Events

Large language models (LLMs) and Generative AI (GenAI) are at the forefront of frontier AI research and technology. With their rapidly increasing popularity and availability, challenges and concerns about their misuse and safety risks are becoming more prominent than ever. In this talk, we introduce a unified computational framework for evaluating and improving a wide range of safety challenges in generative AI. Specifically, we will show new tools and insights to explore and mitigate the safety and robustness risks associated with state-of-the-art LLMs and GenAI models, including (i) safety risks in fine-tuning LLMs, (ii) LLM red-teaming and jailbreak mitigation, (iii) prompt engineering for safety debugging, and (iv) robust detection of AI-generated content. Speaker(s): Pin-Yu Chen, Agenda: - 5:30 PM – 6:00 PM: Networking (Free pizza & drinks) - 6:00 PM – 7:30 PM: Presentation, Q&A Room: Bergin Hall Room 116, Bldg: SCDI, 500 El Camino Real, Santa Clara, California, United States, 95053

Join us to hear from Arun Anbumani, an IEEE Senior Member and Principal Engineer at Oracle Cloud Infrastructure! Arun specializes in large-scale cloud infrastructure, distributed systems, infrastructure provisioning, and platform reliability. We will spend time learning about Arun's real experience with hyperscalar infrastructure, and it's implication for the future, followed by Q&A and virtual networking. See you there! Speaker(s): Arun Agenda: 6:30 - 7:15 PM : Arun Introduction, General Presentation 7:15 - end : Q&A, virtual networking, etc. Virtual: https://events.vtools.ieee.org/m/579294

IEEE SCV WIE AI Summit 2026 [] In an era where AI technologies are rapidly transforming industries and redefining possibilities, it is crucial to explore both the innovations driving this change and the responsibilities that come with it. Today, we will delve into a diverse array of topics that highlight the multifaceted nature of AI and its profound impact on our lives. Our sessions will cover the latest developments in Large Language Models and Foundation Models, exploring efficient fine-tuning, multilingual adaptation, and the role of LLMs as knowledge bases. We will also examine the evolution of AI agents, focusing on autonomous task completion, multi-agent collaboration, and the integration of external knowledge for robust decision-making. In the realm of Vision and Multimodality, we will explore the integration of text, image, and video understanding, as well as advanced techniques like zero-shot learning and self-supervised learning. Our discussions on MLOps for LLMs will provide insights into best practices for training, deploying, and evaluating large models. We will also address the critical areas of Knowledge-Grounded Reasoning, On-Device Learning, and the ethical dimensions of AI, including bias mitigation, privacy preservation, and the detection of misinformation. Talk tracks are broadly classified but not limited to, 1. Large Language Models (LLMs) & Foundation Models 2. AI Agents 3. Sustainable Hardware for AI 4. Edge to Cloud Orchestration 5. Knowledge-Grounded & Reasoning 6. On-Device Learning for LLMs and Multi-Modal AI 7. Ethics, Bias & Fairness 8. Women Leading the AI Revolution Agenda: TBD Bldg: SC12, Intel, 3600 Juliette Ln, Santa Clara, CA 95054, US, Santa Clara, California, United States, 95054

Abstract: The Next-Gen Aerospace & Electromagnetics workshop brings together global experts to bridge the gap between pioneering aerospace achievements, cutting-edge planetary observation technologies, and modern engineering education. Designed for both industry professionals and students, this session explores the revolutionary mechanics behind the Mars Helicopter Ingenuity, innovations in large antenna technologies for tracking Earth's changing systems, and the shifting pedagogical paradigms required to prepare the next generation of electromagnetic engineers. Speaker(s): Nacer CHATAT, Richard E. HODGES, Prof. Levent SEVGİ Agenda: Lecture Program 18:30 – 19:00 | Lecture 2: “Exploring new frontiers: the Mars Helicopter Ingenuity's groundbreaking journey” Speaker: Dr. Nacer CHATAT (NASA - JPL, Caltech, USA) 19:00 – 19:30 | Lecture 4: “Large Antenna Technologies for Earth Science” Speaker: Dr. Richard E. HODGES (NASA - JPL, Pasadena, CA, USA) 19:30 – 20:00 | Lecture 3: “From Engineering Electromagnetics to Electromagnetic Engineering: Teaching, Training Next Generations” Speaker: Prof. Levent SEVGİ (Istanbul Technical University, Türkiye) Room: 4021, Bldg: Sobrato Campus for Discovery and Innovation, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95054, Virtual: https://events.vtools.ieee.org/m/578863

