Hosted via Google Meet - https://meet.google.com/pqw-trcy-xpg The financial industry is entering a new phase of intelligence—one where AI systems are no longer just analytical tools but autonomous collaborators capable of interpreting goals, reasoning over complex data, and taking context-aware actions. This talk explores the emergence of agentic AI systems in finance—AI architectures designed with intent, memory, and decision agency at their core. We’ll examine how these systems differ from traditional automation by introducing the concept of goal-driven autonomy: agents that plan, execute, and self-reflect across dynamic financial environments. Drawing from real-world applications such as loan underwriting, portfolio monitoring, and compliance intelligence, the session will unpack how planners, executors, and reflectors interact within an agentic loop to make transparent, auditable decisions. The discussion will also highlight enabling technologies—large language models as reasoning engines, retrieval-augmented generation (RAG+) for contextual grounding, and knowledge graphs for structured memory—and how they converge to form adaptive decision frameworks. Finally, we’ll address the critical dimensions of safety, alignment, and regulatory oversight required to operationalize agentic AI responsibly in financial ecosystems. Participants will gain a systems-level understanding of how to engineer intent into AI, design autonomous yet trustworthy financial agents, and prepare for a future where decision-making is increasingly shared between humans and intelligent systems. --------------------------------------------------------------- By registering for this event, you agree that IEEE and the organizers are not liable to you for any loss, damage, injury, or any incidental, indirect, special, consequential, or economic loss or damage (including loss of opportunity, exemplary or punitive damages). The event will be recorded and will be made available for public viewing. Speaker(s): Dhivya Nagasubramanian Virtual: https://events.vtools.ieee.org/m/508173

Millimeter-wave (mmWave) power amplifiers (PAs) are critical building blocks in next-generation radar, satellite, defense, and 6G communication systems, where output power, bandwidth, and efficiency must be achieved under stringent size, weight, and power (SWaP) constraints. Among the enabling technologies, Gallium Arsenide (GaAs) and Gallium Nitride (GaN) continue to dominate due to their complementary strengths in linearity, noise performance, and high-power density. This talk will focus on design considerations unique to mmWave GaAs and GaN PAs, with particular emphasis on stability and biasing challenges at frequencies above 20 GHz. Unlike lower microwave designs, mmWave PAs are highly susceptible to low-frequency oscillations, odd-mode instabilities, and bias-induced resonances. To mitigate these, stability networks—ranging from RC shunt loading and resistive feedback to series loading and quarter-wave stabilization—must be co-optimized with matching and biasing schemes. Special attention will be given to the integration of stability networks with bias networks, where parasitics from bias chokes, decoupling capacitors, and high-impedance bias lines can introduce additional poles/zeros in the response, affecting both gain flatness and unconditional stability. The presentation will review practical approaches to stabilizing mmWave PAs without compromising efficiency or bandwidth, including the use of lossy transmission lines, broadband bias tees, and RC filtering strategies tailored for GaAs vs. GaN processes. Case studies will illustrate how bias network design impacts stability margins and overall PA performance, and how distributed versus lumped stabilization choices evolve with frequency. The session will conclude with a discussion of packaging and integration considerations, where bondwire inductances, via transitions, and LTCC/SiP bias routing play a defining role in amplifier stability at mmWave frequencies. Speaker(s): Asmita Dani, Room: 4021, Bldg: Sobrato Campus for Discovery and Innovation, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95054, Virtual: https://events.vtools.ieee.org/m/505939

[]This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses. Registration is now open. Visit our website for details, for our Advance Program, and to register. https://attend.ieee.org/repp. Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/495693

The power industry is under pressure to rapidly expand infrastructure to meet growing demands from both consumers and producers. But sticking to traditional design and construction methods may no longer be enough. One of the biggest bottlenecks? Hardware dependencies—like waiting on control wiring or specific components—that delay commissioning and inflate project timelines. This presentation explores how embracing IEC 61850, a globally recognized standard for power system communication and configuration, can unlock new efficiencies. By shifting more functionality into software and adopting a standardized, vendor-neutral approach, engineers can accelerate deployment, improve system quality, and simplify integration. We will demystify the IEC 61850 data model and show how it builds intuitive, scalable protection and control systems. You will learn how it reduces vendor lock-in, streamlines troubleshooting, and supports a more agile design process. Real-world case studies will highlight successful implementations, and we will share a practical roadmap to help you begin your journey toward a fully digitized power system. Speaker(s): Darren De Ronde, Agenda: No-host social at 5:30pm Presentation at 6:00pm Dinner at 7:00pm Presentation continues at 7:45pm Adjourn by 8:30pm Zio Fraedo’s, 611 Gregory Lane, Pleasant Hill, California, United States, 94523

