Events
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We are excited to continue the Orange County Computer Society (OCCS) Global Emerging Technologies (GET) Series—a monthly platform dedicated to spotlighting transformative innovations in computer science and technology. Hosted by the IEEE Orange County Computer Society Chapter, this series brings together professionals, students, and tech enthusiasts to explore the cutting edge of what’s possible. Following a highly engaging March session filled with thought-provoking conversations on Advancement in Digital healthcare , we’re thrilled to bring you a powerful double-feature this April—exploring both the strategic and technical sides of artificial intelligence. Curious about Generative AI? This hands-on lab simplifies core concepts—from tokens and LLMs to RAG, Agents, and MCP—while showing how they work together in real systems. By the end, you’ll gain the skills and confidence to build your own AI-powered applications. Session 1: Understanding Generative AI — Core Principles and Industry Impact (40 mins) 1. What is GenAI Understand how AI generates content and why it’s transforming every industry. 2. Tokens & How LLMs Think Learn how text is broken into tokens and how that impacts cost, speed, and output. 3. Models & Ecosystem Explore key GenAI players and choose the right model for your use case. 4. Prompting (Vibe Programming) Master the art of guiding AI using structured, effective prompts. 5. RAG (Retrieval-Augmented Generation) Enhance AI accuracy by grounding responses in your own data. 6. Agents (Automation Layer) Move beyond chatbots to AI systems that can reason, plan, and take actions. 7. MCP (Tool Integration Layer) Enable AI to securely discover and interact with real-world tools and APIs. Session 2: GenAI in Action — From Prompt to Working Prototype (60 mins) 1. Hands-On Build Follow along in a live demo as we integrate concepts and build an AI-powered application in real time using Visual Studio Code and Python notebooks 2. Architecture & Best Practices Understand how all components fit together in a real-world AI system. 3. Next Steps The journey doesn’t end here—stay with us for what’s next. Gora Datta FHL7,SMIEEE,SMACM Chair IEEE Computer Society – OC Chapter Chair IEEE Engineering in Medicine and Biology Society (EMBS) - OC Chapter Chair & Board Member IEEE Blockchain Technical Community Founding Chair IEEE P3271.01 Working Group – Standard for Recurring Transactions Using Distributed Ledger Technologies (DLTs) 📧 gora.datta@ieee.org 🔗 LinkedIn: linkedin.com/in/goradatta Co-sponsored by: Gora Datta Speaker(s): Vinay, Pradyumna Kodgi Agenda: GenAI Unlocked: From Buzzwords to Breakthroughs Generative AI is no longer just a trend—it’s transforming how we create, innovate, and solve problems across industries. But what’s really behind all the excitement? In this interactive session, we’ll cut through the hype and help you truly understand Generative AI—without the jargon. 🔍 What you’ll explore: - What Generative AI actually is (in simple, practical terms) - How it works behind the scenes - Key concepts and terminology you’ll hear everywhere—explained clearly - Real-world use cases shaping industries today 💡 What makes this session different? This isn’t just theory. You’ll experience Generative AI in action through a live, interactive demo, where we’ll demo and explore real examples together. 🛠️ To keep the learning going, we’ll also share source code and hands-on resources so you can experiment, build, and deepen your understanding at your own pace. 🎯 Who should attend? - Beginners curious about AI - Professionals looking to understand GenAI fundamentals - Engineers, product managers, and innovators exploring AI adoption ✨ Walk away with: - A clear, confident understanding of Generative AI - The ability to engage in GenAI conversations without confusion - Practical exposure to how GenAI works in real scenarios Whether you're just getting started or looking to solidify your foundation, this session will kickstart your journey into the world of intelligent creation. 5270 California Ave , Irvine, California, United States, 92617, Virtual: https://events.vtools.ieee.org/m/553615
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Shalini Lakshmana is inviting you to a scheduled Zoom meeting. Topic: SCV WIE Mar ExCom Meeting Time: Mar 26, 2026 06:00 PM Pacific Time (US and Canada) Every month on the 26 of the month, 36 occurrence(s) Monthly: https://zoom.us/meeting/tJArfumopzkpHtaky1j5fYpqwMUeY7hSmBWs/ics?icsToken=DLAvxr8efHNhT92mFgAALAAAAICuIz08PSYY6dBYKGdyAmG9V8apUVN2a4qZ15xYs4WT3mV-sSkt5z2I4R9S5HnEoBhV7EWs81CyNNkybzAwMDAwMQ&meetingMasterEventId=GF3_gS3WTzuUZDIP3DGSlw Join Zoom Meeting https://zoom.us/j/94690092342?pwd=7PGwqJDSorXhy8TcYD9alL0bucCPEc.1 Meeting ID: 946 9009 2342 Passcode: 9yPaX9 Agenda: - New member introductions - Past Events - Upcoming Events - Other agenda items Virtual: https://events.vtools.ieee.org/m/555229 |
