Events

Join us at Santa Clara University for the APEC 2026 Download Event, hosted by the IEEE PELS San Francisco Bay Area Chapter. This engaging session brings together engineers, researchers, and industry professionals to explore the most impactful moments and innovations presented at the Applied Power Electronics Conference (APEC) 2026. The event will highlight key takeaways from technical sessions, including emerging trends in wide bandgap semiconductors, advances in high-efficiency power conversion, AI-driven design optimization, and next-generation energy systems. Attendees will gain valuable insights into cutting-edge research and real-world applications shaping the future of power electronics. In addition, we will cover standout keynote sessions, offering perspectives from industry leaders on the evolving landscape of power electronics. The program aims to foster knowledge sharing, networking, and discussion within the local power electronics community. Student Highlights: Students are especially encouraged to attend! This is a great opportunity to: - Discover cutting-edge topics that can inspire your coursework, senior projects, or research direction - Learn directly from experts about industry expectations and emerging career paths in power electronics - Network with professionals and local engineers from leading companies in Silicon Valley - Gain exposure to real-world applications beyond the classroom Whether you attended APEC or want a curated overview of its most important developments, this download event is an excellent opportunity to stay informed, get inspired, and expand your professional network. Bldg: Sobrato Campus for Discovery and Innovation, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95053

Reserve this date for a social gathering followed by this presentation. IEEE member fee is subsidized. Before Wi-Fi, smartphones, and streaming, there were spark transmitters, crystal sets, and glowing vacuum tubes. Rachel Lee, the Executive Director of the California Historical Radio Society will discuss the work being done to preserve the technologies and stories that shaped modern electronic communication. This presentation offers a fast-paced visual tour of the CHRS Museum in Alameda. Agenda: Social meeting, presentation, and lunch. Select from buffet or order from menu depending on the number of registrations. Bldg: Golf course restaurant, not pro shop, Beeb's Sports Bar and Grill, 915 Club House Drive, Livermore, California, United States

Join us for an insightful virtual webinar on "The Engineer’s Guide to AI Strategy: Bridging the Gap Between Business and Technical Reality" hosted by the IEEE Women in Engineering Oregon Section AG and co-hosted by Spokane Section, Seattle Section San Francisco section, Santa Clara Valley Section, and San Fernando Valley Section WIE AG where we challenge the traditional boundaries between strategy, governance, and engineering. The rapid rise of Artificial Intelligence has led to countless “Proof of Concepts” that never make it to production—and production systems that fail spectacularly when they do. Why does this happen? A key reason lies in how organizations traditionally separate Strategy and Governance from Engineering execution. Strategy is often treated as a conceptual exercise, while governance is reduced to compliance checklists—leaving engineers disconnected from the very decisions that shape successful AI systems. In this insightful session, we challenge that paradigm. We will explore how engineers must evolve from execution-focused contributors to strategic decision-makers, integrating governance and strategy as core technical requirements in AI system design. Participants will learn how to bridge the gap between business vision and engineering reality by embedding strategy, governance, and ethical considerations directly into the development lifecycle. Additionally, the session will highlight practical strategies for women in tech to strengthen their influence—through confident communication, strategic thinking, and authentic leadership. Key Learning Objectives - Understand why many AI systems fail to transition from concept to production - Learn how to align engineering decisions with organizational strategy - Explore how to embed governance and safety into AI pipelines - Develop a strategic engineering mindset - Gain practical insights on influencing effectively as a woman in technology Who Should Attend - Engineers and AI practitioners - Early-career professionals and students - Technical leaders and project managers - Anyone interested in AI strategy, governance, and leadership development Speaker(s): Kierra Dotson Agenda: - Welcome & Overview of IEEE WIE Oregon Section Affinity Group - Invited talk from Kierra Dotson - Q/A Session Virtual: https://events.vtools.ieee.org/m/553802

Diamond Semiconductor Device Design & Fabrication [] Abstract: Diamond Quanta: making diamond as available as silicon Laser Annealing for Electronic-Quality Diamond Abstract: Diamond’s extreme thermal conductivity, wide bandgap, high breakdown field, stiffness, and radiation hardness make it a compelling platform for power microelectronics, photonics, and quantum technologies. But its performance is often limited by defects that scatter carriers, perturb color-center environments, and degrade quantum coherence. Conventional polishing and growth processes typically create defects near the surface, where they will have the greatest impact on electronic and optical performance. For many applications, a key challenge is to convert commercially available diamond plates into device-ready surfaces over large areas. In collaboration with Lawrence Livermore Lab, Diamond Quanta is developing sub-melt nanosecond Pulsed‑Laser Annealing (PLA) - a controllable, scalable means to reconfigure carbon bonding and relieve near‑surface strain without melting. This method produces low-defect, device-ready surfaces from industrial-grade diamond, with applications in high-power electronics, photonics, and quantum-grade substrates and wafers. Read More: (https://arxiv.org/abs/2512.08719v1) (https://link.springer.com/article/10.1557/s43580-025-01206-x) Speaker: Adam Khan Founder & CEO Diamond Quanta AGENDA: Thursday April 23, 2026 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar Please register on Eventbrite before 9:30 AM on Thursday April 23, 2026 $4 IEEE members $6 non IEEE members (discounts for unemployed and students ) Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road, EAG Labs, 810 Kifer Road, Sunnyvale, California, California, United States, 95051

