements 6:30 PM - Guest Speaker Topics Bldg: 1, UL Solutions, 47173 Benicia St., Fremont, CA, California, United States, 94538-7366

This is a hybrid in-person and online event. Pre-registration is required for either. Doug Engelbart was an engineer who worked at Stanford Research Institute (later SRI International) from 1957 to 1986. On December 9, 1968, in San Francisco’s Civic Auditorium, he demonstrated a vision of computing that reached beyond calculation wherein computers could augment a human’s ability to understand and solve complex problems. Later called The Mother of All Demos, his vision included many aspects of computing that have become truly ubiquitous. Amongst these was the mouse, his invention which had its first public exposure on that day 58 years ago. He also demonstrated collaborative online editing, hypertext, video conferencing, word processing, spell checking, and revision control. This talk will trace the development of Engelbart’s vision, which was first inspired by (https://en.wikipedia.org/wiki/Memex) of 1945, and which led to Engelbart’s 1962 paper (https://www.dougengelbart.org/pubs/papers/scanned/Doug_Engelbart-AugmentingHumanIntellect.pdf) and his 1968 Demo. It will also explore the paradigm shift that he championed, and which we all use on a daily basis. Importantly, this talk will also discuss the unfinished revolution that Engelbart left us. The timing of this talk coincides with other events happening later that week: SRI’s 80th anniversary celebration on Nov. 12, and the dedication of an IEEE Milestone for the Mouse on Nov. 13. Speaker(s): Jeff Rulifson, Bldg: Recreation Center, 550 E Remington Drive, Sunnyvale, California, United States, 94087, Virtual: https://events.vtools.ieee.org/m/584786

Stanford IEEE and the Global Semiconductor Alliance (GSA) Talent Initiative present an industry panel featuring Stanford alumni from GSA partner companies across the semiconductor industry, followed by informal networking with the panelists. Wednesday, November 11, 5-6 PM. Free and open to all Stanford students (undergrad and grad) in EE, CS, and related engineering programs. Room TBD. Panelists are still being finalized. Details and RSVP: https://luma.com/tocxory8 Co-sponsored by: Global Semiconductor Alliance (GSA) Talent Initiative Bldg: Stanford Electrical Engineering (room TBD), 350 Jane Stanford Way, Stanford, California, United States, 94305

Key Takeaways from this talk: - The 4 Types of People You Need In Your Corner for a Successful Career - What is Mentorship? And why do you need it? - How to be a good Mentor - How to be a good Mentee - How you can get started - Build your own personal Board of Directors for your Career today Co-sponsored by: Santa Clara University Student Chapter Speaker(s): Avery Lu, Room: 2302, Bldg: SCDI, Santa Clara University, Santa Clara, California, United States, Virtual: https://events.vtools.ieee.org/m/585093

[]This 2-day symposium focuses on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, stress levels, mechanisms, testing schemes, accelerated testing, and environmental stresses. The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliabilit-yrelated aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing. Location: In person at UCLA, and over IEEE WebEx Dates: November 12-13, 2026 Cost: $90 ($75 for IEEE members, $35 for WebEx) through Oct. 16 UCLA, Los Angeles, California, United States, Virtual: https://events.vtools.ieee.org/m/572167

Inventing the Future SRI has spent 80 years developing the technology that fuels the world we live in today: the internet, robotics, weather satellites, early human-machine AI, medicine, diagnostics and treatments, education programs, mapping, personal computing, and more. Celebrate with us and hear from some of the people who continue to deliver the future. - David Pogue, Moderator - David Parekh, SRI CEO - Adam Cheyer, Siri founder - Gary Guthart, Intuitive Surgical founder - Todd Grindal, SRI Education President - Celia Merzbacher, Executive Director of QED-C - Karen Myers, VP, Information and Computing Sciences and Lab Director, AI Center More special guests to be announced soon! Co-sponsored by: Computer History Museum Computer History Museum, 1401 N. Shoreline Blvd, Mountain View, California, United States, 94043