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Autonomous mobility is largely approached as a vehicle-centric problem. Persistent challenges in safety, scalability, and public trust suggest a deeper issue: “intelligence” is often considered in isolation rather than as distributed. This presentation argues that truly safe and trustworthy autonomy will emerge only through symbiotic computational systems, where perception, decision-making, and control are distributed across humans, machines, and infrastructure. The presentation starts with an overview of the four decades-long progress in autonomous driving and related advancements in driver assistance technologies. It is followed by a discussion of the central thesis: that many failures in autonomous mobility stem not from algorithms alone, but from how system boundaries are defined— what is sensed, where intelligence resides, and how responsibility is shared. Framing autonomy as a systems- level problem, the talk draws on principles of distributed and embodied cognition to unify perspectives from robotics, artificial intelligence, human–computer interaction, and transportation engineering. Concrete examples from multidisciplinary research by the CVRR and LISA teams at UC San Diego, conducted on real vehicles in real-world driving environments and validated through both quantitative benchmarks and qualitative studies in collaboration with industry partners, illustrate how shared autonomy can tightly couple human state (e.g., intent, attention, readiness) with environmental context to enable safer and more adaptive human–AI interaction. The lecture also discusses how advances in foundation models, self-supervised learning, and active learning can improve generalization and robustness in safety-critical settings. The talk concludes with key open challenges, including multimodal foundation models for traffic ecosystems, human–AI co-adaptation, and continual learning under domain shift, important problems to realize scalable, trustworthy autonomous mobility. Co-sponsored by: Vishnu S. Pendyala, San Jose State University Speaker(s): Professor Mohan Trivedi, Dr. Vishnu S Pendyala Room: MLK Room 225, Dr. Martin Luther King, Jr. Library (SJSU), 150 E San Fernando St San Jose, California 95112, San Jose, California, United States, Virtual: https://events.vtools.ieee.org/m/556950 |
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Key Considerations for Successful High-Speed Board Design Ujjwal Datt Sharma Abstract: Successful high-speed board design requires more than meeting electrical and functional requirements. Engineers must make balanced decisions that affect performance, reliability, manufacturability, cost, and schedule across the full product lifecycle. This talk provides a practical overview of the key considerations that should guide high-speed board design from concept through implementation. It emphasizes the value of thoughtful early decisions in reducing downstream problems during validation and bring-up. Attendees will gain a broader understanding of how disciplined design practices can improve hardware quality and support smoother product development. Speaker biography: Ujjwal Datt Sharma is a Hardware Engineer with 10 years of experience in high-speed system design, signal integrity, and AI hardware architecture. He specializes in motherboard design, FPGA-based systems, and data center switch platforms. He holds a Bachelor of Science in Electrical and Electronics Engineering from Manipal Institute of Technology, Karnataka (KA), India, and a Master of Science in Electrical and Computer Engineering from the University of New Haven, Connecticut (CT). His work focuses on developing reliable, high-performance hardware systems for next-generation computing and networking applications. Agenda: Networking: 5:30pm-6pm Talk: 6p-7pm Room: SCDI 1308 , Bldg: SCDI (Sobrato Campus for Discovery and Innovation), 500 El Camino Real, Santa Clara, California, United States, 95053 |