Our IEEE PES San Francisco / Oakland East Bay (SF/OEB) Chapter invites you to join our post IEEE PES Resiliency Summit Networking session (at the Hilton Union Square) and a delicious 5-course Moroccan dinner & show at Marrakech Restaurant right afterwards. (The restaurant will not be open to the public and registration will be required.) See https://ieee-pes.org/events/2026-ieee-power-energy-society-pes-resiliency-summit/ for more info and separate registration for the Summit. Our Networking, Dinner & Show will be co-hosted by our IEEE San Francisco Young Professionals (YP) & Women in Engineering (WiE) affinity groups. Additionally, this event is cosponsored by the IEEE PES Resiliency Summit, IEEE PES Region 6 YP, IEEE PES Women in Power (WiP) and IEEE San Francisco Section. All are welcome but registrations will be limited to seating capacity. Networking at Hilton Union Square 4-5pm Moderated Panel: PES Industry Leaders to share about their careers, challenges and excitement for the next generation of engineers. 5-6pm Speed Networking: PES Industry Leaders will move from tables of 6-8 attendees every 10 minutes. Move from Hilton Union Square a 1/2 block to Marrakech Restaurant 6:30-7:30pm Five Course Moroccan Dinner at Marrakech Restaurant with informal networking 7:30-10pm Georges Lammam Ensemble & Show with the premier Arabic band including violinist & singer Georges Lammam, keyboardist Khader Keileh, Susu Pampanin on tabla & Amina Goodyear on additional percussion. The show will also include two local SF bellydancers Jordone & Maya and open floor dancing! Important Note: You do not need to attend the Resiliency Summit to register and attend the Networking events 10/8 4-6pm at the Hilton and 6:30-10pm at Marrakech Restaurant. You can register and attend: 1) the Summit (separate IEEE PES registration at link above); 2) our 10/8 late afternoon/evening local networking event, or 3) both. We do require separate paid registrations through this vTools link for our networking event as our IEEE PES SF/OEB Chapter has booked the entire restaurant and entertainment. Our IEEE SF Section has kindly committed to supporting our networking event for 1/3 the costs, but we still need your support to cover our IEEE SF/OEB PES Chapter costs. Co-sponsored by: IEEE PES Resiliency Summit & Region 6 Young Professionals (YP) & Women in Power (WiP) San Francisco, California, United States

[]This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC (High Performance Computing), Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems. Speaker(s): Dan Kuchta, Virtual: https://events.vtools.ieee.org/m/568144

This is an online event. Pre-registration is required. Trusted adoption of an AI solution in an enterprise setting has many requirements. Large Language Models (LLMs) can often be constrained by the risks of hallucination bias and limited operational trust and reliability. Overcoming these challenges requires models whose output is fully grounded, auditable, and accurate. In addition, enterprise policy compliancy is critical in highly regulated sectors such as finance, healthcare, legal, insurance, government, and critical infrastructure. This presentation will discuss a solution framework with open-source models that can be systematically adapted using a combination of post-training optimization with advanced and agentic Retrieval-Augmented Generation (RAG) to create a production-ready enterprise LLM architecture. Advanced RAG is able to strengthen factual grounding through hybrid retrieval, metadata filtering, reranking, citation generation, and context optimization. Agentic RAG is able to extend this capability by enabling planner, retriever, verifier, and critic agents to decompose complex tasks, iteratively retrieve evidence, validate sufficiency, re-query when needed, and produce auditable answers suitable for enterprise production use. Speaker(s): Prasad Venkatachar, Virtual: https://events.vtools.ieee.org/m/577393