Stanford IEEE, co-hosted with the IEEE Circuits and Systems Society (CASS) and Samsung Semiconductor, is holding a half-day technical workshop on how AI compute is designed and orchestrated, from the transistor up to the datacenter. It is open to Stanford students, staff, and faculty along with guests from the co-hosting organizations, and is aimed especially at undergraduate and graduate students in electrical engineering and computer science. The program features talks and a panel from industry and Stanford faculty speakers, covering AI software, circuit design, advanced packaging, and hardware co-design, with time for audience Q&A. Speakers will be announced soon. Admission is free and no registration is needed. Just show up! Light refreshments and lunch will be provided. Details: https://luma.com/kv8u97ga Co-sponsored by: IEEE Circuits and Systems Society (CASS); Samsung Semiconductor Room: 101X, Bldg: Paul G. Allen Building, 420 Via Palou, Stanford, California, United States, 94305

SRI will be honored with two new (https://history.ieee.org/ieee-milestones-program/) — designations that recognize technical achievements of lasting historical significance. The room will be filled with some of the people who made these innovations real. What to expect: - Doors open at 9:30 am; coffee and light fare will be served - Welcome and opening remarks from David Parekh, CEO of SRI - The unveiling of two new IEEE Milestones - Invention of SRI’s Computer Mouse, 1961-1968 - First Robotic Telepresence Surgery System, 1987-1995 - Remarks from 2024 IEEE President, Tom Coughlin - A history of IEEE Milestone’s from Brian Berg, IEEE Region 6 Milestone Chair - A moderated panel led by Pulitzer Prize-winning journalist and author John Markoff This is a rare chance to hear directly from the people who shaped these breakthroughs — and to be there when their contributions are formally written into the historical record. Co-sponsored by: SRI Computer History Museum, 1401 N. Shoreline Blvd, Mountain View, California, United States, 94043

Electrical utility infrastructure has historically been responsible for less than 10% of reported wildfires in California. However, fires attributed to power lines account for roughly half of the most destructive wildfires in the state’s history. Rapid detection of electrical faults and de-energization of the affected power line can therefore play an important role in reducing the potential for utility-related wildfire ignition. Power semiconductors offer an opportunity to significantly reduce protection response times, potentially to well below one cycle. One approach uses thyristor-based solid-state crowbars to rapidly short-circuit the line during a fault, providing a fast-acting protective response ahead of conventional electromechanical switching devices. This additional layer of protection can be integrated with existing infrastructure while retaining conventional circuit-interruption equipment. Because the crowbar operates only during fault conditions rather than continuously conducting load current, it can provide high-speed protection without introducing continuous operating losses. This presentation will explore the potential application of solid-state crowbar protection as a wildfire risk-mitigation technology, including its fundamental operating principles, key technical design considerations, integration with conventional protection equipment, and the modular architecture that allows the concept to scale from low-voltage to medium-voltage distribution systems. Speaker(s): Dr. Martin Schulz, Virtual: https://events.vtools.ieee.org/m/586349