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[]This presentation provides a high-level description of CALCE-UMD activities in reliability physics of microelectronic systems, starting with a brief history and continuing on to recent trends in multiscale modeling of the reliability of advanced microelectronic packaging. The discussion includes specific focus on the importance of considering material microstructure in predictive reliability physics modeling; and explores the role of reliability physics in the context of AI/ML* approaches for reliability modeling. In Topic 1, we will examine three examples where microstructure-sensitive modeling can provide important insights into material behavior: (i) organic interposers/substrates that are based on fabric-reinforced composites; (ii) solder alloys with heterogeneous multiscale microstructure; (iii) sintered silver materials with agglomerated nanoporous microstructure. In Topic 2, we will qualitatively explore the interplay between reliability physics and AI/ML in influencing both epistemic as well as aleatory uncertainties in reliability predictions. *AI/ML: Artificial Intelligence / Machine Learning Speaker(s): Abhijit Dasgupta, Bldg: ARMS 3115, Purdue University, West Lafayette, Indiana, United States, Virtual: https://events.vtools.ieee.org/m/554090 |
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This talk covers research on miniaturized power supplies using high-voltage IC technologies from 110/230V mains or 400V DC sources to power low-voltage subsystems. It explores system and circuit solutions for chip-scale power supplies, enhancing miniaturization and decentralization of complex systems, applicable to sensor nodes, transmitters, receivers, and actuators with 3-10V supply voltages at or below 500mW. Highlighted are various miniaturized high-voltage converters, including active-clamp flyback and buck converters. An innovative voltage-interval-based constant-on-time control for buck converters supports 12.5-400 V input, achieving a power density of 752 mW/cm³ and 84% peak efficiency. A high-speed, low- power HV threshold-detection circuit significantly reduces sensing losses. The AC-DC converter features an active zero-crossing buffer, minimizing capacitance by 240x and enabling integration up to 50 mW with a power density of 458 mW/cm³ and 73.7% AC peak efficiency. Monolithic GaN integration supports designs like a 55W PFC converter and a 15W offline buck converter. A fully integrated GaN power stage operating at 500V and up to 6.25MHz will also be presented. Speaker(s): Bernhard Wicht Virtual: https://events.vtools.ieee.org/m/555593 |
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The IEEE Santa Clara Valley (SCV) Section invites you to an engaging and informative evening at Sensors Converge! This combined event brings together professionals at all career stages for a unique opportunity to learn, connect, and grow within IEEE. This session will focus on: - Senior Member Elevation: Learn about the benefits and eligibility requirements of becoming an IEEE Senior Member. Experienced volunteers will be available to guide prospective candidates through the application process and help connect you with potential references. - Fellow Elevation Insights: Gain an overview of the prestigious IEEE Fellow grade, including the nomination process, expectations, and pathways to recognition. - IEEE-HKN (Eta Kappa Nu): Discover the IEEE honor society, its mission, membership opportunities, and how it supports excellence in engineering and technology. - Young Professionals (YP) Networking Mixer: Wrap up the evening with a relaxed networking session designed to foster meaningful connections among students, young professionals, and seasoned engineers. Whether you are looking to advance your IEEE membership status, explore recognition opportunities, or simply expand your professional network, this event offers valuable insights and connections in an informal and welcoming environment. Attendees can use the code IEEESCV200 to register for Sensors Converge Please note that the Room for this event is Room 209 Location: Room 209, Santa Clara Convention Center (Sensors Converge) Date & Time: May 6, 2026 5:30 PM – 8:00 PM Who Should Attend: - IEEE members interested in Senior Member or Fellow elevation - Prospective and current IEEE-HKN members - Young Professionals and students - Anyone looking to network within the IEEE SCV community Join us to take the next step in your IEEE journey while building lasting professional connections. Room: 209, Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, California, United States, 95054-1119
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This talk explores how Edge AI deployed within connected vehicles is enabling practical safety and telematics use cases—such as real‑time crash detection, while complementing cloud intelligence. The discussion is framed at a high level, focusing on system‑level edge‑vs‑cloud tradeoffs (latency, resiliency, privacy, and cost). Speaker(s): Pushpak Agenda: 6:00-6:50pm Lecture 6:50-7:00pm Q&A Virtual: https://events.vtools.ieee.org/m/557134 |