Datacenter workload fluctuations challenge the design and operation of our critical grid infrastructure. Significant gaps exist in assessment of these fluctuations as to their lifetime and short-term impact on the infrastructure and environment. Some mitigation approaches focus on throttling the datacenter workload, thus impacting the performance. Other approaches include use of alternate generation sources or energy storage systems. While disparate, these approaches are reactive and lack foresight and the intelligence to plan and strategize for optimal power management. We introduce an approach to quantify the transitional entropy generated during datacenter power fluctuations as a metric to evaluate datacenter performance using power demand measurements. A comparative assessment is provided between a BESS optimized datacenter and a regular datacenter to demonstrate the reduction of irreversibilities due to power fluctuations. Workloads are used to characterize the datacenter power demand at the point of interaction with utility. This approach can be scaled from datacenters to servers to chips. Speaker(s): Ratnesh K Sharma, Agenda: No-host social at 5:30pm Presentation at 6:00pm Dinner at 7:00pm Presentation continues at 7:45pm Adjourn by 8:30pm Zio Fraedo's, 611 Gregory Lane, Pleasant Hill, California, United States, 94523

Shalini Lakshmana is inviting you to a scheduled Zoom meeting. Topic: SCV WIE Mar ExCom Meeting Time: Mar 26, 2026 06:00 PM Pacific Time (US and Canada) Every month on the 26 of the month, 36 occurrence(s) Monthly: https://zoom.us/meeting/tJArfumopzkpHtaky1j5fYpqwMUeY7hSmBWs/ics?icsToken=DLAvxr8efHNhT92mFgAALAAAAICuIz08PSYY6dBYKGdyAmG9V8apUVN2a4qZ15xYs4WT3mV-sSkt5z2I4R9S5HnEoBhV7EWs81CyNNkybzAwMDAwMQ&meetingMasterEventId=GF3_gS3WTzuUZDIP3DGSlw Join Zoom Meeting https://zoom.us/j/94690092342?pwd=7PGwqJDSorXhy8TcYD9alL0bucCPEc.1 Meeting ID: 946 9009 2342 Passcode: 9yPaX9 Agenda: - New member introductions - Past Events - Upcoming Events - Other agenda items Virtual: https://events.vtools.ieee.org/m/555229

Overview Webinar EDS SCV/SF event, Topic: "Robustness and Reliability of Wide Bandgap Power Semiconductors", Presenter: Dr. Layi Alatise "Robustness and Reliability of Wide Bandgap Power Semiconductors" Lecture by Dr. Layi Alatise The Electron Devices Society Santa Clara Valley/San Francisco joint Chapter and Device Reliability Physics committee are hosting Dr. Layi Alatise When: Friday, April 24th, 2026 – 11:45AM to 1:15PM (PDT) 11:45AM - 12PM: Introduction 12PM-12:45PM: Lecture 12:45PM-12:55PM: Q&A 1PM Adjourn Where: Zoom Zoom This is an online event ONLY and attendees can participate via Zoom. We will send the Zoom meeting information to registrants one day before the meeting. Please make sure you register. Contact: ieeescveds at gmail.com Speaker: Dr. Layi Alatise Abstract: Wide bandgap devices are increasingly penetrating the automotive market and are becoming prime candidates for implementation in applications like traction inverters and battery chargers. The mission profile of the traction inverter is a particularly aggressive one since the electrothermal stresses on the power devices vary significantly in amplitude and frequency as the motor drive goes through various stages of the drive cycle including acceleration, deceleration, stalling etc. Historically, the traction converter has been implemented using silicon devices where the performance and reliability is well known and understood. Application of WBG devices like SiC MOSFETs and GaN power devices in automotive applications requires understanding of the reliability and qualification procedures especially according to the automotive standard. SiC and GaN power devices have varying internal physics and modes of operation with vastly varying robustness and reliability performance compared to silicon devices. Given the sensitive nature of the application, these devices must pass stringent automotive reliability tests and guidelines defined by the Automotive Electronics Council (AEC), the Joint Electron Device Engineering Council (JEDEC-JC70) and the European Centre of power electronics (AQG). Virtual: https://events.vtools.ieee.org/m/555035