IEEE OEB-LMAG, 4Q26 Meeting Visit both the USS Hornet and CA Historical Radio Society Museum! This is one meeting you won’t want to miss! Wednesday, October 14, 2026 (11:50 AM to 2:30 PM PDT) The Oakland East Bay Life Members Affinity Group (OEB LMAG) is hosting an excursion to two historical locations in Alameda CA, including lunch – this is like winning the “daily double”! Our lunch meeting this quarter will be at the USS Hornet Museum, but those who want to spend more time there can come early (at 11:00 AM) for a free docent guided tour of the famous aircraft carrier that recovered the Apollo 11 Astronauts, and their Apollo Capsule, after the first landing of men on the moon, as well as Apollo 12 a few months later. The ship has 20+ restored vintage aircraft from WWII: Grumman FM-2 Wildcat, TBM-3E Avenger, Cold War & Vietnam Era: F-4J Phantom II, F8U-1 Crusader, F-14A Tomcat, F-11 Tiger (cockpit/nose), TA-4J Skyhawk, S-3B VikingHelicopters: SH-3H Sea King, HUP-1 Retriever, SH-2F Seasprite, UH-34D Seahorse, Modern Era: F/A-18C Hornet. After lunch, the excursion will continue with a visit to the birthplace of broadcasting: At the California Historical Radio Society Museum, we be given a tour of the museum that includes a collection that spans about 120 years of radio, wireless communication, and broadcasting history, including vacuum tubes, radios in unusual period casings (snakeskin, neon, even a whisky-bottle design), WWII-era transmitters, CIA com gear, a replica of Amelia Earhart's plane radio, a working telegraph, and vintage televisions (including the largest black-and-white TV ever made) playing classic programs. Please plan to drive, or car pool, to the USS Hornet, docked at Pier 3 in Alameda: USS Hornet - Sea, Air and Space Museum, 707 W Hornet Ave, Alameda, CA 94501 https://maps.app.goo.gl/2YRgoVeC5PcNyNN58 Please plan to arrive no later than 11:50, as lunch will be served at noon! After a leisurely 50 minute lunch, we will depart in the cars we arrived in, and drive to the California Historical Radio Society Museum, about 15 minutes away at: 2152 Central Ave, Alameda, CA 94501 https://maps.app.goo.gl/H15ydMEyjgFxTwUB7 Subsidized fee for OEB Life Members: $30 We also welcome Non-Members, so please bring your spouse or guest(s): $50 Agenda: USS Hornet Museum Tour: 11-Noon Lunch on Board: Noon-1 CHRS Drive and Tour: 1-3 Bldg: Visitor's Entrance, USS Hornet Museum, 707 W Hornet Ave, Alameda, California, United States, 94501

*****This vTools link is for purchase of Vendor Tables ONLY! No walk-in registrations.***** (Limit of 10 vendor tables so do not delay!) Vendor table will be one 6-foot exhibit table. Vendor table includes one (1) attendee ticket. A power strip will be available upon request. For more than one (1) attendee to support the table, please register additional people using the regular attendee link: https://events.vtools.ieee.org/m/562108 Tape, Tacks, Nails may not be applied to walls, ceilings, or doors and are strictly prohibited. Outside food, non-alcoholic and alcoholic beverage are not allowed. IEEE and the Hotel are not responsible for any loss or damage to property belonging to you. Sign-in for attendees and continental breakfast will open at 7:15AM, so please be completely set up by 7:15AM. Vendors are encouraged (voluntary) to bring up to three (3) giveaways to be included in the overall raffle for attendees. This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. The seminar will serve as a primer for engineers and a refresher for experienced engineers. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers. The registration cost includes continental breakfast, lunch, and refreshments. Please join us in attending this one-day Technical Seminar which will include an impressive list of speakers from IEEE, Eaton, Electrical Reliability Services (a Vertiv Company), ETAP, SEL, and NEMA. Seminar topics will include: - Overview of IEEE 1547-2018, Standard for Interconnection and Interoperability of distributed energy resources (DER) with Electric Power Systems - Electrical Design Fundamentals – Circuit Breaker Applications Understood - Medium Voltage Cable Installations - Cable Ampacity and Sizing Fundamentals Generator - Protective Relaying Fundamentals - NEMA Resources and the NEMA Standards Store Plan to attend this timely, educational Seminar. Registration is now open! Speaker(s): Chase Sun, Chris Lovin, Steve Park, Avelardo Morales , Angel Morales, Mike Stone Agenda: 8:00AM-4:30PM (sign-in opens at 7:15AM) *****Vendors should be set up and ready by 7:15AM.***** DoubleTree by Hilton Hotel Pleasanton at The Club, 7050 Johnson Drive, Pleasanton, California, United States, 94588

This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. The seminar will serve as a primer for engineers and a refresher for experienced engineers. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers. The registration cost includes continental breakfast, lunch, and refreshments. Please join us in attending this one-day Technical Seminar which will include an impressive list of speakers from IEEE, Eaton, Electrical Reliability Services (a Vertiv Company), ETAP, SEL, and NEMA. Seminar topics will include: - Overview of IEEE 1547-2018, Standard for Interconnection and Interoperability of distributed energy resources (DER) with Electric Power Systems - Electrical Design Fundamentals – Circuit Breaker Applications Understood - Medium Voltage Cable Installations - Cable Ampacity and Sizing Fundamentals Generator - Protective Relaying Fundamentals - NEMA Resources and the NEMA Standards Store Plan to attend this timely, educational Seminar. Registration is now open! For Group Registrations, please list all attendee email addresses under Special Requests. ***** Early-Bird registration closes on July 3, don’t delay!***** (Registration is limited to 100 attendees and must be completed on vTools. No walk-in registrations.) Speaker(s): Chase Sun, Chris Lovin, Steve Park, Avelardo Morales , Angel Morales, Mike Stone Agenda: 8:00AM-4:30PM (sign-in opens at 7:15AM) DoubleTree by Hilton Hotel Pleasanton at The Club, 7050 Johnson Drive, Pleasanton, California, United States, 94588

