This is a hybrid in-person and online event. Pre-registration is required for either. The holy grail of medical diagnostics is a test that is accurate, sensitive, non-invasive, and inexpensive. For solid tumors such as pancreatic cancer and for many neurological diseases, current diagnostics come too little, too late. An exciting direction of research in this field relates to exosomes, tiny biological nanoparticles around 100 nm in size. There are trillions of them in our body, carrying a massive amount of valuable information about the health—or disorder—of our organs. They are, however, so small that they had eluded detection until quite recently. In this talk, Dr. Giacomo Vacca will discuss the challenges, and the promise, of exosomes in biomedical diagnostics. He will show how their abundance is a fantastic opportunity to use them as biomarkers—if you can detect them. As the attention of both technologists and researchers has focused on them, new tools have emerged, enabling new scientific findings—and the tantalizing possibility of much more powerful biomedical diagnostics. Speaker(s): Giacomo Vacca 925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/514921

[]The rapid rise in power density and complexity of electronic systems has made thermal management a critical challenge for ensuring reliability, performance, and sustainability. Artificial Intelligence (AI) offers transformative opportunities to address this challenge by enabling data-driven modeling, optimization, and predictive control of cooling systems. By integrating AI with experimental and physics-based approaches, adaptive models can be developed to capture transient thermal behaviors, and optimize system-level energy efficiency. This forms the foundation for digital twins, virtual replicas that continuously interact with their physical counterparts to provide system specific real-time monitoring, and data driven decision support. In this talk, I will present recent and ongoing research activities at ES2 Binghamton on AI-enabled thermal management design, with emphasis on cooling solutions for high-power chips in data centers. I will further highlight how these developments serve as a pathway towards creating digital twins, dynamic virtual replicas that integrate real-time data, physics, and AI to enable system-level monitoring, prediction, and optimization. Together, these advancements pave the way for reliable, energy-efficient, and sustainable electronic systems. Speaker(s): Srikanth Rangarajan, Virtual: https://events.vtools.ieee.org/m/504510

[] Requirements on the high-performance compute (HPC) systems from AI workloads necessitates transition to larger package sizes with 2.5D to 3.5D integration and density scaling at every level in the stack. Several competing packaging architectures are emerging to solve the compute and power efficiency challenge presented by AI workloads. Each presents unique lithography challenges such as >100×100 field size, large chip placement deviations, fine lines and tight overlay warped substrates. The conventional lithography tools are incapable of meeting all the requirements to achieve scaling. The talk will preview Applied Materials’ Digital Lithography Technology (DLT) which enables highest resolution at production throughputs while ensuring CD uniformity and overlay accuracy across the entire panel. Speaker(s): Niranjan Khasgiwale, Virtual: https://events.vtools.ieee.org/m/502777

[] Inferencing has become ubiquitous across cloud, regional, edge, and device environments, powering a wide spectrum of AI use cases spanning vision, language, and traditional machine learning applications. In recent years, Large Language Models (LLMs), initially developed for natural language tasks, have expanded to multimodal applications including vision speech, reasoning and planning each demanding distinct service-level objectives (SLOs). Achieving high-performance inferencing for such diverse workloads requires both model-level and system-level optimizations. This talk focuses on system-level optimization techniques that maximize token throughput , achieve user experience metrics and inference service-provider efficiency. We review several recent innovations including KV caching, Paged/Flash/Radix Attention, Speculative Decoding, P/D Disaggregation, KV Routing and Parallelism, and explain how these mechanisms enhance performance by reducing latency, memory footprint, and compute overhead. These techniques are implemented in leading open-source inference frameworks such as vLLM, SGLang, Hugging Face TGI, and NVIDIA’s TensorRT-llm, which form the backbone of large-scale public and private LLM serving platforms. Attendees will gain a practical understanding of the challenges in delivering scalable, low-latency LLM inference, and of the architectural and algorithmic innovations driving next-generation high-performance inference systems. Virtual: https://events.vtools.ieee.org/m/516797