[]Trends in consumer goods are leaning towards thinner, more compact products with higher performance than their predecessors. Today’s consumer wants lightweight, portable, battery-operated gear that is powerful enough to satisfy their needs for speed and ease of use. One of the biggest challenges facing product design is thermal management. Case temperature limits for products that come in contact with user’s skin place constraints on internal power dissipation and increase the need for improved thermal management. With the introduction of locally processed AI and higher compact portable device processing loads thermal issues are critical for avoiding throttling. µCooling: A new device has been invented that changes the way thermal engineers are approaching system cooling design. µCooling is a new concept in air movers. It is small, and thin and is a complete departure from rotating mass fans. This MEMS-based invention can move air through very small spaces, used directly on a chip or package, placed remotely through tiny ducts, or mounted outside of a product. In fact, the versatility of µCooling changes the way we can manage heat at the package, SoC, or bare-chip level. This talk will introduce µCooling, a MEMS-based, all-silicon, micro-sized air pump. The device will be described in terms of how it works, performance characteristics, and application examples. Speaker(s): Tom Tarter, Virtual: https://events.vtools.ieee.org/m/500418

Careers don’t always follow a straight line — and that’s a good thing! In this talk, I’ll share lessons learned from my own journey and from others who’ve navigated career twists, pauses, and pivots. You’ll hear practical strategies for building confidence, staying current, and navigating transitions at every career stage. We’ll look at how to recognize, build, and communicate your value, how to adapt to emerging technologies and new work cultures, and how to re-enter the workforce after time away. Whether you’re early in your career, returning after a pause, or seeking your next chapter, you’ll leave with practical strategies and encouragement to move forward with clarity and confidence. [] Parking info: (1) There are some 2-hour and some 4-hour parking spaces on Benton / Sherman and Franklin streets. (2) There are a number of 2-hour parking spaces next to Bank of America / Starbucks and they are usually not crowded on weeknights. You have to walk across El-Camino traffic light pedestrian crossing. If you get there at 6:20 PM you can park until 8:20PM. (3) Enter at the door of the Sobrato building colored in YELLOW. Speaker(s): , Jill Gostin Room: 1308, Bldg: SCDI, Santa Clara University, Santa Clara, California, United States, Virtual: https://events.vtools.ieee.org/m/513222

[]The rapid rise in power density and complexity of electronic systems has made thermal management a critical challenge for ensuring reliability, performance, and sustainability. Artificial Intelligence (AI) offers transformative opportunities to address this challenge by enabling data-driven modeling, optimization, and predictive control of cooling systems. By integrating AI with experimental and physics-based approaches, adaptive models can be developed to capture transient thermal behaviors, and optimize system-level energy efficiency. This forms the foundation for digital twins, virtual replicas that continuously interact with their physical counterparts to provide system specific real-time monitoring, and data driven decision support. In this talk, I will present recent and ongoing research activities at ES2 Binghamton on AI-enabled thermal management design, with emphasis on cooling solutions for high-power chips in data centers. I will further highlight how these developments serve as a pathway towards creating digital twins, dynamic virtual replicas that integrate real-time data, physics, and AI to enable system-level monitoring, prediction, and optimization. Together, these advancements pave the way for reliable, energy-efficient, and sustainable electronic systems. Speaker(s): Srikanth Rangarajan, Virtual: https://events.vtools.ieee.org/m/504510

[] Requirements on the high-performance compute (HPC) systems from AI workloads necessitates transition to larger package sizes with 2.5D to 3.5D integration and density scaling at every level in the stack. Several competing packaging architectures are emerging to solve the compute and power efficiency challenge presented by AI workloads. Each presents unique lithography challenges such as >100×100 field size, large chip placement deviations, fine lines and tight overlay warped substrates. The conventional lithography tools are incapable of meeting all the requirements to achieve scaling. The talk will preview Applied Materials’ Digital Lithography Technology (DLT) which enables highest resolution at production throughputs while ensuring CD uniformity and overlay accuracy across the entire panel. Speaker(s): Niranjan Khasgiwale, Virtual: https://events.vtools.ieee.org/m/502777