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Process sensors measuring pressure, level, flow, temperature, etc. are assumed to be uncompromised, authenticated, and correct. They are the 100% trusted input for Operational Technology (OT) network monitoring as well as safety and predictive monitoring systems. Process sensor monitoring at the physics level can provide more accurate information for productivity and safety while at the same time providing an independent view of the OT network monitoring systems while not being subjected to ransomware or other IP network malware. There have been several recent programs that have monitored process sensors at the physics level that have demonstrated the efficacy of the approach and produced real, quantifiable benefits. Monitoring the process sensors can also help identify confirmed and potential cyber incidents with equipment such as pumps, compressors, valves, transformers, etc. IEEE conference pass IEEESCV200 at https://www.sensorsconverge.com/sensorsconvergecom/register Speaker(s): , Joe Weiss Room: Great America 1, Bldg: Santa Clara Convention Center, 5001 Great America Parkway, Santa Clara, California, United States, 95054
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[]Join us for an insightful webinar with Francesco Carobolante, founder of IoTissimo® LLC and an EPS Distinguished Lecturer, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office, Francesco will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. This session will analyze how signal BW and energy requirements dictate the options available for architecting the package structure, including Vertical Power Delivery, integrated voltage regulators and advanced thermal management techniques. Discover how these architectural shifts are enabling the next generation of data center performance. Speaker(s): Francesco Carobolante, Virtual: https://events.vtools.ieee.org/m/546237
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Networking expert Cesar Plata will lead us through a dynamic, interactive session where we will practice proven techniques to expand your professional reach. Key topics include: - The Law of Attraction & Marketing Yourself: Learn how to position yourself effectively. - Networking Etiquette: Master the art of starting and leaving conversations gracefully. - The Elevator Pitch: Refine and deliver your personal pitch with confidence. - Strategic Growth: Explore effective tradeshow tips and learn how to connect and leverage as a team. - Event Mastery: Gain insights on how to organize events and, most importantly, have fun while networking! Speaker(s): Cesar Plata, Room: 108, Bldg: Alameda Hall, Santa Clara University, Santa Clara, California, United States |
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IEEE Event Agenda - Tuesday May 12, 2026 🔹 5:00 PM – 5:30 PM Registration, Refreshments, Food & Networking (Meet & Greet) Featured Speakers & Sessions 🔹 5:30 PM – 6:15 PM Topic 1: Industry Talk – Standardizing Automotive Firmware for SDVs Experts from Mercedes-Benz, Arm, and Athos Silicon will discuss the urgent need for a standardized, secure, and vendor-agnostic firmware foundation. Key focus areas: - Overcoming fragmented firmware ecosystems - UEFI as a scalable automotive standard - Enabling functional safety, cybersecurity, and interoperability - Supporting chiplet-based and next-gen ADAS architectures Speakers: - François Piednoël – (https://www.linkedin.com/in/francoispiednoel/) - Sachin Athanikar – (https://www.linkedin.com/in/sachin-athanikar-18ba5914/) - Dong Wei (https://www.linkedin.com/in/dongweimba/) 🔹 6:15 PM – 6:45 PM Topic 2: Academic Keynote – Safe Embodied AI: From Theory to Deployment Prof. Ding Zhao (Carnegie Mellon University) Topics include: - Rare-event safety in autonomous systems - Safe reinforcement and imitation learning - Generalizable and adaptive AI safety - Future of trustworthy embodied AI at scale Speaker: - Ding Zhao – (https://www.linkedin.com/in/ding-zhao-01130730/) 🔹 6:45 PM – 7:15 PM Topic 3: Industry Talk – Static Safety Is Dead: Continuous Risk & Compliance for SDVs Akshay Chalana (CEO & Co-founder, Saphira AI) Modern vehicles evolve continuously through software updates, AI-driven functionality, and increasing connectivity—yet safety and cybersecurity practices remain largely static. This talk explores: - What breaks when traditional safety assumptions no longer hold - Real-world ADAS/autonomy failure propagation: dataset bias, requirement drift, and system boundary ambiguity - Cross-domain challenges between safety and cybersecurity - A new model for continuous, system-aware risk assessment and compliance - Treating compliance artifacts as live infrastructure integrated into development pipelines This session provides a practical path to maintaining certification-grade rigor while operating at software velocity. Speaker: - Akshay Chalana – (https://www.linkedin.com/in/akshaychalana/) 🔹 7:15 PM – 7:30 PM Q&A and open discussion - Aditi Ramadwar About This Technical Forum This technical forum brings together OEMs, Tier-1 suppliers, semiconductor leaders, researchers, and innovators to address the challenge of fragmentation and define a unified, future-ready mobility stack. Who Should Attend: - Automotive engineers and architects - Safety and cybersecurity specialists - Semiconductor and embedded systems professionals - Researchers in autonomous vehicles and AI safety - Technical decision-makers from OEMs and suppliers - Students in Automotive, Compute, Mechanical & Electrical Engineering We would be delighted if you could join us and participate in shaping the future of intelligent transportation. Speaker(s): Francois, Wei , Sachin, Zhao, Akshay In-Person at: SEMI Headquarters, 673 S Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/551666 |
