Virtual: https://events.vtools.ieee.org/m/551389

Th[]e transition to 3D heterogeneous integration has fundamentally changed the thermal characterization problem. Buried heat sources, anisotropic thin-film materials, through-silicon vias, and multilayer stacked structures require measurement techniques with sub-micron spatial resolution, depth sensitivity, and a temporal range — capabilities that infrared thermography and Raman spectroscopy cannot reliably deliver at this level of structural complexity. This session presents optical sampling thermoreflectance as a practical, commercially available solution, with real measurement data from a university lab and an industrial FA environment. Virtual: https://events.vtools.ieee.org/m/551389