Overview Webinar EDS SCV/SF event, Topic: "Robustness and Reliability of Wide Bandgap Power Semiconductors", Presenter: Dr. Layi Alatise "Robustness and Reliability of Wide Bandgap Power Semiconductors" Lecture by Dr. Layi Alatise The Electron Devices Society Santa Clara Valley/San Francisco joint Chapter and Device Reliability Physics committee are hosting Dr. Layi Alatise When: Friday, April 24th, 2026 – 11:45AM to 1:15PM (PDT) 11:45AM - 12PM: Introduction 12PM-12:45PM: Lecture 12:45PM-12:55PM: Q&A 1PM Adjourn Where: Zoom Zoom This is an online event ONLY and attendees can participate via Zoom. We will send the Zoom meeting information to registrants one day before the meeting. Please make sure you register. Contact: ieeescveds at gmail.com Speaker: Dr. Layi Alatise Abstract: Wide bandgap devices are increasingly penetrating the automotive market and are becoming prime candidates for implementation in applications like traction inverters and battery chargers. The mission profile of the traction inverter is a particularly aggressive one since the electrothermal stresses on the power devices vary significantly in amplitude and frequency as the motor drive goes through various stages of the drive cycle including acceleration, deceleration, stalling etc. Historically, the traction converter has been implemented using silicon devices where the performance and reliability is well known and understood. Application of WBG devices like SiC MOSFETs and GaN power devices in automotive applications requires understanding of the reliability and qualification procedures especially according to the automotive standard. SiC and GaN power devices have varying internal physics and modes of operation with vastly varying robustness and reliability performance compared to silicon devices. Given the sensitive nature of the application, these devices must pass stringent automotive reliability tests and guidelines defined by the Automotive Electronics Council (AEC), the Joint Electron Device Engineering Council (JEDEC-JC70) and the European Centre of power electronics (AQG). Virtual: https://events.vtools.ieee.org/m/555035

Monthly AdCom meeting: 1. Welcome - Hualiang 2. Symposium status update - Annette/Paul/Hualiang 3. Education outreach status - Masha/Azmat/Hualiang 4. Chapter Storage - Hualiang XXXX NOT 5. Monthly talk preparation - Chandan/Luu 6. Chapter website update - XXXX NOT Venkatesh/Claire/Paul 7. Senior member advancement - Dwayne Xxxx NOT 8: Election 2026 9: Open discussion - All Agenda: Monthly AdCom meeting: 1. Welcome - Hualiang 2. Symposium status update - Annette/Paul/Hualiang 3. Education outreach status - Masha/Azmat/Hualiang 4. Chapter Storage - Hualiang XXXX NOT 5. Monthly talk preparation - Chandan/Luu 6. Chapter website update - XXXX NOT Venkatesh/Claire/Paul 7. Senior member advancement - Dwayne Xxxx NOT 8: Election 2026 9: Open discussion - All Virtual: https://events.vtools.ieee.org/m/549396

[]This presentation provides a high-level description of CALCE-UMD activities in reliability physics of microelectronic systems, starting with a brief history and continuing on to recent trends in multiscale modeling of the reliability of advanced microelectronic packaging. The discussion includes specific focus on the importance of considering material microstructure in predictive reliability physics modeling; and explores the role of reliability physics in the context of AI/ML* approaches for reliability modeling. In Topic 1, we will examine three examples where microstructure-sensitive modeling can provide important insights into material behavior: (i) organic interposers/substrates that are based on fabric-reinforced composites; (ii) solder alloys with heterogeneous multiscale microstructure; (iii) sintered silver materials with agglomerated nanoporous microstructure. In Topic 2, we will qualitatively explore the interplay between reliability physics and AI/ML in influencing both epistemic as well as aleatory uncertainties in reliability predictions. *AI/ML: Artificial Intelligence / Machine Learning Speaker(s): Abhijit Dasgupta, Bldg: ARMS 3115, Purdue University, West Lafayette, Indiana, United States, Virtual: https://events.vtools.ieee.org/m/554090

Maximize your time at the Sensors Converge 2026. The IEEE Santa Clara Valley (SCV) Section invites all professionals and members attending Sensors Converge to an exclusive evening of networking and industry connection. This is your opportunity to meet key leaders, innovators, and fellow engineers from the local tech community outside of the main exhibition hours. Room: 207, Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, California, United States, 95054-1119

[]Join us for an insightful webinar with Francesco Carobolante, founder of IoTissimo® LLC and an EPS Distinguished Lecturer, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office, Francesco will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. This session will analyze how signal BW and energy requirements dictate the options available for architecting the package structure, including Vertical Power Delivery, integrated voltage regulators and advanced thermal management techniques. Discover how these architectural shifts are enabling the next generation of data center performance. Speaker(s): Francesco Carobolante, Virtual: https://events.vtools.ieee.org/m/546237