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It may surprise you that the world’s first hospital‑wide medical information system MIS-I (pronounced "MIS One") was pioneered in Silicon Valley by defense contractor Lockheed Missiles and Space Company in partnership with El Camino Hospital. This accomplishment is being recognized with the dedication of an IEEE Milestone plaque at El Camino Hospital on Thursday, May 14th. From one hospital in 1974 to two hundred in the late1990s and still installed at a few installations as late as 2020, MIS-I proved what a true systems‑engineering approach could accomplish in healthcare. It let physicians and staff across all departments access patient data and enter work orders electronically, eliminating handwritten versions and thereby reducing costs, improving safety, and laying the foundation of modern medical informatics. MIS-I and its successive embodiments were treated the way Lockheed treated spacecraft: as an integrated system. Working side‑by‑side with the hospital’s clinical staff, teams designed and configured each system in a way no competitor matched then and perhaps even now. That collaboration led Lockheed to a number of inventions, including: - A systems architecture that enabled near instantaneous response using 1970s IBM mainframe computers. - The light-pen controlled Video Matrix Terminal, a practical solution to the user‑interface problems of the era when staff couldn’t type fast enough, and the mouse was not available as a tool. - Matrix Programming (also known as Matrix Coding), a language that allowed screens to be created for clinical use without reprogramming the system. [] (https://events.vtools.ieee.org/vtools_ui/media/display/4fcf27c6-0748-4ee1-b6e2-ba5072afd995) [] The program includes a slide show and a video on the history of MIS‑I at El Camino Hospital, along with an interview of Mel Hodge by Deb Muro, CIO of El Camino Health. Mel drove the development of MIS‑I at Lockheed and continued on as the leader of Technicon Medical Information Systems Company. Executives from El Camino Health, IEEE, and Lockheed Martin will speak about the Milestone and the role MIS‑I played in the evolution of hospital information systems. The event will conclude with the dedication of the Milestone plaque. Virtual Attendance Suggested URL will be provided to registered attendees prior to start of event Limited In-Person Seating Available Please select In-Person only if you truly plan to attend Allow ample time for parking. Limited valet parking available at the hospital main entrance. Co-sponsored by: Silicon Valley Technology History Committee Agenda: Virtual Attendees Start Time Virtual Event 4:00 PM Live stream starts, includes historic slide show 4:15 PM Live stream of Program begins 5:30 PM Virtual event ends In-Person Attendees Start Time Live Event 3:45 PM Arrival and Historic Photo Slideshow 4:15 PM Program begins 5:30 PM Reception with Refreshments 6:30 PM Event ends El Camino Hospital, 2500 Grant Road, Mountain View, California, United States, 94040, Virtual: https://events.vtools.ieee.org/m/554746
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Abstract: Active Magnetic Bearings (AMBs) are actuators that offer near-frictionless operation of spinning rotors. As is often the case with actuators used with feedback, magnetic bearings are driven with a high gain inner loop to linearize their input-output response for the stabilizing rotor position outer loop control development. The primary benefit of the high gain actuator is that the need for the outer loop to have an internal model of the magnetic bearings is mitigated. However, driving the magnetic bearings with high gain presents issues including increased noise, reduced stability margin, and sensitivity to rotor imbalance, motivating the inclusion of an internal model of the magnetic bearings. H_inf synthesis will be employed to demonstrate potential benefits of a low gain amplifier. And since magnetic bearings show temperature sensitivity, mu-synthesis will be leveraged to show that the benefits of a low gain amplifier can still be realized despite significant process noise and strict requirements. Models of AMB rotor systems will be shown to demonstrate their inherent issues and how a holistic control approach can solve them. Speaker(s): Jordan McCrone, Agenda: 6:00 - 6:30 - Networking and light dinner (for in person attendees) 6:30 - 7:30 - Talk and Q & A 7:30 - 8:00 - Wrap up and Networking Room: 116, Bldg: Bergin Hall, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/558058 |