Student Branch Event for members of the CSU East Bay Branch only. If you want to carpool to the venue, meet at Campus parking lot F at 9:00 am. Otherwise drive yourself to the CHM. Free only for student members at CSUEB. You must register to attend. Computer History Museum, 1401 N Shoreline Blvd., Mountain View, California, United States, 94043

The Product Safety Engineering Society Bay Area Joint Section Chapter (SCV/SF/OEB) invites you to a virtual meetup of professionals interested in product safety and compliance. We will discuss the future of the chapter and plan future events. Agenda: - Business Meeting - Plan future activity of the chapter - New Officer Elections Virtual: https://events.vtools.ieee.org/m/518446

[]Join us for this virtual meeting! This event brings together two focused talks that connect the architecture of AI in Blockchain/Web3 with practical career guidance for professionals entering this fast-growing space. The first talk explores how intelligent systems are designed, evaluated, and governed in blockchain and fintech environments. The second outlines the skills, roles, and pathways for building a successful AI career in the Blockchain ecosystem. Together, they provide a clear view of where the industry is heading and how to prepare for it. Speaker(s): Raj Karan Gunukula , Revanth Reddy Airre Virtual: https://events.vtools.ieee.org/m/520440

This is a hybrid in-person and online event. Pre-registration is required for either. The latter part of 20th century witnessed the rise of the compute utility made up of large-scale data centers housing densely-packed compute, storage and networking equipment. In the cyber age, data centers became modern day factories requiring megawatts of power for the information technology (IT) equipment, much like the process equipment in a factory of the machine age. Electrical energy supplied to the chips and systems in the data centers turned into multi-megawatts of heat energy which in turn required heat removal means. The active heat removal means also required power. While many innovative measures have been used for heat removal and energy management in data centers, there is a substantial gap in application of the fundamentals of engineering when compared to the approaches taken by the contributors of the 19th and early 20th century machine age. As an example, machine age contributors performed exergy (2nd law of thermodynamics) analysis and deemed it necessary to build a hydro-electric plant as part of the design of an Aluminum factory. Indeed, the majority of data centers today rely on the power infrastructure built by our predecessors. Given the inexorable trajectory of data centers strongly driven by AI, and associated demands on available energy, it is time we returned to such fundamentals, particularly given the environmental challenges. This talk will present a holistic approach that traces the energy flow from a power plant to a chip, and from the chip core to the cooling tower. Speaker(s): Chandrakant D. Patel, PE 925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/518438

Short-circuit current ratings (SCCR) and interrupting ratings form the backbone of electrical safety, coordination, and compliance in modern power systems. This presentation explores how UL 508A Supplement SB intersects with the National Electrical Code (NEC) to define the limits of what electrical equipment can safely withstand and interrupt under fault conditions. The presentation examines how UL product listings and component ratings interact with NEC Articles 409, 110.9, and 110.10, clarifying how available fault current, protective device selection, and equipment labeling all converge in practice. Real-world examples will illustrate how engineers can properly determine SCCR, verify interrupting ratings, and ensure that the overall system meets both code and product standard intent. Key Topics - Fundamentals of SCCR and interrupting ratings - Relationship between UL 508A Supplement SB and NEC Articles 409, 110.9, and 110.10 - Evaluating equipment for compliance and labeling accuracy - Case studies from industrial and institutional systems Speaker(s): Tyler Shewbert, Agenda: No-host social at 5:30pm Presentation at 6:00pm Dinner at 7:00pm Presentation continues at 7:45pm Adjourn by 8:30pm Zio Fraedo's, 611 Gregory Lane, Pleasant Hill, California, United States, 94523

[]Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas. Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design. We expect registrations for our on-site program to be filled by the end of December; we apologize if you are not able to attend in person, but we encourage you to join us via WebEx. SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/495346