Materials Science for Quantum Computing Abstract: Quantum technologies have made remarkable advances in recent years, but moving from laboratory demonstrations to useful, large-scale systems remains a formidable engineering challenge. Whether the platform is based on superconducting circuits, semiconductor spins, atoms, ions, or photons, performance and scalability depend critically on materials quality, interfaces, defect control, process uniformity, and integration. Applied Materials is bringing decades of semiconductor manufacturing expertise to these challenges. Its quantum technology program is applying advanced materials engineering, 300-mm wafer processing, precision metrology, integrated photonics, and advanced packaging to improve quantum-device performance and enable larger, more manufacturable systems. Through applying materials engineering, advanced packaging, and next-generation optical materials including metasurfaces, to lower error rates, longer coherence times, and scaling. Applied is also exploring how its capabilities in photonics and materials engineering can support quantum sensing and communications. In this seminar, Dr. Robert Visser, who leads Applied Materials’ quantum technology activities, will discuss how technologies developed to manufacture billions of highly controlled classical devices may help overcome the materials, fabrication, and integration barriers now limiting practical quantum systems. Speaker: Robert J. Visser Vice President of Engineering Technology, Office of the CTO Applied Materials AGENDA: Thursday October 15, 2026 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar Please register on Eventbrite before 9:30 AM on Thursday October 15, 2026 $4 IEEE members $6 non IEEE members (discounts for unemployed and students ) Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road, EAG Labs, 810 Kifer Road, Sunnyvale, California, California, United States, 95051

TBD Power system models are essential for planning, analysis, and operational studies, but a model that reproduces a measured response is not necessarily a meaningful model. This presentation examines what makes a power system model meaningful in practice, drawing on extensive experience in model development, parameterization, validation, field testing, and application of generic and vendor-specific models. The presentation will discuss the role of models, the information they can reliably represent, and their inherent limitations. It will also consider how modeling objectives, available data, model structure, and parameter uncertainty affect the interpretation and use of simulation results. Examples from generation, inverter-based resources, and transmission systems will illustrate why meaningful modeling requires more than simply matching measurements. Co-sponsored by: University of California, Riverside Speaker(s): Dr. Pouyan Poubeik (IEEE Fellow), Virtual: https://events.vtools.ieee.org/m/579515

[]This no-cost workshop brings together five industry experts (plus an optional lab tour) to discuss the latest 2.5D/3D/3.5D semiconductor packaging solutions for HPC and AI. It highlights the growing challenges of fault isolation (FI) and failure analysis (FA) in dense interconnects such as hybrid bonding and micro bump arrays, reviews new thermal management options (metallic TIMs, low-temp solders), showcases advanced non-destructive inspection tools (computed laminography and high resolution CT), and introduces cutting edge microscopy techniques (SAM and PiFM) for defect characterization, while outlining emerging FI-FA workflows and tool roadmaps for reliable, scalable AI and data center hardware. Attendees will gain insight into current industry troubleshooting workflows and a forward-looking roadmap of the tools and techniques being developed to address advanced packaging failures. Additionally, the optional lab tour can help the attendees understand the tools and techniques discussed in the lectures. Four guided training talks with small-group interaction: 9:00: Advanced Packaging for AI – Challenges and Roadmaps in Fault Isolation and Failure Analysis 9:30: Metal TIM and Low-Temp Solder Paste for HPC and AI Industry Challenges 10:00: Failure Analysis of Electronic Components for AI and Data Center Infrastructure 10:30: High-Resolution 3D X-Ray Inspection for Advanced Packaging Integration 11:00: Scanning Acoustic Microscopy (SAM) and Photo-induced Force Microscopy (PiFM) for Defect Identification and Characterization in AI Hardware 11:30: lunch, social/networking, and optional lab tours Speaker(s): Yan Li, David Hu, Audrey Chamoire , Jeff Gelb, Austin Barnes Covalent Corp., 925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/575155