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1 event,Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305 |
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2 events,[] (We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.) The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO). As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures. BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics. SEMI World Headquarters, Milpitas, California, United States [] (We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.) The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO). As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures. BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics. SEMI World Headquarters, Milpitas, California, United States |
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Speaker(s): Sudipto Chakraborty, Room: 4021, Bldg: Sobrato Campus for Discovery and Innovation, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95054, Virtual: https://events.vtools.ieee.org/m/557263 |
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Recent updates to NFPA 70B reflect the industry’s shift from periodic inspection toward continuous condition monitoring by permitting permanently installed thermal sensors to be used in lieu of traditional infrared (IR) thermographic inspections. This presentation will examine Continuous Thermal Monitoring (CTM) as a modern, code‑aligned approach for monitoring critical electrical assets, highlighting how permanently installed sensors provide 24/7 temperature visibility, early detection of abnormal heat rise, and actionable data for predictive maintenance—without requiring IR windows, panel opening, or personnel exposure to energized equipment. Speaker(s): Jonathan Fromm, Agenda: No-host social at 5:30pm Presentation at 6:00pm Dinner at 7:00pm Presentation continues at 7:45pm Adjourn by 8:30pm Zio Fraedo's, 611 Gregory Lane, Pleasant Hill, California, United States, 94523 |
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Abstract In high-volume manufacturing, failures in advanced electronic packaging are an unavoidable reality. Consequently, effective failure analysis is vital for enhancing product quality, reliability, and safety. This multidisciplinary task requires the integration of fundamental material science with technological expertise in manufacturing processes and product operation. As packages incorporate increasingly diverse materials and complex geometries, the interactions between components become more intricate. To address this, a systematic, data-driven approach is essential for identifying root causes. This lecture outlines strategies for postulating and verifying failures by linking material properties and characterization techniques to specific failure modes. The session concludes by addressing the industry's most pressing technical challenges. Outline - Foundations of Failure Analysis: Global perspectives, packaging challenges, and the "Octagonal Relationship" of engineering materials. - Mechanisms of Failure: Exploring electrical, thermal, mechanical, chemical, and optical properties in advanced packaging. - Strategic Problem Solving: Implementing the 3C Technique (Create, Challenge, and Confirm) to navigate modern analysis hurdles. Co-sponsored by: Benson Chan Speaker(s): KY Cheong, Agenda: See LOCATION tab for WebEx info Room: Symposium Hall, Bldg: Center of Excellence Building, Binghamton University, 85 Murray Hill Road, Vestal, New York, United States, 13850, Virtual: https://events.vtools.ieee.org/m/557425 |
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[] The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Expect deep thought leadership, executive talks and panels, and academic presentations. We're talking about long-term engineering trends and innovation. You won't find marketing narratives, token launches, or promotions. Note: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum Enterprise Alliance, EY, Starknet, among others. Co-sponsored by: Government of Ontario, Invest Hong Kong (Canada), Moody's Ratings, Compass360 Consulting and Tetra Digital Group Agenda: First wave of speaker announcement Room 1: Seminar Room - for the Thought Leaders On the wake of Bill C-15 and the rapid digitisation of Canada's financial system, Canadian innovation leaders will