IEEE EMC Silicon Valley Chapter sponsors this technical event but does not have any financial stake in the event. The Silicon Valley Area Workshop on EMC and SI/PI (SV-EMCTM) is planning another round of exciting presentations this year from world-renowned experts in EMC and SI/PI. The program will focus on advanced tutorials on topics that many engineers working in the area of EMC and SI/PI will find important to their job. The event will take place from 8:30-4:45 PM, on Tuesday, Nov. 17, 2026 at the Rhode & Schwarz facility at 490 N McCarthy Blvd Suite 100 Milpitas, CA 95035. Registration is now open and can be accessed at https://tinyurl.com/SV-EMC. The presentations and speakers for the event include: - How to Perform Simulations of High-Speed Systems, Baolong Li, Cadence Design Systems - Recent Progress in Machine-Learning Driven PCB Power Delivery Network Design, Chulsoon Hwang, Missouri University of Science and Technology - De-Embedding for In-Circuit Test Characterization and Materials Testing in R&D and Manufacturing Environments, Jim Drewniak, Clear Signal Solutions - Accelerating EMC Design Verification: From Automated Rule Checking to Multiphysics Optimization, Yun Xu and David Johns, Dassault Systems - AI-Assisted Signal and Power Integrity: Practical Applications and Future Outlook, Matteo Cocchini, IBM - Understanding Vias for Better SI and PI – > 50+ Years of Physics-Based Modeling, Christian Schuster, Hamburg University of Technology - Understanding Root Causes of SIPI Through Measurement, Mike Schnecker, Rohde & Schwarz - Protecting High-Speed Interfaces from Electrostatic Discharge, Daryl Beetner, Missouri University of Science and Technology - Industry Outlook on ESD Protection Challenges and Solutions for High-Speed Interfaces, Sergej Bub, Nexperia A table-top show will be held from the morning to the noon break where several vendors will be available to discuss software, components, equipment and other tools that help practicing engineers tackle EMC and SI/PI problems. Vendor table-top show from 10:20-2:45 is free to IEEE Members Rhode and Schwarz will sponsor a short reception after the event. If you are a vendor interested in sponsoring a table at the event, you can also register as a vendor on the (https://tinyurl.com/SV-EMC.). If you have any questions, please feel free to reach out to myself, Lijun Jiang (ljf82@mst.edu), or Melissa Pence (mpence@mst.edu). 490 N McCarthy Blvd Suite 100 , Milpitas, California, United States, 95035

Abstract: Wireless power transfer has emerged as a transformative technology. Traditionally, biomedical devices use batteries as a power source. Therefore, every battery replacement requires surgery. The concept of seamlessly delivering power within the human body through implanted coils and antennas has opened a new frontier in healthcare, enabling the development of innovative medical devices and systems. Some applications of implanted wireless power transfer technology include implantable medical sensors, monitoring devices, drug delivery systems, and neurostimulators. The implanted coils and antennas ensure these medical devices function optimally without the need for invasive procedures for battery replacement or recharging. When it comes to wireless power transfer, there are two major methods used in implanted devices. One is magnetic field coupling, which uses coils, and the second method involves electromagnetic waves transferred through antennas. The development of these components demands careful consideration of factors such as miniaturization, biocompatibility, and efficient power transfer over varying distances and orientations within the human body. Magnetic coupling offers high power transfer efficiency but is limited by the depth at which power can be effectively transferred. Beyond a certain depth, efficiency drops significantly. Radiative power transfer via electromagnetic waves can transfer power over larger distances, but its efficiency may become very low. An interesting research topic is how to take advantage of both methods to extend the range of power transfer while optimizing power transfer efficiency. Another primary focus in this field is the development of safe and efficient systems that comply with safety regulations. Particularly, the regulated levels of exposure in terms of Specific Absorption Rate (SAR) are critical considerations in the design and implementation of these technologies. To improve power transfer efficiency, careful modeling and simulation of these devices is essential, as well as rigorous testing in phantom and laboratory environments. This talk aims to explore some of these topics, considering the significance, challenges, and potential of wireless power transfer technology for implanted devices. Speaker(s): Sima Noghanian Room: 4021, Bldg: Sobrato Campus for Discovery and Innovation, 500 El Camino Real, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/591377

The unprecedented growth of artificial intelligence (AI) is fundamentally transforming data center design. Industry initiatives centered around 800VDC power distribution have emerged as a promising pathway to reduce conversion stages, improve energy efficiency, lower copper usage, and support ultra-high-density computing environments. This presentation will examine the technical and economic drivers behind the transition toward Direct Current (DC) data centers, including increasing AI workloads, growing power demands, and evolving sustainability requirements. It will provide an overview of current industry developments, emerging technologies, and architectural approaches. Speaker(s): Joel Liu, Agenda: No-host social at 5:30pm Presentation at 6:00pm Dinner at 7:00pm Presentation continues at 7:45pm Adjourn by 8:30pm Zio Fraedo's, 611 Gregory Lane, Pleasant Hill, California, United States, 94523