give us a glimpse of what's to come this year and next. 9 am – Registration 9:30 am - Welcome and introduction - Conference Chair Marc Lijour, Secretary of the IEEE Blockchain Technical Community 9:40 am - Opening Keynote by Alex McDougall, CEO of The FUTR Corporation: The Missing Layer: Why Agentic Commerce Needs a Consumer Data Protocol 10 am - Short Keynote by Sheereen Khan, Founder and CEO of Regulativity: An update on the Canadian regulatory landscape 10:10 am - Panel #1 - Stablecoins: A New Era of Payments in Canada - Felipe Priuli, Program Director for CAD Digital (CADD) - Kesem Frank, CEO of Canada Stablecorp (QCAD) - Kevin Zhang, Founder and CEO of LOON 11 am - Short Keynote by Hilary Carter, SVP Research at The Linux Foundation: What's the Role of Open Source for Canadian Sovereignty? 11:10 am - Panel #2 - Sovereignty by Design - Ali Abou Daya, CEO of Transactix Financial Inc. - Thomas You, Associate Partner at Maverix Private Equity - Gaëlle Martin-Cocher, IEEE Canada === LUNCH BREAK === 1 pm - Short Keynote by Christopher Chen, Head of InvestHK Canada: Opportunities within the Hong Kong Fintech/Web3 eco-system 1:10 pm - Panel #3 - How does Canada compete on the global stage? - Rajeev Bamra, Global Head of Strategy, Digital Economy at Moody's Ratings - Stuart Davis, President of Surpass Insights Inc. - Torstein Braaten, Chief Compliance at Stablecorp 2 pm - Panel #4 - Gaining Momentum from Innovation to Adoption - Nisrine, Innovation Lead at Interac - Eric Richmond, General Counsel & Head of Business Development at Shakepay - Adam Cai, CEO at Virgo Group == SNACK BREAK == 3:30 pm - Short Keynote by Eyal Sivan, Principal Consultant / Podcast Host at Mr. Open Banking: Open Banking and AI - A Perfect Match 3:40 pm - Panel #5 - The New Frontier of Trust in Agentic AI & Blockchain - Michelle Beyo, CEO of FINAVATOR - Carlos Andres Delgado, Fintech, AI & Banking Expert - Diana Oreto, Blockchain & Digital Assets Expert Room 2: Main Theatre - for The Engineers Building the next generation of payments and Agentic AI Anil Nadiminti - When AI Agents Pay: Building x402 Apps for Agentic AI on AWS James Holler - Compliance by Design: Why Blockchain Systems Must Integrate Regulatory Frameworks from Day One Ken Timsit - Agentic Commerce and Payments Lawrence Ley - Agentic AI & Blockchain: The Autonomous Future of Decentralized Intelligence Rayan Sekhraoui - Sovereign Infrastructure for Web3 — Why Decentralized Apps Need Independent Cloud Simon Kubbinga - Solana, Superteam, and Agentic Commerce Vikas Malhotra - Building safer environments with control, decentralization and distribution Academic Talks Federico Gatta - Deviations from Tradition: Stylized Facts in the Era of DeFi Ignacy Nieweglowski - PoliFi Tokens and the Trump Effect Dr. Jia Kan - Stop Building Faster Chains: Start Building Blockchain Operating Systems Dr. Marina Flat - AI Governance in Distributed Ecosystems: Accountability by Design Ngozi Nora Agwu - Beyond Hype: Governance Barriers to Blockchain-Enabled Infrastructure Revanth Reddy Airre - From Reasoning to Settlement: A Five-Layer Architecture for Agent Payments on the Decentralized Network Srisht Fateh Singh - Modeling Loss-Versus-Rebalancing in Automated Market Makers via Continuous-Installment Options Emerging Ventures Shashank Motepalli, Founder of Ekai Labs: Auditable Context Handoff in the Agent-to-Agent Economy Tity Lyngdoh, Founder of Dolphinze: From Global Workforce to Global Payment Rails: Rebuilding Contractor Payments Infrastructure Vedant Harlalka, CEO and Co-Founder of Auditorium AI: Building Early Stage Startups in Canada - Blockchain, Data and Crypto More speakers to be announced soon. Stay tuned! Many thanks to our sponsors: the Government of Ontario (sponsoring the location), as well as Invest Hong Kong (Canada), Moody's Ratings, Compass360 Consulting and Tetra Digital Group! Ontario Investment and Trade Centre, 250 Yonge Street, 35th Floor, Toronto, Ontario, Canada, M5B 2L7 |
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We are excited to continue the Orange County Computer Society (OCCS) Global Emerging Technologies and Artificial Intelligence (GET-AI) Series—a monthly platform focused on transformative innovations in computer science and technology. Hosted by the IEEE Orange County Computer Society Chapter, this series brings together professionals, students, and tech enthusiasts to explore the cutting edge of what’s possible. Following a highly engaging April session on Generative AI, where we explored LLMs, RAG, Agents, MCP, and hands-on AI application development, we are excited to bring you our May Tech Talk on “Security in AI.” --------------------------------------------------------------- 🔒 May Focus: Securing Generative AI As AI systems evolve—from traditional models to LLM-powered agents interacting with enterprise systems and real-world tools—they introduce powerful capabilities along with new security challenges, including: - Data leakage and prompt injection - Model misuse and unauthorized access - Risks in agent-driven automation - Governance and compliance concerns This session combines technical insights and practical demonstrations to explore how to build secure, trustworthy AI systems at scale. --------------------------------------------------------------- Session 1: Intelligent Attack Detection & Provenance (45 mins) Modern enterprises generate massive, fragmented logs, making it difficult to derive meaningful security insights. This session explores how AI enhances detection and forensic analysis: - Graph-Based Intrusion Detection Use unsupervised graph learning to uncover multi-step attacks in network activity - LLM-Powered Security Intelligence Convert low-level alerts into high-level, actionable insights for faster response 👉 Takeaway: Move from fragmented alerts to intelligent, end-to-end attack understanding --------------------------------------------------------------- Session 2: Securing AI Agents — MCP Threats & Defense (45 mins) As AI agents integrate with tools, APIs, and external systems, they introduce new attack surfaces. This session includes a live demo of how agents can be compromised—and secured: - Understanding MCP Architectures How agents invoke tools and why trust boundaries blur - Live Demo: Tool Poisoning & Agent Manipulation See how adversarial inputs can: - Manipulate agent behavior - Trigger unintended actions - Lead to data exfiltration - Layered Security Framework Practical defenses: - Tool authentication - Response sanitization - Schema validation - Context isolation - Real-Time Evaluation Prevent attacks without impacting performance 👉 Takeaway: Practical strategies to secure AI agents in enterprise environments --------------------------------------------------------------- About the Organizer Pradyumna Kodgi Principal Product Manager | Oracle Health & AI IEEE Senior Member | Vice Chair, IEEE EMBS – Orange County Member, IEEE AI Agentic Systems & AI Policy Committees 📍 California, USA 📧 pkodgi@ieee.org 🔗 linkedin.com/in/pkodgi Co-sponsored by: Pradyumna Kodgi Speaker(s): Zhou, Sreekanth Agenda: Securing AI: From Innovation to Resilience AI is rapidly transforming how we build intelligent systems—but as capabilities grow, so do security risks. From LLM-powered agents to tool-integrated architectures, the question is no longer just what AI can do—but how do we secure it? In this interactive session, we cut through the noise and break down AI security in practical, real-world terms—so you can understand not just the risks, but how to defend against them. --------------------------------------------------------------- 🔍 What You’ll Explore - How modern AI systems (LLMs, agents, MCP) introduce new attack surfaces - The shift from traditional security to AI-driven threat models - Key security concepts—explained clearly and practically - Real-world attack scenarios and emerging threat patterns --------------------------------------------------------------- 💡 What Makes This Session Different This isn’t just theory—you’ll see AI systems under attack and defense in action. Through a live, end-to-end demonstration, we’ll show how AI agents can be manipulated—and how layered security approaches can prevent these attacks in real time. --------------------------------------------------------------- 🛠️ Practical Takeaways You’ll walk away with actionable strategies and frameworks you can apply immediately, including: - Securing AI agents interacting with external tools - Validating and sanitizing untrusted inputs - Designing trust boundaries in AI-driven architectures --------------------------------------------------------------- 🎯 Who Should Attend - Security professionals and architects working with AI systems - Engineers and developers building AI/LLM-based applications - Product managers and leaders driving AI adoption - Anyone interested in understanding AI risks and defenses --------------------------------------------------------------- ✨ What You’ll Walk Away With - A clear understanding of emerging AI security risks - Practical knowledge of how to secure AI agents and systems - Real-world insights into attack prevention and defense strategies --------------------------------------------------------------- As AI systems become more autonomous and integrated into enterprise workflows, security becomes foundational—not optional. This session will equip you with the mindset and tools to build AI systems you can trust. 5270 California Ave , Irvine, California, United States, 92617, Virtual: https://events.vtools.ieee.org/m/557806 |
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